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公开(公告)号：DE10393284T5
公开(公告)日：2005-09-08
申请号：DE10393284
申请日：2003-09-16
Applicant: WORLD PROPERTIES INC
Inventor： SETHUMADHAVAN MURALI , TRASKOS RICHARD T , ST LAWRENCE MICHAEL E
IPC: B32B15/04 , B32B27/12 , C08K3/36 , C08L27/18 , C08L67/00 , C09K19/38 , C09K19/54 , H05K1/03 , H05K3/46
Abstract: A liquid crystalline composite comprising a liquid crystalline polymer, particulate filler, and fibrous web. Further disclosed is a method for forming the liquid crystalline polymer composite. The liquid crystalline polymer composite is useful in circuit materials, circuits, and multi-layer circuits, economical to make, and has excellent flame retardant properties.
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2.发明专利
公开(公告)号：GB2410620B
公开(公告)日：2006-06-21
申请号：GB0507565
申请日：2003-09-16
Applicant: WORLD PROPERTIES INC
Inventor： SETHUMADHAVAN MURALI , TRASKOS RICHARD T , ST LAWRENCE MICHAEL E , PAUL SANKAR K , BORGES LUIS D , HORN III ALLEN F
IPC: H05K1/03 , B32B15/04 , B32B27/12 , C08K3/36 , C08L27/18 , C08L67/00 , C09K19/38 , C09K19/54 , H05K3/46
Abstract: A liquid crystalline composite comprising a liquid crystalline polymer, particulate filler, and fibrous web. Further disclosed is a method for forming the liquid crystalline polymer composite. The liquid crystalline polymer composite is useful in circuit materials, circuits, and multi-layer circuits, economical to make, and has excellent flame retardant properties.
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3.发明专利
公开(公告)号：GB2410620A
公开(公告)日：2005-08-03
申请号：GB0507565
申请日：2003-09-16
Applicant: WORLD PROPERTIES INC
Inventor： SETHUMADHAVAN MURALI , TRASKOS RICHARD T , ST LAWRENCE MICHAEL E , PAUL SANKAR K , BORGES LUIS D , HORN III ALLEN F
IPC: B32B15/04 , B32B27/12 , C08K3/36 , C08L27/18 , C08L67/00 , C09K19/38 , C09K19/54 , H05K1/03 , H05K3/46
Abstract: A liquid crystalline composite (12) comprising a liquid crystalline polymer (13), particulate filler (16), and fibrous web (18). Further disclosed is a method for forming the liquid crystalline polymer composite (12). The liquid crystalline polymer composite is useful in circuit materials, circuits, and multi-layer circuits, economical to make, and has excellent flame retardant properties.
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4.发明专利
公开(公告)号：GB2410620A8
公开(公告)日：2008-08-04
申请号：GB0507565
申请日：2003-09-16
Applicant: WORLD PROPERTIES INC
Inventor： SETHUMADHAVAN MURALI , TRASKOS RICHARD T , ST LAWRENCE MICHAEL E , PAUL SANKAR K , BORGES LUIS D , HORN ALLEN F III
IPC: B32B15/04 , B32B27/12 , C08K3/36 , C08L27/18 , C08L67/00 , C09K19/38 , C09K19/54 , H05K1/03 , H05K3/46
Abstract: A liquid crystalline composite comprising a liquid crystalline polymer, particulate filler, and fibrous web. Further disclosed is a method for forming the liquid crystalline polymer composite. The liquid crystalline polymer composite is useful in circuit materials, circuits, and multi-layer circuits, economical to make, and has excellent flame retardant properties.
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公开(公告)号：WO0249404A3
公开(公告)日：2003-02-27
申请号：PCT/US0146671
申请日：2001-12-04
Applicant: WORLD PROPERTIES INC
Inventor： ST LAWRENCE MICHAEL E , KENNEDY SCOTT
CPC classification number: B32B15/085 , B29K2105/0079 , B32B7/12 , B32B15/08 , B32B15/092 , B32B15/20 , B32B27/285 , B32B27/322 , B32B27/38 , B32B2307/202 , B32B2307/204 , B32B2309/02 , B32B2309/12 , B32B2327/18 , B32B2363/00 , B32B2457/08 , H05K3/4626 , H05K2201/0141 , Y10S428/901 , Y10T428/1005 , Y10T428/24917 , Y10T428/31681
Abstract: A multi-layer circuit board (10) comprises a liquid crystalline polymer bond ply (12) disposed between two circuit layers (14, 20) wherein the liquid crystalline polymer bond ply (12) is formed by treating a film comprising a liquid crystalline polymer with an amount of heat and pressure effective to produce a liquid crystalline polymer bond ply (12) with an in-plane coefficient of thermal expansion (CTE) of 0 to about 50 ppm/°C and further wherein the multi-layer circuit (10) is formed by lamination at a temperature of 0°C to about 10°C less than the melt temperature of the liquid crystalline polymer.
Abstract translation: 多层电路板（10）包括设置在两个电路层（14,20）之间的液晶聚合物键合层（12），其中液晶聚合物键合层（12）通过处理包含液晶聚合物 具有有效地产生面内热膨胀系数（CTE）为0至约50ppm /℃的液晶聚合物键合层（12）的热量和压力的量，此外，其中多层电路（10） ）通过在比液晶聚合物的熔融温度低0℃至约10℃的温度下层压而形成。
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Patent Agency Ranking
公开(公告)号：WO0249405A3
公开(公告)日：2002-10-17
申请号：PCT/US0148948
申请日：2001-12-13
Applicant: WORLD PROPERTIES INC
Inventor： ST LAWRENCE MICHAEL E , KENNEDY SCOTT D
CPC classification number: H05K3/4655 , H05K3/4652 , H05K2201/0141 , H05K2201/0195 , H05K2201/0358 , Y10T428/24917 , Y10T428/2495
Abstract: A multi-layer circuit comprises a circuit (18) and a resin covered conductive layer (12) disposed on the circuit (18), wherein the resin covered conductive layer (12) comprises a liquid crystalline polymer resin (16) laminated to a conductive layer (14). Such multi-layer circuits are particularly useful for high density circuit applications.
Abstract translation: 一种多层电路，包括电路（18）和设置在电路（18）上的树脂覆盖的导电层（12），其中树脂覆盖的导电层（12）包括液晶聚合物树脂（16） 层（14）。 这种多层电路对于高密度电路应用特别有用。
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7.发明申请THERMAL MANAGEMENT CIRCUIT MATERIALS, METHOD OF MANUFACTURE THEREOF, AND ARTICLES FORMED THEREFROM 审中-公开热管理电路材料，其制造方法和由其形成的制品
公开(公告)号：WO2007076014A2
公开(公告)日：2007-07-05
申请号：PCT/US2006049027
申请日：2006-12-21
Applicant: WORLD PROPERTIES INC , ST LAWRENCE MICHAEL E , SETHUMADHAVAN MURALI , SHERE ANI
Inventor： ST LAWRENCE MICHAEL E , SETHUMADHAVAN MURALI , SHERE ANI
CPC classification number: H05K1/0373 , B82Y10/00 , H01L23/3735 , H01L23/3737 , H01L2924/0002 , H01L2924/3011 , H05K1/0203 , H05K1/056 , H05K2201/0129 , H05K2201/0141 , H05K2201/015 , H05K2201/0154 , H05K2201/0158 , H05K2201/0209 , H05K2201/0251 , H05K2201/026 , H05K2201/0323 , H05K2201/068 , Y10T428/31504 , H01L2924/00
Abstract: A thermal management circuit material comprises an electrically conductive layer; a dielectric layer comprising a polymer matrix and a thermally conductive, electrically non-conductive particulate filler, wherein the dielectric layer is disposed on and in at least partial contact with the electrically conductive layer, and wherein the circuit material has a thermal conductivity of greater than or equal to about 1 watt per meter-degree Kelvin.
Abstract translation: 热管理电路材料包括导电层; 介电层，其包含聚合物基体和导热的不导电微粒填充物，其中所述介电层设置在所述导电层上并至少部分接触所述导电层，并且其中所述电路材料具有大于 或等于约1瓦每米开尔文。
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公开(公告)号：DE10393395T5
公开(公告)日：2005-10-27
申请号：DE10393395
申请日：2003-09-02
Applicant: WORLD PROPERTIES INC
Inventor： ST LAWRENCE MICHAEL E , REIMER LEAH M , SETHUMADHAVAN MURALI , KENNEDY SCOTT D
IPC: C09K19/38 , H01L23/498 , H05K1/03 , H05K3/46 , B32B15/08
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公开(公告)号：GB2411052A
公开(公告)日：2005-08-17
申请号：GB0508672
申请日：2003-09-02
Applicant: WORLD PROPERTIES INC
Inventor： ST LAWRENCE MICHAEL E , SETHUMADHAVAN MURALI , KENNEDY SCOTT D
IPC: C09K19/38 , H01L23/498 , H05K1/03 , H05K3/46 , B32B15/08
Abstract: Crosslinkable liquid crystalline polymer compositions (116) for use as dielectric materials (114) in circuit materials, circuits, and multi-layer circuits (100) are disclosed. The crosslinkable liquid crystalline polymer compositions comprise crosslinkable liquid crystalline polymers that preferably comprise end groups selected from the group consisting of phenyl maleimide, nadimide, phenyl acetylene, or combinations of the foregoing. Additionally, the crosslinkable liquid crystalline polymer compositions (116) may further comprise particulate fillers (118) and/or fibrous webs (120). The crosslinkable liquid crystalline polymer compositions provided improved electrical and mechanical properties.
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公开(公告)号：AT233936T
公开(公告)日：2003-03-15
申请号：AT99953087
申请日：1999-10-07
Applicant: WORLD PROPERTIES INC
Inventor： TRASKOS RICHARD T , KOSA BRUCE G , ST LAWRENCE MICHAEL E
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