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公开(公告)号：JPH02102258A
公开(公告)日：1990-04-13
申请号：JP25463388
申请日：1988-10-07
Applicant: TORAY INDUSTRIES
Inventor： KAYABA KEIJI , OKAMOTO MASARU , INOUE SHUNEI
IPC: C08L67/00 , C08L77/00 , C09J167/00 , C09J177/00
Abstract: PURPOSE:To make it possible to form a resin composition excellent in heat resistance, dimensional stability and adhesion to metal by mixing a liquid crystal polyester having a specified structure with a polyamine. CONSTITUTION:This resin composition is prepared by mixing 99-1wt.% liquid crystal polyester comprising structural units of formulas I, II, III and IV (wherein X is at least one group selected from among those of formulas V and VI, -CH2CH2-, etc., the carbonyl groups of a structural unit IV are para or metal to each other, and at least 50mol% carbonyl pairs are in the para position), having a heat distortion temperature of 190-280 deg.C. a liquid crystal initiation temperature
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公开(公告)号：JPH02102257A
公开(公告)日：1990-04-13
申请号：JP25463288
申请日：1988-10-07
Applicant: TORAY INDUSTRIES
Inventor： KAYABA KEIJI , OKAMOTO MASARU
Abstract: PURPOSE:To make it possible to form a resin composition excellent in heat resistance, rigidity and dimensional accuracy by mixing a liquid crystal polyester of a specified structure with a polycarbonate. CONSTITUTION:This resin composition is prepared by mixing 99-1wt.% liquid crystal polyester comprising structural units of formulas I, II and III (wherein X is at least one group selected from among those of formulas IV, V and VI, -CH2CH2-, etc., the carbonyl groups of each structural unit II or III are para or meta to each other, and at least 50mol% carbonyl pairs are in the para position), having a heat distortion temperature of 190-280 deg.C, a liquid crystal initiation temperature
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公开(公告)号：JPH0299513A
公开(公告)日：1990-04-11
申请号：JP25358288
申请日：1988-10-06
Applicant: TORAY INDUSTRIES
Inventor： KAYABA KEIJI , TAKUWA SHIRO , TANAKA MASAYUKI
Abstract: PURPOSE:To obtain the title composition consisting of epoxy resin, curing agent, silicon oil, PS based block copolymer and inorganic filler, having excellent heat resistance to solder, reliability, mold release characteristics and solveut resistance and useful for a sealing resin. CONSTITUTION:The aimed composition consisting of (A) an epoxy resin (e.g., cresol novolak type epoxy resin), preferably of 5-25wt.%, (B) curing agent (preferably phenol novolak or cresol novolak), preferably of 2-15wt.%, (C) silicon oil [e.g., a compound expressed by the formula (R1-R5 are H, 1-20C alkyl, phenyl or vinyl; X and Y are 1-20C alkyl, phenyl, vinyl, OH, amino, epoxy, etc.; m is >=1; n is >=0)], (D) a PS based block copolymer, preferably of 1-4wt.% and (E) an inorganic filler (preferably fused silica), preferably of 65-85wt.%.
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公开(公告)号：JPH0288667A
公开(公告)日：1990-03-28
申请号：JP23884588
申请日：1988-09-26
Applicant: TORAY INDUSTRIES
Inventor： KAYABA KEIJI , OKAMOTO MASARU , INOUE SHUNEI
Abstract: PURPOSE:To provide a resin composition composed of two specific kinds of liquid crystal polyesters and having excellent heat-resistance, fluidity and rigidity. CONSTITUTION:The objective composition can be produced by compounding (A) 99-1wt.% of a liquid crystal polyester composed of the structure units of formula I, formula II and formula III (X is group of formula IV, formula V, -CH2CH2-, etc.; the carbonyl groups of the units of formula II and formula III are p- and/or m-position with each other and >=50mol% of the units are p-position) and having a heat-deformation temperature of 190-280 deg.C, especially 190-220 deg.C with (B) 1-99wt.% of a liquid crystal composition composed of the structural units of formula VI (X' is group of formula IV or formula V) and formula VII (Y' is X, group of formula VIII, etc.; the carbonyl groups are p and/or m-position with each other) and having a heat-deformation temperature of =50 deg.C and =70mol% of the group X is -CH2CH2-.
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公开(公告)号：JPH01284547A
公开(公告)日：1989-11-15
申请号：JP11556588
申请日：1988-05-12
Applicant: TORAY INDUSTRIES
Inventor： KAYABA KEIJI , OKAMOTO MASARU , INOUE SHUNEI
Abstract: PURPOSE:To obtain a resin composition having excellent heat resistance, moldability and flow and high mechanical properties, especially, weld strength by mixing a specified liquid crystal polyester with a flaky or particulate filler and a glass fiber. CONSTITUTION:This resin composition comprises 98-20wt.% liquid crystal polyester (A) comprising structural units of formulas I, II and III, having a heat distortion temperature of 190-280 deg.C, an initial liquid crystal temperature
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Patent Agency Ranking
公开(公告)号：JPH01252657A
公开(公告)日：1989-10-09
申请号：JP21503288
申请日：1988-08-31
Applicant: TORAY INDUSTRIES
Inventor： KAYABA KEIJI , OKAMOTO MASARU , INOUE SHUNEI
IPC: C08L67/02 , C08J5/18 , C08L59/00 , C08L59/02 , C08L67/00 , C08L69/00 , C08L71/00 , C08L71/02 , C08L71/12 , C08L73/00 , C08L77/00 , C08L81/00 , C08L81/02 , C08L81/04 , C08L81/06 , D01F6/90 , D01F6/92 , D01F6/94
Abstract: PURPOSE:To provide a resin composition excellent in heat resistance, mechanical properties, flow property, etc., by mixing a specified thermotropic liquid crystal polyester having a heat distortion temperature in a specified range with a thermoplastic resin of a low heat distortion temperature. CONSTITUTION:A thermoplastic liquid crystal polyester of a heat distortion temperature of 190-280 deg.C, comprising structural units of formulas I, II and III (wherein X is a group of formula IV, V, VI, or VII, or -CH2CH2-, and the carbonyl groups in each of formulas II and III are para to each other, and at least 65mol% of them are para) is prepared. 0.1-99wt.% this polyester is mixed with 99.9-1wt.% thermoplastic resin selected from among a polyamide, a polyoxymethylene, a polycarbonate, a polyarylene oxide, a polyalkylene terephthalate, a polyarylene sulfide, a polysulfone, a polyether sulfone, an amorphous polyarylate and a polyether ketone each having a heat distortion temperature of below 190 deg.C. The obtained resin composition can be molded into a film, fiber or the like.
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公开(公告)号：JPS6343918A
公开(公告)日：1988-02-25
申请号：JP18687086
申请日：1986-08-11
Applicant: TORAY INDUSTRIES
Inventor： OTAWA HIDETOSHI , KAYABA KEIJI
Abstract: PURPOSE:To obtain the title composition excellent in heat resistance, mechanial properties and flame retardancy and useful for sealing semiconductor devices, by mixing an epoxy resin with a curing agent and a cyanuric ester of a halogenated bisphenol. CONSTITUTION:A cyanuric halide (a) is reacted with a halogenated bisphenol (b) to obtain a cyanurate (C) of the bisphenol (b) represented by the formula [wherein R are each a (halogeno)alkyl, X is Br or Cl, Y is a (halogeno) alkylene or alkylidene, -SO2-, -SO-, -S-, -O- or -CO-, l and m are each 0-5, l+m =2 and n is 1-50] and having a halogen content >=25wt%. 100pts.wt. epoxy resin (A) having at least two epoxy groups in the molecule is mixed with (B) 0.5-1.5 equivalent, per equivalent of component A, of a curing agent, 3-60pts.wt. component C and, optionally, (D) 0.1-10pts.wt. curing catalyst, 1-30pts.wt. Sb2O3, a flame- retarding aid, a filler and a mold release.
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公开(公告)号：JPS6335616A
公开(公告)日：1988-02-16
申请号：JP17756986
申请日：1986-07-30
Applicant: TORAY INDUSTRIES
Inventor： KAYABA KEIJI , OTAWA HIDETOSHI
Abstract: PURPOSE:To obtain the title composition excellent in heat resistance and mechanical properties and suitable for sealing semiconductors, by mixing an epoxy resin with a curing agent and a halogenated bisphenol polycarbonate oligomer. CONSTITUTION:100pts.wt. epoxy resin (A) having at least two epoxy groups in the molecule and containing at least 50wt% cresol novolak epoxy resin of an epoxy equivalent of, e.g., =25wt%) of formula I or II (wherein X is Br of Cl, R is X, alkyl or aryl, Y is alkylene, alkylidene, CO, O, S or SO2, p is 0-5, m is 1-50 and n is 0-50) as a flame retardant and 1-30pts.wt. Sb2O3 (D) as an optional component at 50-150 deg.C in, e.g., a Banbury mixer.
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公开(公告)号：JPS62169610A
公开(公告)日：1987-07-25
申请号：JP1058186
申请日：1986-01-21
Applicant: TORAY INDUSTRIES
Inventor： KONDO MAKOTO , KAYABA KEIJI , YAMAMOTO YOSHIYUKI
Abstract: PURPOSE:To obtain a polyamide elastomer compression-molded form, excellent in resistance to abrasion and having large spring effect, by a method wherein a polyamide elastomer block is deformed by compression axially more than a specified ratio in the length thereof. CONSTITUTION:A polyamide elastomer, employed in this process, is preferable to be polyether ester amide consisting of amino-carboxylic acid or lactam, having 6 or more of number of carbon atoms, or (a) the salt of diamine, having 6 or more of number of carbon atoms, and dicarboxylic acid, (b) poly(alkylene oxide) glycol having the number-average molecular weight of 300-6,000 and (c) dicarboxylic acid having 4-20 number of carbon atoms. A block, obtained by a method wherein a block of polyamide elastomer is compressed at least 20% in a predetermined axial direction and a stress in the axial direction is removed, is machined into a molding used for the use of a spring, a cushion member, a pad, a shock absorbing member or the like while keeping the configuration thereof or so as to obtain a configuration suitable to the object of the spring, the cushion member, the pad, the shock absorbing member or the like.
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公开(公告)号：JPS6274647A
公开(公告)日：1987-04-06
申请号：JP21516585
申请日：1985-09-30
Applicant: TORAY INDUSTRIES
Inventor： KAYABA KEIJI , KONDO MAKOTO , YAMAMOTO YOSHIYUKI
IPC: F16F15/02 , B32B15/08 , B32B15/085
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