METHOD OF STRENGTHENING FLAT PANEL DISPLAY AND ASSOCIATED GETTERED DEVICE
    7.
    发明公开
    METHOD OF STRENGTHENING FLAT PANEL DISPLAY AND ASSOCIATED GETTERED DEVICE 失效
    VERFAHREN ZURVERSTÄRKUNGEINER FLACHANZEIGETAFEL UND DAZUGEHÖRIGEGETTERVORRICHTUNG

    公开(公告)号:EP0946960A4

    公开(公告)日:2000-11-15

    申请号:EP97952426

    申请日:1997-12-22

    Abstract: A flat-panel device is fabricated by a process in which a pair of plate structures (40 and 42) are sealed along their interior surfaces (40A and 42B) to opposite edges (44A and 44B) of an outer wall (44) to form a compartment. Subsequently, exterior support structure (64) is attached to the exterior surface of one of the plate structures (40) to significantly increase resistance of the compartment to bending. Exterior support structure (66) is normally likewise attached to the exterior surface of the other plate structure (42) after the sealing operation. The compartment is then typically pumped down to a high vacuum through a suitable pump-out port (46) and closed. By providing the exterior support structure at such a relatively late stage in the fabrication process, the need for using spacers to support the device against external forces is eliminated or substantially reduced while simultaneously avoiding severe fabrication difficulties that arise in attaching the exterior support structure before the sealing operation.

    Abstract translation: 平板装置是通过一对板结构(40和42)沿其内表面(40A和42B)密封到外壁(44)的相对边缘(44A和44B)的方法制成的,以形成 一个隔间 随后,外部支撑结构(64)附接到一个板结构(40)的外表面,以显着增加隔室对弯曲的阻力。 在密封操作之后,外部支撑结构(66)通常同样附接到另一个板结构(42)的外表面。 然后通常将隔室通过合适的抽出口(46)泵送到高真空并关闭。 通过在制造过程中的这种相对较晚的阶段提供外部支撑结构,消除或大大减少了使用间隔件来支撑装置的需要,同时避免了在外部支撑结构在 密封操作。

    USE OF SACRIFICIAL MASKING LAYER AND BACKSIDE EXPOSURE IN FORMING OPENINGS THAT TYPICALLY RECEIVE LIGHT-EMISSIVE MATERIAL, AND ASSOCIATED LIGHT-EMITTING STRUCTURE
    8.
    发明公开
    USE OF SACRIFICIAL MASKING LAYER AND BACKSIDE EXPOSURE IN FORMING OPENINGS THAT TYPICALLY RECEIVE LIGHT-EMISSIVE MATERIAL, AND ASSOCIATED LIGHT-EMITTING STRUCTURE 失效
    VERWENDUNG EINER OPFERMASKIERUNGSSCHICHT UNDRÜCKSEITIGERBELICHTUNG贝德埃尔斯通公司VONLÖCHERNZUR AUFNAHME VON LICHTEMITTIERENDEM材料,ZUGEHÖRIGELICHTEMITTIERENDE STRUKTUR

    公开(公告)号:EP0979525A4

    公开(公告)日:2000-09-27

    申请号:EP98918281

    申请日:1998-04-27

    CPC classification number: H01J29/085 H01J31/127

    Abstract: Openings are created in a structure by a process in which a plate is furnished with a sacrificial patterned masking layer divided into multiple laterally separated mask portions. A primary layer of actinic material is provided over the masking layer and in space between the mask portions. Material of the primary layer not shadowed by a mask formed with the mask portions is backside exposed to actinic radiation. Material of the primary layer not exposed to the radiation is removed. Segments of the masking layer not covered by exposed material of the primary layer are then removed. Consequently, openings extend through the primary layer where the segments of the masking layer have been removed. The process is typically employed in forming an optical device such as a flat-panel cathode-ray tube display in which the openings in the primary layer receive light-emissive material.

    Abstract translation: 通过其中板配备有被分成多个横向分离的掩模部分的牺牲图案化掩模层的工艺在结构中形成开口。 在掩模层上和掩模部分之间的空间中提供光化材料的主要层。 未被由掩模部分形成的掩模遮盖的主要层的材料背面暴露于光化辐射。 未暴露于辐射的主层材料被去除。 然后去除未被主层的暴露材料覆盖的掩蔽层的区段。 因此,开口延伸穿过掩模层的部分已被去除的主层。 该工艺通常用于形成诸如平板阴极射线管显示器的光学装置,其中主层中的开口接收发光材料。

    MULTI-LAYER RESISTOR FOR AN EMITTING DEVICE
    9.
    发明公开
    MULTI-LAYER RESISTOR FOR AN EMITTING DEVICE 失效
    多层阻力发射装置

    公开(公告)号:EP0993679A4

    公开(公告)日:2000-08-30

    申请号:EP98930256

    申请日:1998-06-19

    CPC classification number: H01J3/022 H01J2201/319 H01J2329/00

    Abstract: An electron-emitting device employs a multi-layer resistor (46). A lower layer (48) of the resistor overlies an emitter electrode (42). An electron-emissive element (54) overlies an upper layer (50) of the resistor. The two resistive layers are of different chemical composition. The upper resistive layer is typically formed with cermet. The lower resistive layer is typically formed with a silicon-carbon compound. In fabricating the device, the upper resistive layer normally serves as an etch stop for protecting the lower resistive layer and the emitter electrode during the etch of an overlying dielectric layer (52) to form an opening (56) in which the electron-emissive element is later provided.

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