Coupling structure and method of forming such

    公开(公告)号:GB2485749B

    公开(公告)日:2012-10-03

    申请号:GB201205373

    申请日:2010-12-03

    Applicant: IBM

    Abstract: A coupling structure for coupling piezoelectric material generated stresses to an actuated device of an integrated circuit includes a rigid stiffener structure formed around a piezoelectric (PE) material and the actuated device, the actuated device comprising a piezoresistive (PR) material that has an electrical resistance dependent upon an applied pressure thereto; and a soft buffer structure formed around the PE material and PR material, the buffer structure disposed between the PE and PR materials and the stiffener structure, wherein the stiffener structure clamps both the PE and PR materials to a substrate over which the PE and PR materials are formed, and wherein the soft buffer structure permits the PE material freedom to move relative to the PR material, thereby coupling stress generated by an applied voltage to the PE material to the PR material so as change the electrical resistance of the PR material.

    Memristives Bauelement auf Grundlage eines reversiblen Transfers interkalierter Ionen zwischen zwei metastabilen Phasen

    公开(公告)号:DE112018003217T5

    公开(公告)日:2020-03-19

    申请号:DE112018003217

    申请日:2018-06-14

    Applicant: IBM

    Abstract: Bereitgestellt werden memristive Bauelemente auf Grundlage eines lonentransfers zwischen zwei metastabilen Phasen in einem Material mit interkalierten Ionen. Nach einem Aspekt wird ein memristives Bauelement bereitgestellt. Das memristive Bauelement beinhaltet: einen ersten Inertmetallkontakt; eine Schicht eines phasengetrennten Materials, das auf dem ersten Inertmetallkontakt angeordnet ist, wobei das phasengetrennte Material interstitielle Ionen beinhaltet; und einen zweiten Inertmetallkontakt, der auf der Schicht des phasengetrennten Materials angeordnet ist. Die erste Phase des phasengetrennten Materials kann eine andere Konzentration der interstitiellen Ionen als die zweite Phase des phasengetrennten Materials aufweisen, so dass die erste Phase des phasengetrennten Materials eine andere elektrische Leitfähigkeit als die zweite Phase des phasengetrennten Materials aufweist. Ein Verfahren zum Betreiben des vorliegenden memristiven Bauelements wird ebenfalls bereitgestellt.

    Coupling structure and method of forming such

    公开(公告)号:GB2485749A8

    公开(公告)日:2012-09-12

    申请号:GB201205373

    申请日:2010-12-03

    Applicant: IBM

    Abstract: A coupling structure for coupling piezoelectric material generated stresses to an actuated device of an integrated circuit includes a rigid stiffener structure formed around a piezoelectric (PE) material and the actuated device, the actuated device comprising a piezoresistive (PR) material that has an electrical resistance dependent upon an applied pressure thereto; and a soft buffer structure formed around the PE material and PR material, the buffer structure disposed between the PE and PR materials and the stiffener structure, wherein the stiffener structure clamps both the PE and PR materials to a substrate over which the PE and PR materials are formed, and wherein the soft buffer structure permits the PE material freedom to move relative to the PR material, thereby coupling stress generated by an applied voltage to the PE material to the PR material so as change the electrical resistance of the PR material.

    Coupling structure and method of forming such

    公开(公告)号:GB2485749A

    公开(公告)日:2012-05-23

    申请号:GB201205373

    申请日:2010-12-03

    Applicant: IBM

    Abstract: A coupling structure for coupling piezoelectric material generated stresses to an actuated device of an integrated circuit includes a rigid stiff ener structure formed around a piezoelectric (PE) material and the actuated device, the actuated device comprising a piezoresistive (PR) material that has an electrical resistance dependent upon an applied pressure thereto; and a soft buffer structure formed around the PE material and PR material, the buffer structure disposed between the PE and PR materials and the stiffener structure, wherein the stiffener structure clamps both the PE and PR materials to a substrate over which the PE and PR materials are formed, and wherein the soft buffer structure permits the PE material freedom to move relative to the PR material, thereby coupling stress generated by an applied voltage to the PE material to the PR material so as change the electrical resistance of the PR material.

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