Abstract:
The invention relates to a field effect transistor configuration in which the source region (6), in order to increase the latch-up strength, extends along a trench (2) and below the highly doped base region (8) in a self-adjusting manner.
Abstract:
The FET device includes a semiconductor substrate (1) with a trench (2). An insulating layer (4) covers the walls of the trench. A conductive material (5) fills the trench and forms a gate electrode. A source region (6), a body region (7) and a drain region (10) are also formed. A highly doped region (8) is formed in the body region that is at least partially arranged under the source region and adjoins the source region. The source region extends from the first surface (3) of the semiconductor substrate (1), along the trench (2) and up to the highly doped region in the body region.
Abstract:
Die Offenbarung beschreibt Techniken zur Bestimmung einer Ionenkonzentration in einer Probe. Eine Ionenkonzentration einer Probe ist bestimmt durch Detektieren einer Änderung einer elektrischen Eigenschaft einer Feldeffekttransistor(FET)-Halbleitervorrichtung bedingt durch eine Gate-Isolierung (60) der Halbleitervorrichtung, welche in Kontakt mit der Probe gebracht wurde.
Abstract:
A device with etching equipment for etching complete layers or parts of layers to be removed from semiconductor wafers (5) with a liquid etching medium comprises a spectrometer (13) for measuring the concentration of the etching medium. Independent claims are also included for the following. (1) etching complete layers or parts of layers to be removed from semiconductor wafers; and (2) the application of a spectrometer in an etching device.