Abstract:
A method of forming a suspended beam in a MEMS process is disclosed. In the process a pit (8) is etched into a substrate (5). Sacrificial material (10) is deposited in the pit (8) and on the surrounding substrate surface. The sacrificial material (10) is then removed from the surrounding substrate surface and from the periphery of the pit (8) so that there is a gap between the sacrificial material and at least two sidewalls of the pit. The sacrificial material is then heated so that it reftows such that the remaining sacrificial material contacts the sidewalls of the pit. Material for the beam (12), which is typically a metal, is then deposited on the substrate surface and the reflowed sacrificial material, and the sacrificial material is then removed to form the suspended beam. The beam could be used as the heating element in an inkjet printer.
Abstract:
A method of removing a polymeric coating from sidewalls of an etched trench defined in a silicon wafer is provided. The method comprises etching the wafer in a biased plasma etching chamber using an O2 plasma. The chamber temperature is in the range of 90 to 180 °C.
Abstract:
Fluidic cartridges, and manufacture thereof, having a plurality of circuit element subtypes containing pneumatically operated diaphragm members, where the diaphragm materials are selected for yield point, chemical resistance, breathability and other properties individually according to the fluidic element subtype are provided. A process of in-situ edge-bonded decoupage for forming diaphragm members inside a cartridge, and fluidic circuits having diaphragm members as active and passive circuit elements, including pumps, valves, vents, waste receptacles, reagent reservoirs, and cuvettes with optical windows, where the material composition of each individual diaphragm member may be selected from an assortment of materials during manufacture are also provided.
Abstract:
We describe a method of layer-by-layer deposition of a plurality of layers of material onto the wall or walls of a channel of a microfluidic device, the method comprising: loading a tube with a series of segments of solution, a said segment of solution bearing a material to be deposited; coupling said tube to said microfluidic device; and injecting said segments of solution into said microfluidic device such that said segments of solution pass, in turn, through said channel depositing successive layers of material to perform said layer-by-layer deposition onto said wall or walls of said channel. Embodiments of the methods are particularly useful for automated surface modification of plastic, for example PDMS (Poly(dimethylsiloxane)), microchannels. We also describe methods and apparatus for forming double-emulsions.
Abstract:
A thermal bend actuator ( 6 ) is provided with a group of upper arms ( 23, 25, 26 ) and a group of lower arms ( 27, 28 ) which are non planar, so increasing the stiffness of the arms. The arms ( 23, 25, 26,27,28 ) may be spaced transversely of each other and do not overly each other in plan view, so enabling all arms to be formed by depositing a single layer of arm forming material
Abstract:
A method is disclosed for forming a chamber (350) in an electronic device (310), including the steps of preparing an outer surface (336) on a solidified core material (334), the solidified core material (334) in a depression (316) formed in a substrate (312). The method further includes establishing a layer (338) on the prepared outer surface (336) of the solidified core material (334) and a portion of the substrate (312) surrounding the depression (316). The established layer (338) and the substrate (312) define a chamber (350).
Abstract:
A thermal bend actuator ( 6 ) is provided with a group of upper arms ( 23, 25, 26 ) and a group of lower arms ( 27, 28 ) which are non planar, so increasing the stiffness of the arms. The arms ( 23, 25, 26,27,28 ) may be spaced transversely of each other and do not overly each other in plan view, so enabling all arms to be formed by depositing a single layer of arm forming material