公开(公告)号：EP2008216A4

公开(公告)日：2009-12-23

申请号：EP07870421

申请日：2007-01-23

Applicant: IBM

Inventor： GAUCHER BRIAN P ,  GRYZB JANUSZ ,  LIU DUIXIAN ,  PFEIFFER ULLRICH R ,  ZWICK THOMAS M

IPC: H03H5/00 ,  H01P3/00 ,  H01P3/02 ,  H01P5/10

CPC classification number: H01P5/107 ,  H01P3/003 ,  H01P3/026

公开(公告)号：WO2008003581A2

公开(公告)日：2008-01-10

申请号：PCT/EP2007056051

申请日：2007-06-19

Applicant: IBM ,  IBM UK ,  LIU DUIXIAN ,  HILDNER THOMAS ,  GAUCHER BRIAN PAUL

Inventor： LIU DUIXIAN ,  HILDNER THOMAS ,  GAUCHER BRIAN PAUL

CPC classification number: H01Q9/40 ,  H01Q1/2266 ,  H01Q1/38 ,  H01Q9/28 ,  H01Q9/285

Abstract: Low-profile, compact embedded multi-mode antenna designs are provided for use with computing devices, such as laptop computers, which enable ease of integration within computing devices with limited space, while providing suitable antenna characteristics (e.g., impedance matching and radiation efficiency) over an operating bandwidth of about.8 GHz to about 11 GHz.

Abstract translation: 提供小型，紧凑型嵌入式多模式天线设计，用于与诸如膝上型计算机之类的计算设备一起使用，其允许在具有有限空间的计算设备中方便地集成，同时提供合适的天线特性（例如阻抗匹配和辐射效率） 在约8GHz至约11GHz的工作带宽上。

公开(公告)号：JP2002084117A

公开(公告)日：2002-03-22

申请号：JP2001188413

申请日：2001-06-21

Applicant: IBM

Inventor： ASANO TAKESHI ,  FLINT EPHRAIM B ,  FUJII KAZUO ,  GAUCHER BRIAN P ,  LIU DUIXIAN ,  OIE MASAKI ,  STUDWELL THOMAS W ,  USUI HIDEYUKI

IPC: G06F1/16 ,  G09F9/00 ,  H01Q1/22 ,  H01Q9/04 ,  H01Q13/10 ,  H01Q21/28 ,  H01Q21/29

Abstract: PROBLEM TO BE SOLVED: To provide a display, a computer terminal and an antenna which enables an antenna to be installed without enlarging its frame or downsizing a display panel, and can receive radio waves sufficiently well, if the frame is made of a conductive material. SOLUTION: A notebook type computer terminal has a thin sheet-like slot antenna 20, installed in a gap between a display panel 13 and a sidewall 16 of a display panel frame 14, with its a transmitter-receiver 20a being projected over a prescribed length from a conductive material-made casing 13A of the display panel 13 and a stay 21. The antenna 20 has a ground part 20b connected to the ground of a radio wave-signal converter circuit and also to the conductive material-made frame 14 via the stay 21.

公开(公告)号：EP2274733A4

公开(公告)日：2014-06-11

申请号：EP08873919

申请日：2008-12-30

Applicant: IBM

Inventor： AKKERMANS JOHANNES A G ,  FLOYD BRIAN A ,  LIU DUIXIAN

IPC: G08B13/14 ,  H01Q1/22 ,  H01Q9/04 ,  H01Q21/06 ,  H01Q23/00

CPC classification number: H01Q21/065 ,  G06K19/07749 ,  G06K19/07786 ,  H01L23/3121 ,  H01L23/66 ,  H01L2223/6677 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/15323 ,  H01Q1/2283 ,  H01Q1/38 ,  H01Q9/0457 ,  H01Q21/061 ,  H01Q23/00 ,  Y10T29/49016

公开(公告)号：EP2253045A4

公开(公告)日：2011-03-23

申请号：EP08872709

申请日：2008-12-30

Applicant: IBM

Inventor： FLOYD BRIAN ,  LIU DUIXIAN

IPC: H01Q1/38 ,  H01Q9/04

CPC classification number: H01Q23/00 ,  H01L23/66 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2924/09701 ,  H01Q1/2283 ,  H01Q1/38 ,  H01Q9/0457

公开(公告)号：EP1886412A4

公开(公告)日：2009-07-08

申请号：EP06760686

申请日：2006-06-05

Applicant: IBM

Inventor： CHEN ZHI NING ,  LIU DUIXIAN ,  PFEIFFER ULLRICH R ,  ZWICK THOMAS M

IPC: H04B1/28 ,  H01Q1/22

CPC classification number: H01Q1/22 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01Q1/2283 ,  H01L2924/00

Abstract: Apparatus and methods are provided for integrally packaging semiconductor IC (integrated circuit) chips and antenna devices which are integrally constructed from package frame structures (e.g., lead frame, package carrier, package core, etc.), to thereby form compact integrated radio/wireless communications systems for millimeter wave applications. For example, an electronic apparatus (30) includes a package frame (11) having an antenna (12) that is integrally formed as part of the package frame (11), an IC (integrated circuit) chip (13) mounted to the package frame (11), interconnects (19) that provide electrical connections to the IC chip (13) and the antenna (12), and a package cover (15).

公开(公告)号：JP2005176366A

公开(公告)日：2005-06-30

申请号：JP2004353546

申请日：2004-12-07

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： GAUCHER BRIAN P ,  LIU DUIXIAN ,  RUDOLF PFEIFFER ULLRICH R ,  ZWICK THOMAS M

IPC: H01L21/822 ,  H01L27/04 ,  H01P11/00 ,  H01Q1/00 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q9/04 ,  H01Q9/28 ,  H01Q9/30 ,  H01Q9/40 ,  H01Q13/08 ,  H01Q23/00

CPC classification number: H01Q9/0407 ,  H01L23/66 ,  H01L24/73 ,  H01L2223/6677 ,  H01L2224/48091 ,  H01L2224/73207 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/3011 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q9/28 ,  H01Q9/40 ,  H01Q23/00 ,  Y10T29/49016 ,  Y10T29/49018 ,  H01L2924/00014 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide an antenna which is constituted by using one or a plurality of conductive via stubs formed as radiating elements in a substrate. SOLUTION: A method which constitutes the antenna contains a step for preparing the substrate having a first and a second surfaces which are almost parallel to each other, and a step wherein via holes are formed between the first and the second surfaces penetrating the substrate and filled with a conductive material, the conductive via stubs are formed and the radiating elements are formed in the substrate. The antenna and an IC chip (e.g. a transceiver of an IC type, a receiver, a transmitter, etc.) are collectively packaged, and an integrally formed communication system for radio or RF (high frequency) can be formed. COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种天线，其通过使用在基板中形成为辐射元件的一个或多个导电通孔短路而构成。 解决方案：构成天线的方法包括用于制备具有彼此大致平行的第一和第二表面的基板的步骤，以及在穿过第一和第二表面之间形成通孔的步骤 衬底并且填充有导电材料，形成导电通路短截线，并且辐射元件形成在衬底中。 天线和IC芯片（例如，IC型收发器，接收器，发射器等）被集体封装，并且可以形成用于无线电或RF（高频）的整体形成的通信系统。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：WO2007089341A3

公开(公告)日：2008-04-17

申请号：PCT/US2006048020

申请日：2006-12-18

Applicant: IBM ,  GAUCHER BRIAN P ,  LIU DUIXIAN ,  PFEIFFER ULLRICH R ,  ZWICK THOMAS M

Inventor： GAUCHER BRIAN P ,  LIU DUIXIAN ,  PFEIFFER ULLRICH R ,  ZWICK THOMAS M

IPC: H01L23/48

CPC classification number: H01Q9/16 ,  H01L23/49555 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6677 ,  H01L2224/05554 ,  H01L2224/451 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/3011 ,  H01Q23/00 ,  Y10T29/49018 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Apparatus and methods are provided for integrally packaging semiconductor IC (integrated circuit) chips with antennas having one or more radiating elements and tuning elements that are formed from package lead wires that are appropriated shaped and arranged to form antenna structures for millimeter wave applications. In one aspect, an electronic apparatus (20) includes an IC chip (22) and an antenna system (23), wherein the IC chip (22) and antenna system (23) are integrally packaged together in a leaded chip-scale package (21) and wherein the antenna system (23) includes an antenna having a radiating element that is formed from a package lead wire.

Abstract translation: 提供了用于将半导体IC（集成电路）芯片与具有一个或多个辐射元件和调谐元件整体封装的装置和方法，所述辐射元件和调谐元件由适于成形并布置成形成毫米波应用的天线结构的封装引线形成。 一方面，一种电子设备（20）包括IC芯片（22）和天线系统（23），其中IC芯片（22）和天线系统（23）一体地封装在一起，包括在引线芯片级封装 21），并且其中天线系统（23）包括具有由封装引线形成的辐射元件的天线。

公开(公告)号：WO2008062311A3

公开(公告)日：2009-04-23

申请号：PCT/IB2007004244

申请日：2007-01-23

Applicant: IBM ,  GAUCHER BRIAN P ,  GRYZB JANUSZ ,  LIU DUIXIAN ,  PFEIFFER ULLRICH R ,  ZWICK THOMAS M

Inventor： GAUCHER BRIAN P ,  GRYZB JANUSZ ,  LIU DUIXIAN ,  PFEIFFER ULLRICH R ,  ZWICK THOMAS M

IPC: H03H5/00

CPC classification number: H01P5/107 ,  H01P3/003 ,  H01P3/026

Abstract: Waveguide-to-transmission line transitions are provided for broadband, high performance coupling of power at microwave and millimeter wave frequencies. In one aspect, a transition apparatus (10) includes a transition housing (11) comprising a rectangular waveguide channel (C) and an aperture (13) formed through a broad wall (11a) of the rectangular waveguide channel (C), a substrate ( 12) having a first surface and a second surface opposite the first surface, mid a planar transmission line (12a) and a planar probe (12b) formed on the first surface, wherein the planar transmission line (12a) comprises a first conductive strip and a second conductive strip, wherein the planar probe (12b) is connected to, and extends from, an end of the first conductive strip, and wherein an end of the second conductive strip is terminated by a stub and wherein the substrate (22) is positioned in the aperture (13) such that the printed probe (12b) protrudes into the rectangular waveguide channel (C) at an offset from a center of the broad wall (11a) and wherein the ends of the first and second conductive strip are aligned to an inner surface of the broad wail (11a) of the rectangular waveguide channel (C).

Abstract translation: 提供波导到传输线路转换用于宽带，高性能的微波和毫米波频率耦合。 一方面，一种过渡装置（10）包括：过渡壳体（11），包括矩形波导通道（C）和通过矩形波导通道（C）的宽壁（11a）形成的孔（13），基底 （12）具有第一表面和与第一表面相对的第二表面，在平面传输线（12a）的中间和形成在第一表面上的平面探针（12b），其中平面传输线（12a）包括第一导电条 和第二导电条，其中所述平面探针（12b）连接到所述第一导电条的端部并从所述第一导电条的端部延伸，并且其中所述第二导电条的端部由短截线终止，并且其中所述基底（22） 被定位在所述孔（13）中，使得所述印刷探针（12b）从所述宽壁（11a）的中心偏移地突出到所述矩形波导通道（C）中，并且其中所述第一和第二导电条的端部 与广泛的内表面对齐 矩形波导通道（C）的壁（11a）。

公开(公告)号：WO2006133108A3

公开(公告)日：2007-11-29

申请号：PCT/US2006021770

申请日：2006-06-05

Applicant: IBM ,  CHEN ZHI NING ,  LIU DUIXIAN ,  PFEIFFER ULLRICH R ,  ZWICK THOMAS M

Inventor： CHEN ZHI NING ,  LIU DUIXIAN ,  PFEIFFER ULLRICH R ,  ZWICK THOMAS M

IPC: H04B1/28

CPC classification number: H01Q1/22 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01Q1/2283 ,  H01L2924/00

Abstract: Apparatus and methods are provided for integrally packaging semiconductor IC (integrated circuit) chips and antenna devices which are integrally constructed from package frame structures (e.g., lead frame, package carrier, package core, etc.), to thereby form compact integrated radio/wireless communications systems for millimeter wave applications. For example, an electronic apparatus (30) includes a package frame (11) having an antenna (12) that is integrally formed as part of the package frame (11), an IC (integrated circuit) chip (13) mounted to the package frame (11), interconnects (19) that provide electrical connections to the IC chip (13) and the antenna (12), and a package cover (15).

Abstract translation: 提供了用于整体封装由封装框架结构（例如，引线框架，封装载体，封装芯等）整体构建的半导体IC（集成电路）芯片和天线装置的集成封装，从而形成紧凑的集成无线电/无线 通信系统用于毫米波应用。 例如，电子设备（30）包括具有整体形成为封装框架（11）的一部分的天线（12）的封装框架（11），安装在封装框架（11）上的IC（集成电路）芯片 框架（11），提供到IC芯片（13）和天线（12）的电连接的互连（19）和封装盖（15）。