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公开(公告)号：AU9492801A
公开(公告)日：2002-05-15
申请号：AU9492801
申请日：2001-10-01
Applicant: MACDERMID INC
Inventor： REDLINE RONALD , WOJTASZEK MARK
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公开(公告)号：AU2002305124A1
公开(公告)日：2003-09-04
申请号：AU2002305124
申请日：2002-04-01
Applicant: MACDERMID INC
Inventor： BENGSTON JON , WOJTASZEK MARK , WOJCIK GERALD , DIMARCO MASSIMO
Abstract: A conversion coating composition and a method of applying the conversion coating composition to magnesium and magnesium alloy articles prior to painting to prevent corrosion. The conversion coating composition comprises a source of vanadate ions, a material comprising phosphorus, and nitric acid or a source of nitrate ions. In addition, the composition may also contain boric acid or a source of borate ions and a source of fluoride ions or a source of fluoroborate ions.
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3.发明专利
公开(公告)号：ES2703240T3
公开(公告)日：2019-03-07
申请号：ES06848028
申请日：2006-12-21
Applicant: MACDERMID INC
Inventor： WOJTASZEK MARK , WATKOWSKI JAMES , LARSON GARY , KUKANSKIS PETER
IPC: C23C18/32
Abstract: Un método para metalizar un sustrato de polímero que comprende las etapas de: a) tratamiento de superficie del sustrato de polímero con un tratamiento con plasma o de superficie de descarga corona; b) acondicionar y grabar el sustrato de polímero con una solución de grabado que comprende un hidróxido y paladio iónico; c) activar el sustrato de polímero con paladio iónico; d) reducir el paladio sobre el sustrato de polímero; e) colocar una capa de níquel no electrolítico sobre el sustrato de polímero preparado; y f) colocar una capa de cobre no electrolítico sobre la capa de níquel no electrolítico.
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4.发明专利
公开(公告)号：ES2613510T3
公开(公告)日：2017-05-24
申请号：ES09722758
申请日：2009-02-10
Applicant: MACDERMID INC
Inventor： WOJTASZEK MARK , HAMILTON ROBERT
Abstract: Un artículo sometido a electrodeposición selectiva que comprende: a) una primera parte de plástico que comprende un veneno catalítico disperso uniformemente en la misma que inhibe la electrodeposición no electrolítica sobre la primera parte de plástico; y b) una segunda parte de plástico que es receptiva a la electrodeposición no electrolítica sobre la misma y que tiene una capa de electrodeposición de metal no electrolítico depositada sobre la misma; en el que la primera parte de plástico está libre de electrodeposición de metal no electrolítico, caracterizado por que el veneno catalítico es ácido yodobenzoico.
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Patent Agency Ranking5.发明申请POLYIMIDE SUBSTRATE AND METHOD OF MANUFACTURING PRINTED WIRING BOARD USING THE SAME 审中-公开聚酰亚胺基板和使用其制造印刷线路板的方法
公开(公告)号：WO2007111671A8
公开(公告)日：2007-11-22
申请号：PCT/US2006049016
申请日：2006-12-21
Applicant: MACDERMID INC
Inventor： WOJTASZEK MARK , WATKOWSKI JAMES , LARSON GARY B , KUKANSKIS PETER
CPC classification number: H05K3/181 , C08J7/12 , C08J7/123 , C08J2379/08 , C23C18/1651 , C23C18/1653 , C23C18/2006 , C23C18/2086 , C23C18/22 , C23C18/30 , C23C18/32 , H05K1/0346 , H05K3/381 , H05K2201/0344 , H05K2203/0793 , H05K2203/095 , H05K2203/097
Abstract: The present invention is directed to an improved method for metallizing polymer substrates, such as polyimides. The present invention comprises the steps of surface treating the polymer substrate with a plasma jet or corona discharge surface treatment, conditioning and etching the polymer substrate with an etching solution comprising a hydroxide and ionic palladium, activating the polymer substrate with ionic palladium, reducing the palladium on the polymer substrate, plating an electroless nickel layer onto the prepared polymer substrate, arid plating an electroless copper layer over the electroless nickel layer. The process of the invention provides an improved method for preparing the polymer substrate for subsequent electrolytic plating thereon.
Abstract translation: 本发明涉及用于金属化聚合物基材例如聚酰亚胺的改进方法。 本发明包括以下步骤：用等离子体喷射或电晕放电表面处理对聚合物基材进行表面处理，用包含氢氧化物和离子钯的蚀刻溶液调节和蚀刻聚合物基材，用离子钯活化聚合物底物，还原钯 在聚合物基材上，将无电镍层电镀到制备的聚合物基材上，并在无电镍层上镀覆无电解铜层。 本发明的方法提供了一种改进的制备聚合物基质的方法，用于其后的电解电镀。
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6.发明申请CATALYST SOLUTIONS USEFUL IN ACTIVATING SUBSTRATES FOR SUBSEQUENT PLATING 审中-公开催化剂解决方案可用于激活底层进行后续镀层
公开(公告)号：WO0236273A8
公开(公告)日：2002-06-06
申请号：PCT/US0130655
申请日：2001-10-01
Applicant: MACDERMID INC
Inventor： REDLINE RONALD , WOJTASZEK MARK
CPC classification number: B01J35/0013 , B01J23/66 , C23C18/28 , H05K3/181
Abstract: An improved colloidal activator is disclosed which is useful in preparing substrates for plating. The activator comprises a source of gold, a source of tin and an organic sulfonic acid. The colloidal activator may also include colloid stabilizers. A method for preparing and a process for using the activator are also disclosed.
Abstract translation: 公开了一种改进的胶体活化剂，其可用于制备用于电镀的基材。 活化剂包含金源，锡源和有机磺酸。 胶态活化剂也可以包括胶体稳定剂。 还公开了制备方法和使用该活化剂的方法。
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公开(公告)号：EP1483429A4
公开(公告)日：2005-04-20
申请号：EP02733925
申请日：2002-04-01
Applicant: MACDERMID INC
Inventor： BENGSTON JON , WOJTASZEK MARK , WOJCIK GERALD , DIMARCO MASSIMO
Abstract: A conversion coating composition and method of applying the conversion coating composition to magnesium and magnesium alloy articles prior to painting to prevent corrosion. The conversion coating composition comprises a source of vanadate ions, a material comprising phosphorus, and nitric acid or a source of nitrate ions. In addition, the composition may also contain boric acid or a source of borate ions and a source of fluoride ions or a source of fluoroborate ions.
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8.发明公开
公开(公告)号：EP2007931A4
公开(公告)日：2010-03-10
申请号：EP06848028
申请日：2006-12-21
Applicant: MACDERMID INC
Inventor： WOJTASZEK MARK , WATKOWSKI JAMES , LARSON GARY B , KUKANSKIS PETER
CPC classification number: H05K3/181 , C08J7/12 , C08J7/123 , C08J2379/08 , C23C18/1651 , C23C18/1653 , C23C18/2006 , C23C18/2086 , C23C18/22 , C23C18/30 , C23C18/32 , H05K1/0346 , H05K3/381 , H05K2201/0344 , H05K2203/0793 , H05K2203/095 , H05K2203/097
Abstract: The present invention is directed to an improved method for metallizing polymer substrates, such as polyimides. The present invention comprises the steps of surface treating the polymer substrate with a plasma jet or corona discharge surface treatment, conditioning and etching the polymer substrate with an etching solution comprising a hydroxide and ionic palladium, activating the polymer substrate with ionic palladium, reducing the palladium on the polymer substrate, plating an electroless nickel layer onto the prepared polymer substrate, and plating an electroless copper layer over the electroless nickel layer. The process of the invention provides an improved method for preparing the polymer substrate for subsequent electrolytic plating thereon.
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公开(公告)号：EP2265747A4
公开(公告)日：2014-11-05
申请号：EP09722758
申请日：2009-02-10
Applicant: MACDERMID INC
Inventor： WOJTASZEK MARK , HAMILTON ROBERT
CPC classification number: H05K3/182 , C23C18/1607 , C23C18/1608 , C23C18/1641 , C23C18/24 , C23C18/31 , H05K1/0373 , H05K2201/09118 , H05K2203/0713 , Y10T428/31504
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