Abstract:
Disclosed is a thin film transistor. The thin film transistor includes a gate electrode which is disposed on the upper part of a substrate; a gate insulating film which is disposed to cover the gate electrode; a semiconductor channel which is disposed on the upper part of the gate insulating film; and source/drain electrodes which are in contact with both sides of the semiconductor channel and are spaced apart from each other.
Abstract:
박막트랜지스터가 개시된다. 박막트랜지스터는 기판 상부에 위치한 게이트 전극, 게이트 전극을 덮도록 위치하는 게이트 절연막, 게이트 절연막 상부에 위치하는 반도체 채널 및 반도체 채널의 양쪽에 각각 접하고 서로 이격된 소스/드레인 전극을 구비한다. 반도체 채널은 게이트 절연막 상부에 위치하고 상대적으로 높은 캐리어 농도를 갖는 제1 산화물 패턴 및 제1 산화물 패턴 상부에 위치하고 상대적으로 낮은 캐리어 농도를 갖는 제2 산화물 패턴을 구비할 수 있다.
Abstract:
The present invention relates to a thin film transistor comprising oxygen plasma treated channel layer and a method of manufacturing the same. According to the embodiment of the present invention, the thin film transistor includes a substrate; a source/drain electrode on the substrate; a channel layer made of a chalcogenides-based material on the substrate and the source/drain electrode; a dielectric layer; and a gate electrode. [Reference numerals] (S410) Step of providing a substrate; (S420) Step of forming a source/drain electrode on the substrate; (S430) Step of depositing a channel layer made of a chalcogenides-based material on the substrate and the source/drain electrode; (S440) Step of oxygen plasma treating the top of the channel layer; (S450) Step of depositing a dielectric layer on the top of the oxygen plasma treated channel layer; (S460) Step of forming a gate electrode on a dielectric