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    Process for manufacturing a group comprising at least two elements, one whereof includes an encapsulated micro-integrated structure, and thereby obtained group
    1.
    发明公开
    Process for manufacturing a group comprising at least two elements, one whereof includes an encapsulated micro-integrated structure, and thereby obtained group 审中-公开
    一种用于制备的基团，其保留至少两个元件，它保留一个护套的微一体化结构，从而获得组过程

    公开(公告)号：EP1122720A1

    公开(公告)日：2001-08-08

    申请号：EP00830075.8

    申请日：2000-02-02

    Applicant: STMicroelectronics S.r.l.

    Inventor： Murari, Bruno ,  Vigna, Benedetto ,  Sassolini, Simone ,  Ratti, Francesco ,  Alessandri, Alberto

    IPC: G11B5/55

    CPC classification number: G11B5/5552

    Abstract: The manufacture process comprises: forming a first wafer (20) of semiconductor material housing integrated electronic components forming a microactuator control circuit and a signal preamplification circuit (22); forming microactuators (10), each comprising a rotor (52) and a stator (51), in a surface portion of a second wafer (28) of semiconductor material; attaching the second wafer (28) to the first wafer (20), with the surface portion of the second wafer facing the first wafer; thinning the second wafer (28); attaching the second wafer (28) to a third wafer (75) to obtain a composite wafer (78); thinning the first wafer (20); cutting the composite wafer (78) into a plurality of dice (77) connected to a protection chip (75'); removing the protection chip (75'); attaching read/write transducers (6) to the dice (77); and attaching the dice to supporting blocks (3) for hard-disk drivers (1).

    Abstract translation: 制造方法包括：在形成微致动器控制电路和信号前置放大电路（22），半导体材料壳体集成电子部件的第一晶片（20）; 微致动器形成（10），每个包括一个转子（52）和在所述半导体材料的第二晶片（28）的表面部分的定子（51）; 附着在第二晶片（28）到所述第一晶片（20）具有面向所述第一晶片的第二晶片的表面部分; 减薄所述第二晶片（28）; 第二晶片（28）附接至第三晶片（75），以获得复合晶片（78）; 减薄第一晶片（20）; 切割所述复合晶片（78）插入连接到一个保护芯片（75“）的骰子的多个（77）; 去除保护芯片（75“）; 附接的读/写换能器（6）连接到骰子（77）; 和骰子附着到用于硬盘驱动器支撑块（3）（1）。

    Micro-electro-mechanical gyroscope having electrically insulated regions
    2.
    发明公开
    Micro-electro-mechanical gyroscope having electrically insulated regions 有权
    Mems-Kreisel mit elektrisch isolierten Bereiche

    公开(公告)号：EP1677073A1

    公开(公告)日：2006-07-05

    申请号：EP04425957.0

    申请日：2004-12-29

    Applicant: STMicroelectronics S.r.l.

    Inventor： Spinola Durante, Guido ,  Sassolini, Simone ,  Rusconi Clerici, Andrea

    IPC: G01C19/56

    CPC classification number: G01C19/5762 ,  G01C19/5747

    Abstract: Integrated gyroscope (1) including a suspended mass (10); mobile actuation electrodes (11) extending from the suspended mass; and a sensing mass (6) connected to the actuation mass (10) through coupling springs (25). The suspended mass (10) is formed by an external part (10a) and an internal part (10b), electrically separated by an electrical-insulation region (23) having a closed annular shape. The electrical-insulation region (23) is laterally completely surrounded by the external part (10a) and by the internal part (10, 10b). In one embodiment, the suspended mass (10) has the shape of a closed frame delimiting an opening (18), the sensing mass (20) is formed inside the opening (18) and is connected to the internal part (10b), and the mobile actuation electrodes (11) are connected to the external part (10a).

    Abstract translation: 集成陀螺仪（1），包括悬挂质量（10）; 从悬挂块延伸的移动致动电极（11） 以及通过联接弹簧（25）连接到致动质量块（10）的传感块（6）。 悬挂物质（10）由外部部分（10a）和内部部分（10b）形成，内部部分（10b）由具有闭合环形的电绝缘区域（23）电分离。 电绝缘区域（23）由外部部件（10a）和内部部件（10,10b）横向完全包围。 在一个实施例中，悬挂质量（10）具有限定开口（18）的封闭框架的形状，感测块（20）形成在开口（18）内部并连接到内部部分（10b），并且 移动致动电极（11）连接到外部部分（10a）。

    Process for assembling a microactuator and a transducer in a hard disk R/W unit
    3.
    发明公开
    Process for assembling a microactuator and a transducer in a hard disk R/W unit 有权
    一种用于组装一组包括至少一个第一和一个第二元件，包括无包的显微组织的元素，其中一个过程

    公开(公告)号：EP1069552A1

    公开(公告)日：2001-01-17

    申请号：EP99830449.7

    申请日：1999-07-15

    Applicant: STMicroelectronics S.r.l.

    Inventor： Mastromatteo, Ubaldo ,  Zerbini, Sarah ,  Sassolini, Simone ,  Vigna, Benedetto

    IPC: G11B5/55 ,  G11B21/08 ,  H01L21/20 ,  H01L21/304

    CPC classification number: G11B5/56 ,  B81C1/00896 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/73204 ,  H01L2924/10253 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: The process for assembling a microactuator (10) on a R/W transducer (6) comprises the steps of: forming a first wafer (11) of semiconductor material comprising a plurality of microactuators (10) including suspended regions (15) and fixed regions (22) separated from each other by first trenches (24); forming a second wafer (25) of semiconductor material comprising blocking regions (27, 27') connecting mobile (29') and fixed (29") intermediate regions separated from each other by second trenches (33a); bonding the two wafers (11, 25) so as to form a composite wafer (39) wherein the suspended regions (15) of the first wafer (11) are connected to the mobile intermediate regions (29') of the second wafer (25), and the fixed regions (22) of the first wafer are connected to the fixed intermediate regions (29") of the second wafer; cutting the composite wafer (39) into a plurality of units (41); fixing the mobile intermediate region (29') of each unit (41) to a respective R/W transducer (6); and removing the blocking regions (27'). The blocking regions (27') are made of silicon oxide, and the intermediate regions are made of polycrystalline silicon.

    Abstract translation: 用于在R / W换能器（6）组装的微致动（10）的方法包括以下步骤：形成半导体材料的第一晶片（11）包括微致动器包括悬浮的区域（15）和固定区域中的多个（10） （22）由第一沟槽（24）彼此分开; 形成包括阻挡区域（27,27“）连接的移动（29”的半导体材料）的第二晶片（25）和固定的（29“）通过第二沟槽（33A），键合两个晶片彼此分开的中间区域（11 ，25），以便形成worin第一晶片（11的悬置区（15）的复合材料晶片（39））被连接到所述第二晶片的移动中间区（29“）（25）和所述固定区 （22）所述第一晶片被连接到所述第二晶片的所述固定的中间区域（29“）的; 切割所述复合晶片（39）插入的单元有多个（41）; 每个固定单元（41）的移动中间区（29“）到respectivement R / W换能器（6）; 和去除所述阻挡区域（27“）。 阻挡区域（27“）由氧化硅制成的，以及中间区由多晶硅。

    Process for manufacturing a microintegrated structure protected against contaminating particles, and thereby obtained microintegrated structure
    5.
    发明公开
    Process for manufacturing a microintegrated structure protected against contaminating particles, and thereby obtained microintegrated structure 审中-公开
    一种用于生产是从污染的部分保护的微集成结构的过程，并且这样的微集成结构的维护

    公开(公告)号：EP1122721A1

    公开(公告)日：2001-08-08

    申请号：EP00830076.6

    申请日：2000-02-02

    Applicant: STMicroelectronics S.r.l.

    Inventor： Vigna, Benedetto ,  Sassolini, Simone ,  Ratti, Francesco

    IPC: G11B5/55

    CPC classification number: G11B5/5552

    Abstract: The microstructure (77), of semiconductor material, includes a micromotor (10) and an encapsulation structure (81). The micromotor (10) is externally delimited by a first and a second faces (36, 37), opposed to one another, and by a side delimitation trench (58). The encapsulation structure (81) surrounds the micromotor (10) and has a bottom portion (29a, 29b) facing the second face (37) of the micromotor, and an outer lateral portion (82) facing the side delimitation trench (58). An outer separation trench (30b) extends through the bottom portion (29a, 29b) of the encapsulation structure (81), separates a mobile region (29b) from the external side portion (82), and defines, together with the side delimitation trench (58), a labyrinthic path for contaminating particles. A sealing ring (64a) extends on the bottom portion (29a, 29b) of the encapsulation structure (81) around an inner separation trench (30a) separating the mobile region (29b) from a fixed central region and closes a gap between the bottom portion (29a, 29b) and a mobile component (6) connected to the mobile region (29b) of the encapsulation structure (81).

    Abstract translation: 半导体材料的微结构（77），包括微电机（10）和到封装结构（81）。 微电机（10）在外部通过第一和第二面（36,37）彼此相对，并且通过侧划界沟槽（58）限定。 封装结构（81）包围所述微电机（10）和具有底部部分（29A，29B）面向所述微电机的所述第二面（37），和在面向侧划界沟槽（58），外侧部（82）。 外分离沟槽（30B）穿过底部部分延伸（29A，29B）的封装结构（81）的，从外部侧部分（82）和限定了与侧划界沟槽分开的移动区域（29B），一起 （58），用于污染颗粒的labyrinthic路径。 密封环（64）上的封装结构（81）在内部分离沟槽（30A）周围的底部（29A，29B）延伸，从一个固定的中央区域分离所述移动区域（29B）和关闭所述底部之间的间隙 在部分（29A，29B）和连接到该移动区域内的移动部件（6）（29B）的封装结构（81）的。

    Method for assembling an actuator device for a hard disc, comprising a read/write transducer, a microactuator and a suspension and actuator device thus obtained
    6.
    发明公开
    Method for assembling an actuator device for a hard disc, comprising a read/write transducer, a microactuator and a suspension and actuator device thus obtained 失效
    中，Microaktuator和悬架和致动器装置这样获得一种用于生产的致动器用于硬盘装置，具有读/写头处理

    公开(公告)号：EP0977180A1

    公开(公告)日：2000-02-02

    申请号：EP98830465.5

    申请日：1998-07-30

    Applicant: STMicroelectronics S.r.l.

    Inventor： Sassolini, Simone ,  Zerbini, Sarah ,  Vigna, Benedetto ,  Mastromatteo, Ubaldo

    IPC: G11B5/55

    CPC classification number: G11B5/5552 ,  G11B5/11

    Abstract: The microactuator (9) is attached to a first face (43) of a coupling (8) formed on a suspension (5), so that the R/W transducer (6) projects from the opposite face (44). A hole (41; 56) in the coupling (8) permits passage of an adhesive mass (42) interposed between the rotor (11) of the microactuator (9) and the R/W transducer (6). A strip (40) of adhesive material extends between the die (25) accommodating the microactuator (9) and the coupling (8), and externally surrounds the microactuator (9). The coupling (8) acts as a protective shield for the microactuator (9), both mechanically and electrically; it covers the microactuator (9) at the front, and prevents foreign particles from blocking the microactuator (9); in addition it electrically insulates the R/W transducer (6), sensitive to magnetic fields, from regions of the microactuator biased to a high voltage. With the gimbal (8), the strip (40) forms a sealing structure, which in practice surrounds the microactuator (9) on all sides.

    Abstract translation: （8）上形成的悬浮液微致动器（9）被连接到联接器的第一面（43）（5），所以做了R / W换能器（6）从所述相对面（44）的项目。 的孔（41; 56）中的接头（8）允许微致动器（9）的转子（11）和R / W换能器（6）之间的粘合剂的质量（42）的通道。 粘合材料的条带（40），所述模具（25），其容纳微致动器（9）和所述接头（8）之间延伸，并且外侧包围微致动器（9）。 耦合器（8）作为用于微致动器的保护性屏蔽罩（9）机械和电气; 它覆盖微致动器（9）在前面，并从阻塞微致动器（9）防止外来颗粒; 此外它电绝缘R / W换能器（6），对磁场敏感，从微致动器的区域偏置到高电压。 与万向接头（8），所述条带（40）形成的密封结构，这在实践中围绕微致动器（9）在所有侧面上。

    Analog data-input device provided with a microelectromechanical pressure sensor
    7.
    发明公开
    Analog data-input device provided with a microelectromechanical pressure sensor 有权
    德国传感器公司

    公开(公告)号：EP1707931A1

    公开(公告)日：2006-10-04

    申请号：EP05425183.0

    申请日：2005-03-31

    Applicant: STMicroelectronics S.r.l.

    Inventor： Baldo, Lorenzo ,  Combi, Chantal ,  Sassolini, Simone ,  Del Sarto, Marco

    IPC: G01L1/20

    CPC classification number: G06F3/041 ,  G01L9/0045 ,  G01L9/0054 ,  G01L19/141 ,  G01L19/147 ,  G06F3/0338 ,  H01H13/785 ,  H01H2201/02 ,  H01H2201/036 ,  H01H2221/012 ,  H01H2239/01 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

    Abstract: In a data-input device (4) an actuator element (6) that can be manually actuated, and a sensor (9) mechanically coupled to the actuator element (6). The sensor (9) is formed in a body (10) of semiconductor material housing a first sensitive element (11), which detects the actuation of the actuator element (6) and generates electrical control signals. The first sensitive element (11) is a microelectromechanical pressure sensor, formed by: a cavity (24) made within the body (10); a diaphragm (25) made in a surface portion of the body (10) and suspended above the cavity (24); and piezoresistive transducer elements (26) integrated in peripheral surface portions of the diaphragm (25) in order to detect its deformations upon actuation of the actuator element (6).

    Abstract translation: 在数据输入装置（4）中，可以手动致动的致动器元件（6）和机械地联接到致动器元件（6）的传感器（9）。 传感器（9）形成在容纳有第一敏感元件（11）的半导体材料的本体（10）中，该第一敏感元件（11）检测致动元件（6）的致动并产生电控制信号。 第一敏感元件（11）是微机电压力传感器，其通过：在主体（10）内制成的空腔（24）形成。 在所述主体（10）的表面部分中形成并悬浮在所述空腔（24）上方的隔膜（25）; 以及压电换能器元件（26），其集成在隔膜（25）的外周表面部分中，以便在致动元件（6）致动时检测其变形。

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