Abstract:
A method and system for changing a pressure within at least one enclosure in a MEMS device are disclosed. In a first aspect, the method comprises applying a laser through one of the at least two substrates onto a material which changes the pressure within at least one enclosure when exposed to the laser, wherein the at least one enclosure is formed by the at least two substrates. In a second aspect, the system comprises a MEMS device that includes a first substrate, a second substrate bonded to the first substrate, wherein at least one enclosure is located between the first and the second substrates, a metal layer within one of the first substrate and the second substrate, and a material vertically oriented over the metal layer, wherein when the material is heated the material changes a pressure within the at least one enclosure.
Abstract:
This disclosure provides systems, methods, and apparatus for a MEMS display incorporating extended height actuators. A light modulating component can be positioned between a substrate and an opposing surface coupled to the substrate. A suspended electrode can be coupled to the light modulating component and suspended between the substrate and the opposing surface. An extended-height electrode can be positioned immediately adjacent to the suspended electrode, and can extend from the substrate up to a height beyond the height of the suspended electrode. The suspended electrode and the extended-height electrode can be configured to move the light modulating component laterally with respect to the substrate.
Abstract:
Various embodiments produce a semiconductor device, such a MEMS device, having metallized structures formed by replacing a semiconductor structure with a metal structure. Some embodiments expose a semiconductor structure to one or more a reacting gasses, such as gasses including tungsten or molybdenum.
Abstract:
A method and system for changing a pressure within at least one enclosure in a MEMS device are disclosed. In a first aspect, the method comprises applying a laser through one of the at least two substrates onto a material which changes the pressure within at least one enclosure when exposed to the laser, wherein the at least one enclosure is formed by the at least two substrates. In a second aspect, the system comprises a MEMS device that includes a first substrate, a second substrate bonded to the first substrate, wherein at least one enclosure is located between the first and the second substrates, a metal layer within one of the first substrate and the second substrate, and a material vertically oriented over the metal layer, wherein when the material is heated the material changes a pressure within the at least one enclosure.
Abstract:
A method for fabricating a sensor for chemical and/or biological materials, comprising steps of providing a wafer comprising a plurality of cantilever assemblies, each of the assemblies comprising a cantilever member and a micro-channel plate bonded to the cantilever member, the micro-channel plate further comprising a micro-channel, functionalizing each of the cantilevers by directing a flow of a plurality of functionalizing materials through the micro-channels, and dicing the wafer into a plurality of the sensors. Each of the cantilever assemblies comprises substrate comprising control and sense electrodes deposited on its top side and scribe marks etched on its back side; a cantilever member comprising a cantilever, a seed layer and a contact pad formed on top side of the cantilever member; and the micro-channel plate comprises a micro-channel housing defining the micro-channel etched through the housing, wherein the back side of the cantilever member is bonded to the substrate and the micro-channel plate is bonded to said top side of the cantilever member. Control electronics are incorporated into the substrate for a completely integrated design.
Abstract:
A micromechanical component. The micromechanical component includes: a mount; a displaceable part; and a first serpentine spring and a second serpentine spring which is embodied mirror-symmetrically with respect to the first serpentine spring in terms of a first plane of symmetry; a first actuator device and a second actuator device being embodied in such a way that by way of the first actuator device and the second actuator device, periodic deformations, mirror-symmetrical in terms of the first plane of symmetry, of the first serpentine spring and of the second serpentine spring are excitable; the micromechanical component also encompassing a first torsion spring and a second torsion spring that each extend along a rotation axis; and the displaceable part being displaceable, at least by way of the periodic and mirror-symmetrical deformations of the first serpentine spring and of the second serpentine spring, around the rotation axis with respect to the mount.
Abstract:
The present disclosure provides a method for the surface modification of microstructured components having a polar surface, in particular for high-pressure applications. According to the method, a microstructured component is contacted, in particular treated, with a modification reagent, wherein the surface properties of the component are modified by chemical and/or physical interaction of the component surface and of the modification reagent.
Abstract:
Various embodiments produce a semiconductor device, such a MEMS device, having metallized structures formed by replacing a semiconductor structure with a metal structure. Some embodiments expose a semiconductor structure to one or more a reacting gasses, such as gasses including tungsten or molybdenum.
Abstract:
There is provided a sensor element including: a semiconductor base member having a first main surface and a second main surface located opposite to the first main surface, and having a cavity structure formed on the second main surface side; and a detection element formed on the first main surface side in a region where the cavity structure is formed, the second main surface of the semiconductor base member including a convexly and concavely shaped portion, and a tip of a convex portion of the convexly and concavely shaped portion having a curved shape.