公开(公告)号：JP2004006862A

公开(公告)日：2004-01-08

申请号：JP2003129578

申请日：2003-04-01

Applicant: TESSERA INC

Inventor： FJELSTAD JOSEPH ,  SMITH JOHN W ,  DISTEFANO THOMAS H ,  WALTON A CHRISTIAN ,  ZACCARDI JAMES

IPC: H01R33/76 ,  B23K1/19 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  H01L21/48 ,  H01L21/60 ,  H01L23/32 ,  H01L23/48 ,  H01L23/498 ,  H01R4/02 ,  H01R12/00 ,  H01R12/52 ,  H01R12/57 ,  H01R12/70 ,  H01R12/71 ,  H01R13/24 ,  H05K1/11 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K7/08 ,  H05K7/10

Abstract: PROBLEM TO BE SOLVED: To provide an assembly of contacts useful for mounting semiconductor chips comprising sheet-like material having a plurality of holes aligned in a regular grid pattern, and elastic-layered contacts having a plurality of projections extending internally on the hole of the material. SOLUTION: A connector of a subminiature electronic element is equipped with a sheet-shaped main body (30) including a plurality of holes (36) that are preferably arranged with regular grid patterns. Each hole is provided with an elastic sheathed contact (38) including a plurality of protrusions (42) extending inward above the holes of the main body. The subminiature electronic element (68) including bump reeds (70) like solder balls can be engaged with the connector by making the bump reeds (70) enter into the holes of the connector so that the bump leads become engaged with the contacts. When it has become clear that the integrated body can be tested and can be admissible, the bump leads can be connected permanently to the contacts. COPYRIGHT: (C)2004,JPO

公开(公告)号：JP2006108704A

公开(公告)日：2006-04-20

申请号：JP2005338610

申请日：2005-11-24

Applicant: Tessera Inc ,  テセラ,インコーポレイテッド

Inventor： FJELSTAD JOSEPH ,  SMITH JOHN W

IPC: H01L21/60 ,  H05K1/18 ,  H01L23/12 ,  H01L23/31 ,  H01L23/495 ,  H01R12/04

CPC classification number: H01L24/50 ,  H01L23/3107 ,  H01L23/49572 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/3011

Abstract: PROBLEM TO BE SOLVED: To provide a lead structure, in which the electrical characteristic can be controlled satisfactorily, and a junction at a narrow spacing is enabled. SOLUTION: A microelectronic connection component has a support structure 10 and one or more flexible leads 36. Each lead has a first end 38 attached to the support structure, and a second end separate from the first end. Each lead includes a polymeric strip 41 having a top surface 16 and a bottom surface 18 facing in directions opposite to each other, a first metal layer 48 arranged on one side of the surface, and a second metal layer 50 arranged on another side of the surface. The thickness of the first and second conductive layer is smaller than 10 microns. COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：提供可以令人满意地控制电气特性的引线结构，并且能够实现窄间隔的结。 解决方案：微电子连接部件具有支撑结构10和一个或多个柔性引线36.每个引线具有附接到支撑结构的第一端38和与第一端分开的第二端。 每个引线包括具有顶表面16和面向彼此相反方向的底表面18的聚合物条41，布置在该表面的一侧上的第一金属层48和布置在该表面的另一侧上的第二金属层50 表面。 第一和第二导电层的厚度小于10微米。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2006032938A

公开(公告)日：2006-02-02

申请号：JP2005181280

申请日：2005-06-21

Applicant: Tessera Inc ,  テセラ,インコーポレイテッド

Inventor： DISTEFANO THOMAS H ,  SMITH JOHN W ,  KARAVAKIS KONSTANTINE ,  KOVAK ZLATA ,  FJELSTAD JOSEPH

IPC: H05K1/18 ,  H01R12/50 ,  H01R12/71 ,  H01R13/24 ,  H01R43/02 ,  H05K1/02 ,  H05K1/03 ,  H05K1/05 ,  H05K1/11 ,  H05K1/14 ,  H05K3/00 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46

CPC classification number: H01R13/2414 ,  H01R12/714 ,  H05K1/0272 ,  H05K1/036 ,  H05K1/056 ,  H05K1/116 ,  H05K3/0032 ,  H05K3/445 ,  H05K3/462 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0382 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10378 ,  H05K2203/0554 ,  H05K2203/0582 ,  H05K2203/135 ,  H05K2203/308 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: PROBLEM TO BE SOLVED: To provide a connecting structure which can improve the coupling reliability between substrates or a substrate and an electronic element. SOLUTION: An inserting body for interconnection between microelectronic circuit panels 260 has a contact point 250 on its surface. Each contact point has a center axis line orthogonal to the surface and a peripheral part which extends outward from the center axis line in a radial direction, in response to the force applied by a pad 262 of the engaged circuit panel. Thus, when the circuit panel 260 is compressed with the inserting body, the contact point is extended in the radial direction to wipe the pad 262. By this wiping action, coupling of the contact point to the pad by a conductive coupling material 246 supported by the contact point itself is facilitated. COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：提供可以提高基板或基板与电子元件之间的耦合可靠性的连接结构。 解决方案：用于微电子电路板260之间的互连的插入体在其表面上具有接触点250。 每个接触点具有与表面正交的中心轴线和响应于被接合的电路板的焊盘262施加的力而从径向方向从中心轴线向外延伸的外围部分。 因此，当电路板260被插入体压缩时，接触点在径向方向上延伸以擦拭焊盘262.通过这种擦拭动作，通过导电耦合材料246将接触点耦合到焊盘，由 接触点本身便利。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：DE69516725D1

公开(公告)日：2000-06-08

申请号：DE69516725

申请日：1995-07-19

Applicant: TESSERA INC

Inventor： DISTEFANO H ,  SMITH W ,  KARAVAKIS KONSTANTINE ,  KOVAK ZLATA ,  FJELSTAD JOSEPH

IPC: H01R12/50 ,  H01R12/71 ,  H01R13/24 ,  H01R43/02 ,  H05K1/02 ,  H05K1/03 ,  H05K1/05 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46 ,  H01R12/04 ,  H01R12/32

Abstract: An interposer for interconnection between microelectronic circuit panels (260) has contacts (250) at its surfaces. Each contact has a central axis normal to the surface and a peripheral portion adapted to expand radially outwardly from the central axis responsive to a force applied by a pad (262) on the engaged circuit panel. Thus, when the circuit panels (260) are compressed with the interposers, the contacts expand radially and wipe across the pads (262). The wiping action facilitates bonding of the contacts to the pads, as by conductive bonding material (246) carried on the contacts themselves.

公开(公告)号：AT192609T

公开(公告)日：2000-05-15

申请号：AT95927327

申请日：1995-07-19

Applicant: TESSERA INC

Inventor： DISTEFANO THOMAS H ,  SMITH JOHN W ,  KARAVAKIS KONSTANTINE ,  KOVAK ZLATA ,  FJELSTAD JOSEPH

IPC: H01R12/50 ,  H01R12/71 ,  H01R13/24 ,  H01R43/02 ,  H05K1/02 ,  H05K1/03 ,  H05K1/05 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46 ,  H01R12/04 ,  H01R12/32

Abstract: An interposer for interconnection between microelectronic circuit panels (260) has contacts (250) at its surfaces. Each contact has a central axis normal to the surface and a peripheral portion adapted to expand radially outwardly from the central axis responsive to a force applied by a pad (262) on the engaged circuit panel. Thus, when the circuit panels (260) are compressed with the interposers, the contacts expand radially and wipe across the pads (262). The wiping action facilitates bonding of the contacts to the pads, as by conductive bonding material (246) carried on the contacts themselves.

公开(公告)号：DE69533063T2

公开(公告)日：2005-05-19

申请号：DE69533063

申请日：1995-06-07

Applicant: TESSERA INC

Inventor： FJELSTAD JOSEPH ,  SMITH W ,  DISTEFANO H ,  WALTON CHRISTIAN ,  ZACCARDI JAMES

IPC: H01R33/76 ,  B23K1/19 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  H01L21/48 ,  H01L21/60 ,  H01L23/32 ,  H01L23/48 ,  H01L23/498 ,  H01R4/02 ,  H01R12/00 ,  H01R12/52 ,  H01R12/57 ,  H01R12/70 ,  H01R12/71 ,  H01R13/24 ,  H05K1/11 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K7/08 ,  H05K7/10 ,  H01R12/04 ,  H01R12/32 ,  H01R12/16

Abstract: A connector for microelectronic elements includes a sheet-like body (3) having a plurality of holes (36), desirably arranged in a regular grid pattern. Each hole is provided with a resilient laminar contact (38) having a plurality of projections (42) extending inwardly over the hole in the body. Microelectronic elements (68) having bump leads (70) such as solder balls thereon may be engaged with the connector by advancing the bump leads into the holes of the connector to engage the bump leads with the contacts. The assembly can be tested, and if found acceptable, the bump leads can be permanently bonded to the contacts.

公开(公告)号：DE69532832T2

公开(公告)日：2005-01-13

申请号：DE69532832

申请日：1995-07-19

Applicant: TESSERA INC

Inventor： DISTEFANO THOMAS H ,  SMITH JOHN W ,  KARAVAKIS KONSTANTINE ,  KOVAK ZLATA ,  FJELSTAD JOSEPH

IPC: H01R12/50 ,  H01R12/71 ,  H01R13/24 ,  H01R43/02 ,  H05K1/02 ,  H05K1/03 ,  H05K1/05 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46 ,  H01R12/04 ,  H04N9/877

Abstract: An interposer for interconnection between microelectronic circuit panels (260) has contacts (250) at its surfaces. Each contact has a central axis normal to the surface and a peripheral portion adapted to expand radially outwardly from the central axis responsive to a force applied by a pad (262) on the engaged circuit panel. Thus, when the circuit panels (260) are compressed with the interposers, the contacts expand radially and wipe across the pads (262). The wiping action facilitates bonding of the contacts to the pads, as by conductive bonding material (246) carried on the contacts themselves.

公开(公告)号：DE69533063D1

公开(公告)日：2004-06-24

申请号：DE69533063

申请日：1995-06-07

Applicant: TESSERA INC

Inventor： FJELSTAD JOSEPH ,  SMITH W ,  DISTEFANO H ,  WALTON CHRISTIAN ,  ZACCARDI JAMES

IPC: H01R33/76 ,  B23K1/19 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  H01L21/48 ,  H01L21/60 ,  H01L23/32 ,  H01L23/48 ,  H01L23/498 ,  H01R4/02 ,  H01R12/00 ,  H01R12/52 ,  H01R12/57 ,  H01R12/70 ,  H01R12/71 ,  H01R13/24 ,  H05K1/11 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K7/08 ,  H05K7/10 ,  H01R12/04 ,  H01R12/32 ,  H01R12/16

Abstract: A connector for microelectronic elements includes a sheet-like body (3) having a plurality of holes (36), desirably arranged in a regular grid pattern. Each hole is provided with a resilient laminar contact (38) having a plurality of projections (42) extending inwardly over the hole in the body. Microelectronic elements (68) having bump leads (70) such as solder balls thereon may be engaged with the connector by advancing the bump leads into the holes of the connector to engage the bump leads with the contacts. The assembly can be tested, and if found acceptable, the bump leads can be permanently bonded to the contacts.

公开(公告)号：AU5720998A

公开(公告)日：1998-07-03

申请号：AU5720998

申请日：1997-12-12

Applicant: TESSERA INC

Inventor： DISTEFANO THOMAS H ,  FJELSTAD JOSEPH

IPC: H01L23/498 ,  H01L23/538 ,  H05K1/11 ,  H05K3/46 ,  H01R23/68

公开(公告)号：AU3141297A

公开(公告)日：1997-12-09

申请号：AU3141297

申请日：1997-05-22

Applicant: TESSERA INC

Inventor： FJELSTAD JOSEPH ,  DISTEFANO THOMAS H ,  KARAVAKIS KONSTANTINE ,  FARACI ANTHONY B ,  NGUYEN TAN

IPC: H01R11/01 ,  G01R31/28 ,  H01L23/32 ,  H01L23/48 ,  H01L23/498 ,  H01R12/52 ,  H01R33/76 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K7/10 ,  H01R9/09

Abstract: A connector for microelectronic elements includes a sheetlike body having a plurality of active contacts arranged in a regular grid pattern. The active contacts may include several sheetlike metallic projections extending inwardly around a hole in the sheetlike element, on a first major surface of the sheetlike element. A support structure such as a grid array of noncollapsing structural posts is on a second major surface of the sheetlike element, and each of the posts is electrically connected to one of the active contacts. The grid array of posts and the grid array of active contacts are offset from one another so that an active contact is surrounded by several posts. The posts support the sheetlike element spaced away from a substrate to which the posts are attached. A microelectronic element having bump leads thereon may be engaged by contacting the bump leads with the active contacts, and deflecting the sheetlike element between the bump leads on one side and the posts on the other side. The assembly can be tested, and if found acceptable, the bump leads can be permanently bonded to the contacts.