RADIATION-SENSITIVE RESIN COMPOSITION
    91.
    发明专利

    公开(公告)号:JP2003202673A

    公开(公告)日:2003-07-18

    申请号:JP2001401936

    申请日:2001-12-28

    Applicant: JSR CORP

    Abstract: PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition excellent in basic physical properties as a resist, such as transparency and sensitivity to radiations, resolution and dry etching resistance. SOLUTION: The radiation-sensitive resin composition comprises an acid- dissociable group-containing resin (A) including a repeating unit of formula (1-1) (where each R 1 is independently H or methyl and each R 2 is independently a 2-6C alkyl) and a radiation-sensitive acid generator (B) of formula (2) (where R 3 is a monovalent organic group and R 4 is a divalent organic group). COPYRIGHT: (C)2003,JPO

    Compound having sulfonyl structure, radiation-sensitive acid generating agent produced by using the same, positive-type radiation-sensitive resin composition and negative-type radiation-sensitive resin composition
    92.
    发明专利
    Compound having sulfonyl structure, radiation-sensitive acid generating agent produced by using the same, positive-type radiation-sensitive resin composition and negative-type radiation-sensitive resin composition 有权
    具有磺基结构的化合物,使用其生产的辐射敏感酸产生剂,阳离子型辐射敏感性树脂组合物和负型类型的辐射敏感性树脂组合物

    公开(公告)号:JP2003055341A

    公开(公告)日:2003-02-26

    申请号:JP2001248430

    申请日:2001-08-17

    Abstract: PROBLEM TO BE SOLVED: To provide a compound having a sulfonyl structure, giving excellent resist pattern and useful as an acid generating agent sensitive to active radiation such as far ultraviolet radiation, a radiation-sensitive acid generating agent produced by using the compound and a positive-type or negative-type chemical- amplification radiation-sensitive resin composition. SOLUTION: The compound having a sulfonyl structure is expressed by general formula I [R to R are each H, a 1-20C substituted/unsubstituted alkyl or alkenyl or a substituted/unsubstituted aryl or heteroaryl; and Y is O, S, =N-R , =N-OR , =N-N-R or the like (R and R are each same as R to R )]. Concrete example of the compound of general formula I is 2- methoxyimino-2-indanonoxime-1-propanesulfonate.

    Abstract translation: 要解决的问题:为了提供具有磺酰结构的化合物,提供优异的抗蚀剂图案并且可用作对诸如远紫外线辐射的活性辐射敏感的酸产生剂,使用该化合物和阳性产生的辐射敏感性酸产生剂 型或负型化学放大辐射敏感树脂组合物。 解决方案:具有磺酰结构的化合物由通式I表示[R 1至R 3各自为H,1-20C取代/未取代的烷基或烯基或取代/未取代的芳基或杂芳基; 并且Y是O,S,= NR 4,= N-OR 4,= NNR 5等(R 4和R 5各自与R 1至R' 3>)]。 通式I的化合物的具体实例是2-甲氧基亚氨基-2-茚满酮肟-1-丙磺酸盐。

    Radiation sensitive resin composition
    93.
    发明专利
    Radiation sensitive resin composition 有权
    辐射敏感性树脂组合物

    公开(公告)号:JP2003043678A

    公开(公告)日:2003-02-13

    申请号:JP2001234457

    申请日:2001-08-02

    Abstract: PROBLEM TO BE SOLVED: To provide a radiation sensitive composition excellent in storage stability as well as in resolution and environmental resistance as a chemical amplification type resist sensitive to active radiation, e.g. UV rays such as g- or i-line, KrF, ArF or F
    2 excimer laser light, far UV typified by EUV (extreme-ultraviolet radiation) or an electron beam.
    SOLUTION: The radiation sensitive resin composition contains a nitrogen- containing compound having a specified structure.
    COPYRIGHT: (C)2003,JPO

    Abstract translation: 要解决的问题:提供具有优异的储存稳定性以及分辨率和耐环境性的辐射敏感性组合物,作为对活性辐射敏感的化学放大型抗蚀剂,例如, 诸如g-或i-线,KrF,ArF或F2准分子激光的紫外线,由EUV(极紫外辐射)代表的远紫外线或电子束。 解决方案:辐射敏感性树脂组合物含有具有特定结构的含氮化合物。

    POLYSILOXANE, METHOD FOR PRODUCING THE SAME, AND RADIATION-SENSITIVE RESIN COMPOSITION

    公开(公告)号:JP2002308990A

    公开(公告)日:2002-10-23

    申请号:JP2001111786

    申请日:2001-04-10

    Applicant: JSR CORP

    Abstract: PROBLEM TO BE SOLVED: To obtain a polysiloxane which can give a radiation-sensitive resin composition having a high transparency to light of a wavelength of 193 nm or shorter and being highly sensitive, and excellent in dry etching resistance, developability, adhesion to a substrate, or the like, to provide a method for producing the same, and to obtain a radiation-sensitive resin composition containing the polysiloxane. SOLUTION: The polysiloxane is an alkali-insoluble or difficulty alkali-soluble acid-dissociable-group-containing polysiloxane which becomes alkali-soluble when the acid-dissociable groups are dissociated and has an Mw/Mn ratio of at most 2.5. The polysiloxane is produced by a method having a step of polycondensing a starting silane compound in the presence of an acid catalyst.

    POLYSILOXANE
    96.
    发明专利
    POLYSILOXANE 审中-公开

    公开(公告)号:JP2002194085A

    公开(公告)日:2002-07-10

    申请号:JP2001300517

    申请日:2001-09-28

    Applicant: JSR CORP

    Abstract: PROBLEM TO BE SOLVED: To obtain a new polysiloxane, useful as a resin component, or the like, of a resist material, excellent in dryetching resistance, and also excellent in basic physical properties as resist such as a transparency to a radiation, sensibility, resolution and developing property. SOLUTION: This polysiloxane has a structural unit (I) and/or a structural unit (II) expressed by formula (1), and a polystylene-converted weight-average molecular weight of 500-1,000,000 (wherein, in formula (1), each R denotes independently hydrogen atom or methyl group, R' denotes hydrogen atom, methyl group or trifluoromethyl group, X denotes hydrogen atom or a monovalent acid-dissociative group, R" denotes hydrogen atom, a 1-20C hydrocarbon group, a monovalent 1-20C hydrocarbon halide group, a halogen atom or primary, a secondary or a tertiary amino group, and (n) is an integer of 0-3).

    SILICON-CONTAINING ALICYCLIC COMPOUND

    公开(公告)号:JP2002128788A

    公开(公告)日:2002-05-09

    申请号:JP2000318752

    申请日:2000-10-19

    Applicant: JSR CORP

    Abstract: PROBLEM TO BE SOLVED: To provide a new silicon-containing alicyclic compound useful as a raw material for polysiloxane resins used for chemical amplification resists having excellent dry etching resistance, transparency to radiation, resolution, a developing property. SOLUTION: This silicon-containing alicyclic compound has such a structure that 2-hydroxy-(2-trifluoromethyl)ethyl group, 2-hydroxy-2-methyl-(2- trifluoromethyl)ethyl group or 2-hydroxy-2,2-di(trifluoromethyl)ethyl group and a (substituted) silyl group or cyclic polysiloxane group (the number of silicon atoms being 3-10) are bound to a bicyclo[2.2.1]heptane ring or 2-4 bicyclo[2.2.1]heptane rings-condensed ring, or a structure that the hydrogen atom(s) of the hydroxy group(s) in the above structure is (are) substituted with acid-dissociable organic group(s).

    RADIATION SENSITIVE RESIN COMPOSITION

    公开(公告)号:JP2002023371A

    公开(公告)日:2002-01-23

    申请号:JP2000204223

    申请日:2000-07-05

    Applicant: JSR CORP

    Abstract: PROBLEM TO BE SOLVED: To provide a new radiation sensitive resin composition having high transparency to radiation, excellent in basic physical properties as a resist such as sensitivity, resolution and pattern shape, not causing development defects in microfabrication and capable of producing a semiconductor device in a high yield. SOLUTION: The radiation sensitive resin composition contains (A) a resin having at least one heterocyclic structure of formula (1) (where R1 is H, a 1-6C linear, branched or cyclic alkyl, a 1-6C linear, branched or cyclic alkoxy or a 2-7C linear, branched or cyclic alkoxycarbonyl) in a side chain and (B) a radiation sensitive acid generating agent.

    POSITIVE TYPE RADIATION SENSITIVE RESIN COMPOSITION

    公开(公告)号:JP2001330959A

    公开(公告)日:2001-11-30

    申请号:JP2000151175

    申请日:2000-05-23

    Applicant: JSR CORP

    Abstract: PROBLEM TO BE SOLVED: To provide a positive type radiation sensitive resin composition having high transparency to radiation, excellent in resolution, sensitivity, pattern shape, etc., causing no development defect in microfabrication and capable of producing a semiconductor device in a high yield. SOLUTION: The positive type radiation sensitive resin composition contains (A) an alkali-insoluble or slightly alkali-soluble acid dissociable group-containing resin having a structure of formula (1) [where R1 is H, a 1-5C linear or branched alkyl or a 1-5C linear or branched alkoxyl] and/or a structure of formula (2) [where Z is a 4-20C trivalent alicyclic hydrocarbon group or its substituted derivative and X is a single bond or a 1-5C divalent organic group] and convertible to an alkali-soluble resin when the acid dissociable group is dissociated and (B) a radiation sensitive acid generating agent.

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