公开(公告)号：EP1719181A4

公开(公告)日：2010-08-25

申请号：EP04702191

申请日：2004-01-14

Applicant: IBM

Inventor： ANGYAL MATTHEW ,  HICHRI HABIB ,  LEE JIA ,  MCHERRON DALE ,  NYE HENRY A III

IPC: H01L29/00 ,  C23C16/40 ,  C23C16/455 ,  H01L21/316

CPC classification number: H01L21/31633 ,  C23C16/401 ,  C23C16/45523 ,  H01L21/02126 ,  H01L21/02164 ,  H01L21/022 ,  H01L21/02211 ,  H01L21/02216 ,  H01L21/02274

公开(公告)号：CA2368950A1

公开(公告)日：2000-11-30

申请号：CA2368950

申请日：2000-05-15

Applicant: IBM

Inventor： MCGAHAY VINCENT ,  NYE HENRY A III ,  OTTEY BRIAN G R ,  EDELSTEIN DANIEL C ,  PRICE WILLIAM H

IPC: H01L23/52 ,  H01L21/3205 ,  H01L21/60 ,  H01L23/485 ,  H01L23/532

Abstract: A structure comprising a layer of copper (1), a barrier layer (10), a layer of AlCu (9), and a pad-limiting layer (7), wherein the layer of AlCu and barrie r layer are interposed between the layer of copper and pad-limiting layer.

公开(公告)号：MY119966A

公开(公告)日：2005-08-30

申请号：MYPI20010319

申请日：2001-01-23

Applicant: IBM

Inventor： NYE HENRY A III ,  MCGAHAY VINCENT J ,  TALLMAN KURT A

IPC: H01L21/4763 ,  H01L21/3205 ,  H01L23/52 ,  H01L21/768 ,  H01L21/77 ,  H01L23/00 ,  H01L23/58

Abstract: A COPPER-INTERCONNECT (126, 136, 146), LOW-K DIELECTRIC (10) INTEGRATED CIRCUIT HAS REDUCED CORROSION OF THE INTERCONNECT WHEN THE CRACKSTOP (2) NEXT TO THE KERF IS ALSO USED AS THE PRIMACY BARRIER TO OXYGEN DIFFUSION THROUGH THE DIELECTRIC, WITH CORRESPONDING ELEMENTS (112, 122, 132, 142) OF THE CRACKSTOP BEING CONSTRUCTED SIMULTANEOUSLY WITH THE CIRCUIT INTERCONNECT ELEMENTS; E.G. HORIZONTAL INTERCONNECT ELEMENTS HAVE A CORRESPONDING STRUCTURE IN THE CRACKSTOP AND VIAS BETWEEN INTERCONNECT LAYERS HAVE CORRESPONDING STRUCTURES IN THE CRACKSTOP.

公开(公告)号：CA2368950C

公开(公告)日：2012-10-02

申请号：CA2368950

申请日：2000-05-15

Applicant: IBM

Inventor： EDELSTEIN DANIEL C ,  MCGAHAY VINCENT ,  NYE HENRY A III ,  OTTEY BRIAN G R ,  PRICE WILLIAM H

IPC: H01L23/485 ,  H01L23/52 ,  H01L21/3205 ,  H01L21/60 ,  H01L23/532

Abstract: A structure comprising a layer of copper (1), a barrier layer (10), a layer of AlCu (9), and a pad-limiting layer (7), wherein the layer of AlCu and barrier layer are interposed between the layer of copper and pad-limiting layer.

公开(公告)号：MY118419A

公开(公告)日：2004-10-30

申请号：MYPI20001978

申请日：2000-05-08

Applicant: IBM

Inventor： EDELSTEIN DANIEL CHARLES ,  MCGAHAY VINCENT ,  NYE HENRY A III ,  OTTEY BRIAN R ,  PRICE WILLIAM H

IPC: H01L21/4763 ,  H01L23/52 ,  H01L21/3205 ,  H01L21/60 ,  H01L23/485

Abstract: A STRUCTURE COMPRISING A LAYER OF COPPER, A BARRIER LAYER, A LAYER OF ALCU, AND A PAD-LIMITING LAYER, WHEREIN THE LAYER OF ALCU AND BARRIER LAYER ARE INTERPOSED BETWEEN THE LAYER OF COPPER AND PAD-LIMITING LAYER. (FIGURE 2)