公开(公告)号：EP1705968A2

公开(公告)日：2006-09-27

申请号：EP06075577.4

申请日：2006-03-10

Applicant: Delphi Technologies, Inc.

Inventor： Fairchild, Ray M. ,  Sarma, Dwasasi H. ,  Workman, Derek B. ,  Harshbarger, Daniel R.

IPC: H05K1/14 ,  H05K1/18

CPC classification number: H01L23/142 ,  H01L21/563 ,  H01L23/5385 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15311 ,  H01L2924/30107 ,  H05K1/0306 ,  H05K1/053 ,  H05K1/141 ,  H05K3/284 ,  H05K3/3436 ,  H05K2201/0212 ,  H05K2201/10977 ,  H01L2924/00 ,  H01L2224/0401

Abstract: An electronic assembly (100) includes a first substrate (102) and a second substrate (122). The first substrate (102) includes a first surface having a first plurality of conductive traces (106) formed on an electrically non-conductive layer (104). The second substrate (122) includes a first surface having a second plurality of conductive traces (126) formed thereon and a second surface having a third plurality of conductive traces (124) formed thereon. A first electronic component (132) is electrically coupled to one or more of the plurality of conductive traces (126) on the first surface of the second substrate (122). At least one of a plurality of conductive interconnects (108) is incorporated within each solder joint that electrically couples one or more of the conductive traces (124) formed on the second surface of the second substrate (122) to one or more of the conductive traces (106) formed on the first substrate (102).

Abstract translation: 电子组件（100）包括第一基板（102）和第二基板（122）。 第一衬底（102）包括具有形成在非导电层（104）上的第一多个导电迹线（106）的第一表面。 第二衬底（122）包括具有形成在其上的第二多个导电迹线（126）的第一表面和在其上形成有第三多个导电迹线（124）的第二表面。 第一电子部件（132）电耦合到第二基板（122）的第一表面上的多个导电迹线（126）中的一个或多个。 多个导电互连件（108）中的至少一个被并入每个焊接接头内，将形成在第二衬底（122）的第二表面上的一个或多个导电迹线（124）电耦合到一个或多个导电 形成在第一基板（102）上的迹线（106）。

公开(公告)号：EP1628515A1

公开(公告)日：2006-02-22

申请号：EP05076577.5

申请日：2005-07-11

Applicant: Delphi Technologies, Inc.

Inventor： Chang, Shih-chia ,  Berlin, Carl W. ,  Myers, Bruce A. ,  Fairchild, Ray M. ,  Peugh, Darrel E.

IPC: H05K7/20 ,  H05K1/02

CPC classification number: H05K7/20254 ,  H05K1/0206 ,  H05K1/0272 ,  H05K3/4611 ,  H05K2201/064

Abstract: The present invention provides a method for producing an electronic assembly and an electronic assembly (10, 100, 200, 300, 600) with an integrated cooling system for dissipating heat. The electronic assembly comprises a base (18, 218, 318, 618); and at least one electrical component (30, 230, 330, 630) attached to the base (18, 218, 318, 618). The base (18, 218, 318, 618) defines an integrated cooling system having a fluid channel (11, 211, 311, 611) spanning within the base (18, 218, 318, 618) and at least one heat exchanger (12, 13) in heat communication with the fluid channel (11, 211, 311, 611). The integrated cooling system may further include a pump (14) attached to the base (18, 218, 318, 618) for directing the flow of the fluid within the fluid channel (11, 211, 311, 611), and a port (16) in fluid communication with the fluid channel (11, 211, 311, 611) for receiving fluid from an external source.

Abstract translation: 本发明提供了一种用于制造电子组件和具有用于散热的集成冷却系统的电子组件（10,100,200,300,600）的方法。 电子组件包括基座（18,218,318,618）; 以及附接到基座（18,218,318,618）的至少一个电气部件（30,230,330,630）。 底座（18,218,318,618）限定了一个整体的冷却系统，该冷却系统具有横跨在基座（18,218,318,618）内的流体通道（11,211,311,611）和至少一个热交换器 ，13）与所述流体通道（11,211,311,611）热连通。 集成冷却系统还可以包括附接到基座（18,218,318,618）的泵（14），用于引导流体在流体通道（11,211,311,611）内的流动，以及一个端口 16）与流体通道（11,211,311,611）流体连通，用于从外部源接收流体。

公开(公告)号：EP1705968A3

公开(公告)日：2008-06-04

申请号：EP06075577.4

申请日：2006-03-10

Applicant: Delphi Technologies, Inc.

Inventor： Fairchild, Ray M. ,  Sarma, Dwasasi H. ,  Workman, Derek B. ,  Harshbarger, Daniel R.

IPC: H05K1/14 ,  H05K1/18 ,  H01L23/538

CPC classification number: H01L23/142 ,  H01L21/563 ,  H01L23/5385 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15311 ,  H01L2924/30107 ,  H05K1/0306 ,  H05K1/053 ,  H05K1/141 ,  H05K3/284 ,  H05K3/3436 ,  H05K2201/0212 ,  H05K2201/10977 ,  H01L2924/00 ,  H01L2224/0401

Abstract: An electronic assembly (100) includes a first substrate (102) and a second substrate (122). The first substrate (102) includes a first surface having a first plurality of conductive traces (106) formed on an electrically non-conductive layer (104). The second substrate (122) includes a first surface having a second plurality of conductive traces (126) formed thereon and a second surface having a third plurality of conductive traces (124) formed thereon. A first electronic component (132) is electrically coupled to one or more of the plurality of conductive traces (126) on the first surface of the second substrate (122). At least one of a plurality of conductive interconnects (108) is incorporated within each solder joint that electrically couples one or more of the conductive traces (124) formed on the second surface of the second substrate (122) to one or more of the conductive traces (106) formed on the first substrate (102).

公开(公告)号：EP1628515B1

公开(公告)日：2007-09-19

申请号：EP05076577.5

申请日：2005-07-11

Applicant: Delphi Technologies, Inc.

Inventor： Chang, Shih-chia ,  Berlin, Carl W. ,  Myers, Bruce A. ,  Fairchild, Ray M. ,  Peugh, Darrel E.

IPC: H05K7/20 ,  H05K1/02

CPC classification number: H05K7/20254 ,  H05K1/0206 ,  H05K1/0272 ,  H05K3/4611 ,  H05K2201/064

公开(公告)号：EP1589795A1

公开(公告)日：2005-10-26

申请号：EP05075795.4

申请日：2005-04-06

Applicant: Delphi Technologies, Inc.

Inventor： Sarma, Dwadasi H. ,  Heytens, Rhonda J. ,  Berlin, Carl W. ,  Fairchild, Ray M. ,  Myers, Bruce A. ,  Ward, Daniel K.

IPC: H05K1/03 ,  H05K1/02

CPC classification number: H01L23/15 ,  H01L23/3677 ,  H01L23/3731 ,  H01L23/3735 ,  H01L24/48 ,  H01L2224/32225 ,  H01L2224/4847 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/19107 ,  H05K1/0206 ,  H05K1/0306 ,  H05K3/0061 ,  H05K3/4629 ,  H05K3/4688 ,  H05K2201/0209 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A circuit board assembly (30) that makes use of a low-temperature co-fired ceramic (LTCC) substrate (10), and a process for producing the assembly (30). The substrate (10) contains at least first and second regions (32,34) formed by a plurality of first ceramic layers (36) and at least one second ceramic layer (38), respectively, that are superimposed and bonded to each other. Conductor lines (22) are present on at least some of the first ceramic layers (36) so as to be between adjacent pairs of the layers (36). Electrically-conductive vias (16) electrically interconnect the conductor lines (22) on different first ceramic layers (36), and a surface-mount IC device (12) is mounted to the substrate (10). The first ceramic layers (36) are formed of electrically-nonconductive materials, while the one or more second ceramic layers (38) contain thermally-conductive particles dispersed in a matrix of electrically-nonconductive materials, such that the one or more second ceramic layers (38) are more thermally conductive than the first ceramic layers (36).

Abstract translation: 使用低温共烧陶瓷（LTCC）基板（10）的电路板组件（30）和用于制造组件（30）的工艺。 衬底（10）至少包含由多个第一陶瓷层（36）和至少一个第二陶瓷层（38）形成的第一和第二区域（32,34），它们彼此叠加并结合。 导体线（22）存在于至少一些第一陶瓷层（36）上，以便在相邻的层（36）之间。 导电通孔（16）将不同第一陶瓷层（36）上的导体线（22）电互连，并且表面安装IC器件（12）安装到基板（10）。 第一陶瓷层（36）由非导电材料形成，而一个或多个第二陶瓷层（38）包含分散在非导电材料的基体中的导热颗粒，使得一个或多个第二陶瓷层 （38）比第一陶瓷层（36）更加导热。