Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition excellent in basic physical properties as a resist, such as transparency and sensitivity to radiations, resolution and dry etching resistance. SOLUTION: The radiation-sensitive resin composition comprises an acid- dissociable group-containing resin (A) including a repeating unit of formula (1-1) (where each R 1 is independently H or methyl and each R 2 is independently a 2-6C alkyl) and a radiation-sensitive acid generator (B) of formula (2) (where R 3 is a monovalent organic group and R 4 is a divalent organic group). COPYRIGHT: (C)2003,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a compound having a sulfonyl structure, giving excellent resist pattern and useful as an acid generating agent sensitive to active radiation such as far ultraviolet radiation, a radiation-sensitive acid generating agent produced by using the compound and a positive-type or negative-type chemical- amplification radiation-sensitive resin composition. SOLUTION: The compound having a sulfonyl structure is expressed by general formula I [R to R are each H, a 1-20C substituted/unsubstituted alkyl or alkenyl or a substituted/unsubstituted aryl or heteroaryl; and Y is O, S, =N-R , =N-OR , =N-N-R or the like (R and R are each same as R to R )]. Concrete example of the compound of general formula I is 2- methoxyimino-2-indanonoxime-1-propanesulfonate.
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation sensitive composition excellent in storage stability as well as in resolution and environmental resistance as a chemical amplification type resist sensitive to active radiation, e.g. UV rays such as g- or i-line, KrF, ArF or F 2 excimer laser light, far UV typified by EUV (extreme-ultraviolet radiation) or an electron beam. SOLUTION: The radiation sensitive resin composition contains a nitrogen- containing compound having a specified structure. COPYRIGHT: (C)2003,JPO
Abstract:
PROBLEM TO BE SOLVED: To obtain a polysiloxane which can give a radiation-sensitive resin composition having a high transparency to light of a wavelength of 193 nm or shorter and being highly sensitive, and excellent in dry etching resistance, developability, adhesion to a substrate, or the like, to provide a method for producing the same, and to obtain a radiation-sensitive resin composition containing the polysiloxane. SOLUTION: The polysiloxane is an alkali-insoluble or difficulty alkali-soluble acid-dissociable-group-containing polysiloxane which becomes alkali-soluble when the acid-dissociable groups are dissociated and has an Mw/Mn ratio of at most 2.5. The polysiloxane is produced by a method having a step of polycondensing a starting silane compound in the presence of an acid catalyst.
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive variable refractive index composition for an optical material so that the refractive index of the material can be varied by an easy method, the difference in the varied refractive indices is sufficiently large, and a stable refractive index pattern and optical material can be obtained without depending on the succeeding use conditions. SOLUTION: The radiation-sensitive variable refractive index composition contains (A) a decomposable compound, (B) a non-decomposing compound having the refractive index lower than that of the decomposable compound (A), (C) a radiation-sensitive decomposing agent and (D) a stabilizer. By irradiating the composition with radiation through a pattern mask, the above component (C) and the component (A) in the irradiated part are decomposed to produce a difference in the refractive index between the irradiated part and the non- irradiated part to form a pattern having different refractive indices.
Abstract:
PROBLEM TO BE SOLVED: To obtain a new polysiloxane, useful as a resin component, or the like, of a resist material, excellent in dryetching resistance, and also excellent in basic physical properties as resist such as a transparency to a radiation, sensibility, resolution and developing property. SOLUTION: This polysiloxane has a structural unit (I) and/or a structural unit (II) expressed by formula (1), and a polystylene-converted weight-average molecular weight of 500-1,000,000 (wherein, in formula (1), each R denotes independently hydrogen atom or methyl group, R' denotes hydrogen atom, methyl group or trifluoromethyl group, X denotes hydrogen atom or a monovalent acid-dissociative group, R" denotes hydrogen atom, a 1-20C hydrocarbon group, a monovalent 1-20C hydrocarbon halide group, a halogen atom or primary, a secondary or a tertiary amino group, and (n) is an integer of 0-3).
Abstract:
PROBLEM TO BE SOLVED: To provide a new silicon-containing alicyclic compound useful as a raw material for polysiloxane resins used for chemical amplification resists having excellent dry etching resistance, transparency to radiation, resolution, a developing property. SOLUTION: This silicon-containing alicyclic compound has such a structure that 2-hydroxy-(2-trifluoromethyl)ethyl group, 2-hydroxy-2-methyl-(2- trifluoromethyl)ethyl group or 2-hydroxy-2,2-di(trifluoromethyl)ethyl group and a (substituted) silyl group or cyclic polysiloxane group (the number of silicon atoms being 3-10) are bound to a bicyclo[2.2.1]heptane ring or 2-4 bicyclo[2.2.1]heptane rings-condensed ring, or a structure that the hydrogen atom(s) of the hydroxy group(s) in the above structure is (are) substituted with acid-dissociable organic group(s).
Abstract:
PROBLEM TO BE SOLVED: To provide a new radiation sensitive resin composition having high transparency to radiation, excellent in basic physical properties as a resist such as sensitivity, resolution and pattern shape, not causing development defects in microfabrication and capable of producing a semiconductor device in a high yield. SOLUTION: The radiation sensitive resin composition contains (A) a resin having at least one heterocyclic structure of formula (1) (where R1 is H, a 1-6C linear, branched or cyclic alkyl, a 1-6C linear, branched or cyclic alkoxy or a 2-7C linear, branched or cyclic alkoxycarbonyl) in a side chain and (B) a radiation sensitive acid generating agent.
Abstract:
PROBLEM TO BE SOLVED: To provide a positive type radiation sensitive resin composition having high transparency to radiation, excellent in resolution, sensitivity, pattern shape, etc., causing no development defect in microfabrication and capable of producing a semiconductor device in a high yield. SOLUTION: The positive type radiation sensitive resin composition contains (A) an alkali-insoluble or slightly alkali-soluble acid dissociable group-containing resin having a structure of formula (1) [where R1 is H, a 1-5C linear or branched alkyl or a 1-5C linear or branched alkoxyl] and/or a structure of formula (2) [where Z is a 4-20C trivalent alicyclic hydrocarbon group or its substituted derivative and X is a single bond or a 1-5C divalent organic group] and convertible to an alkali-soluble resin when the acid dissociable group is dissociated and (B) a radiation sensitive acid generating agent.
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition excellent particularly in pattern shape as a chemical amplification type resist and excellent also in sensitivity, resolution, etc. SOLUTION: The radiation sensitive resin composition contains (A) an alkali- insoluble or slightly alkali-soluble acid dissociable group-containing resin which is made alkali-soluble when the acid dissociable group is dissociated, (B) a radiation sensitive and generating agent and (C) an adamantine derivative of formula 1 [where each R1 is H, an optionally substituted 1-20C alkyl or -CH2 COOR2 (R2 is a 1-18C alkyl)].