마이크로 전자기계 시스템 공정에서의 현수형 빔의제조방법
    91.
    发明公开
    마이크로 전자기계 시스템 공정에서의 현수형 빔의제조방법 失效
    在MEMS工艺中制造悬挂梁的方法

    公开(公告)号:KR1020080066781A

    公开(公告)日:2008-07-16

    申请号:KR1020087011016

    申请日:2005-10-10

    Abstract: A method of forming a suspended beam in a MEMS process is disclosed. In the process a pit (8) is etched into a substrate (5). Sacrificial material (10) is deposited in the pit (8) and on the surrounding substrate surface. The sacrificial material (10) is then removed from the surrounding substrate surface and from the periphery of the pit (8) so that there is a gap between the sacrificial material and at least two sidewalls of the pit. The sacrificial material is then heated so that it reftows such that the remaining sacrificial material contacts the sidewalls of the pit. Material for the beam (12), which is typically a metal, is then deposited on the substrate surface and the reflowed sacrificial material, and the sacrificial material is then removed to form the suspended beam. The beam could be used as the heating element in an inkjet printer.

    Abstract translation: 公开了一种在MEMS工艺中形成悬挂梁的方法。 在该过程中,凹坑(8)被蚀刻到衬底(5)中。 牺牲材料(10)沉积在凹坑(8)中和周围的基底表面上。 然后将牺牲材料(10)从周围的衬底表面和凹坑(8)的周边移除,使得在牺牲材料和凹坑的至少两个侧壁之间存在间隙。 然后将牺牲材料加热,使得其牺牲使得剩余的牺牲材料接触凹坑的侧壁。 然后将通常为金属的梁(12)的材料沉积在衬底表面和回流牺牲材料上,然后去除牺牲材料以形成悬挂梁。 该光束可用作喷墨打印机中的加热元件。

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