公开(公告)号：US20080289861A1

公开(公告)日：2008-11-27

申请号：US11910142

申请日：2007-02-14

Applicant: Hyung Wook Lee

Inventor： Hyung Wook Lee

IPC: H05K1/00 ,  B29C65/72

CPC classification number: H05K3/361 ,  H01L2224/48091 ,  H05K1/0393 ,  H05K3/064 ,  H05K3/281 ,  H05K3/323 ,  H05K3/4611 ,  H05K3/4635 ,  H05K3/4691 ,  H05K3/4694 ,  H05K2201/0191 ,  H05K2201/0355 ,  H05K2201/043 ,  H05K2201/09127 ,  H05K2201/09972 ,  H01L2924/00014

Abstract: Disclosed are a multi-layer flexible printed circuit board and a method for manufacturing the same. The multi-layer flexible printed circuit board includes an adhesion sheet from which a pressing and heating area is cut, an upper base layer, from which the pressing and heating area is cut, on the adhesion sheet, and a lower base layer under to the adhesion sheet.

Abstract translation: 公开了一种多层柔性印刷电路板及其制造方法。 多层柔性印刷电路板包括：加压区域被切割的粘合片，粘合片上的加压区域被切割的上基层和下基层 粘合片。

公开(公告)号：US20080266822A1

公开(公告)日：2008-10-30

申请号：US11948526

申请日：2007-11-30

Applicant: YING-CHENG WU ,  KUN-HSIAO LIU

Inventor： YING-CHENG WU ,  KUN-HSIAO LIU

IPC: H05K1/18 ,  H05K1/16 ,  H05K3/30

CPC classification number: H05K1/183 ,  H05K1/141 ,  H05K3/284 ,  H05K3/3442 ,  H05K3/4611 ,  H05K3/4697 ,  H05K2201/043 ,  Y10T29/49128 ,  Y10T29/4913

Abstract: An electronic elements carrier includes a body, at least an electronic element and a filler. The body includes a substrate having a plate and a dam formed on the peripheral of plate, a conductive layer mounted on a surface of the dam, and at least a cavity defined by the plate and the dam of the substrate. The electronic element is disposed in the cavity of the body. The filler is received in the cavity of the substrate for encapsulating, sealing and protecting the electronic element.

Abstract translation: 电子元件载体包括主体，至少电子元件和填充物。 主体包括具有板和形成在板的周边上的坝的基板，安装在坝的表面上的导电层和至少由板和基板的坝限定的空腔。 电子元件设置在身体的空腔中。 填料被接收在衬底的空腔中，用于封装，密封和保护电子元件。

公开(公告)号：US07321164B2

公开(公告)日：2008-01-22

申请号：US11294842

申请日：2005-12-05

Applicant: Shih-Ping Hsu

Inventor： Shih-Ping Hsu

IPC: H01L23/02 ,  H01L23/34

CPC classification number: H01L23/5389 ,  H01L24/24 ,  H01L24/45 ,  H01L24/48 ,  H01L24/82 ,  H01L25/105 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H05K1/185 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/043 ,  H05K2201/10515 ,  H05K2201/10674 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A stack structure with semiconductor chips embedded in carriers comprises two carriers stacking together as a whole, at least two semiconductor chips having active surfaces with electrode pads and inactive surfaces corresponding thereto placed in the cavities of the carriers, at least one dielectric layer formed on the active surface of the semiconductor chip and the surface of the carrier, at least a conductive structure formed in the opening of the dielectric layer, and at least a circuit layer formed on the surface of the dielectric layer wherein the circuit layer is electrically connected to the electrode pad by the conductive structure, so as to form a three-dimensional module to increase the storage capacity dramatically and integrate the semiconductor chips in the carriers for efficiently reducing the size of the module, so that the combinations can be changed flexibly to form the required storage capacity according to the demands.

Abstract translation: 具有嵌入在载体中的半导体芯片的堆叠结构包括两个整体堆叠在一起的载体，至少两个具有活性表面的半导体芯片，电极焊盘和与之对应的非活性表面放置在载体的空腔中，至少一个介电层形成在 半导体芯片的活性表面和载体的表面，至少形成在电介质层的开口中的导电结构，以及至少形成在电介质层的表面上的电路层，其中电路层电连接到 通过导电结构形成三维模块，从而显着提高存储容量，并将半导体芯片集成在载体中，以有效降低模块的尺寸，从而可以灵活更改组合，形成 所需存储容量根据需求。

公开(公告)号：US20060102386A1

公开(公告)日：2006-05-18

申请号：US11252540

申请日：2005-10-19

Applicant: Shinji Morimoto ,  Kouji Nakashima ,  Toyokazu Yoshino ,  Katsuya Okamoto

Inventor： Shinji Morimoto ,  Kouji Nakashima ,  Toyokazu Yoshino ,  Katsuya Okamoto

IPC: H05K1/16

CPC classification number: H05K3/4635 ,  H05K1/0393 ,  H05K3/386 ,  H05K3/4046 ,  H05K3/4084 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/462 ,  H05K3/4623 ,  H05K2201/0195 ,  H05K2201/0221 ,  H05K2201/0379 ,  H05K2201/043 ,  H05K2201/096 ,  H05K2201/10234 ,  H05K2201/10416 ,  H05K2203/0278 ,  H05K2203/041 ,  H05K2203/082 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49153 ,  Y10T29/49165

Abstract: A multi-layered flexible print circuit board comprising an insulating layer, a circuit layer formed on the front and back surfaces of the insulating layer and a hole connecting between the circuit layers via the insulating layer, wherein there is provided an electrically-conductive member having a metal layer formed thereon at least on the surface thereof which is press-fitted into the hole to electrically conduct the circuit layer.

Abstract translation: 一种多层柔性印刷电路板，包括绝缘层，形成在绝缘层的前表面和后表面上的电路层和经由绝缘层连接在电路层之间的孔，其中设置有导电构件，其具有 至少在其表面上形成有金属层，该金属层压配合到孔中以导电电路层。

公开(公告)号：US06910637B2

公开(公告)日：2005-06-28

申请号：US10683838

申请日：2003-10-09

Applicant: Jackson Hsieh ,  Jichen Wu ,  Abnet Chen

Inventor： Jackson Hsieh ,  Jichen Wu ,  Abnet Chen

IPC: G06K19/02 ,  G06K19/077 ,  H05K1/02 ,  H05K1/14 ,  H05K3/28 ,  G06K19/06

CPC classification number: G06K19/0773 ,  G06K19/02 ,  G06K19/077 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/0206 ,  H05K1/144 ,  H05K3/0061 ,  H05K3/284 ,  H05K2201/043 ,  H01L2924/00014

Abstract: A stacked small memory card includes an upper memory card and a lower memory card, the upper memory card and the lower memory card respectively formed a first heat sink and a second heat sink, the first heat sink and the second heat sink are stacked together, so that, the heat of the upper memory card and the lower memory card may be dispersed via the first heat sink and the second heat sink. Thus, the stacked small memory card of present invention having high function of disperses heat to promote its durability and lifetime effectively.

Abstract translation: 堆叠式小存储卡包括上存储卡和下存储卡，上存储卡和下存储卡分别形成第一散热器和第二散热器，第一散热器和第二散热器堆叠在一起， 使得上存储卡和下存储卡的热量可以经由第一散热器和第二散热器分散。 因此，本发明的堆叠式小型存储卡具有高散热功能，有效地提高了其耐久性和寿命。

公开(公告)号：US06818837B2

公开(公告)日：2004-11-16

申请号：US10263185

申请日：2002-10-03

Applicant: Mitsutoshi Okami

Inventor： Mitsutoshi Okami

IPC: H05K116

CPC classification number: H05K3/445 ,  H05K1/0219 ,  H05K1/144 ,  H05K3/0061 ,  H05K3/3447 ,  H05K3/368 ,  H05K3/4046 ,  H05K2201/043 ,  H05K2201/09809 ,  H05K2201/10287 ,  H05K2201/10303 ,  H05K2201/10371

Abstract: A transmitter includes an RF board having a circuit for processing high frequency signals, an IF board having a circuit for processing intermediate frequency signals, a shield plate formed of a conductive material arranged between the boards for shielding electromagnetic waves generated from the circuits, a board-to-board connecting wire inserted to a through hole based by a gap sufficient to avoid electric influence from an inner wall surface of the through hole provided in the shield plate, to be connected to through hole lands provided on the RF board and a IF board, respectively, and connectors formed of an insulating material and attached near opposite ends of the board-to-board connecting wire and sandwiching the shield plate, for fixing the board-to-board connecting wire to the shield plate. This provides a wiring connection structure that facilitates connection between circuit boards with each other and stably realizes normal signal transmission.

Abstract translation: 发射机包括具有用于处理高频信号的电路的RF板，具有用于处理中频信号的电路的IF板，由布置在板之间的导电材料形成的屏蔽板，用于屏蔽从电路产生的电磁波;板 基板连接线以足够的间隙插入到通孔中，该间隙足以避免来自设在屏蔽板上的通孔的内壁表面的电力影响，以连接到设置在RF板上的通孔焊盘和IF 以及由绝缘材料形成并且连接在板对板连接线的相对端并夹持屏蔽板的连接器，用于将板对板连接线固定到屏蔽板。 这提供了一种有助于电路板彼此连接并且稳定地实现正常信号传输的布线连接结构。

公开(公告)号：US20040218367A1

公开(公告)日：2004-11-04

申请号：US10824090

申请日：2004-04-14

Inventor： Wen-Yen Lin ,  Tsan-Nan Chien ,  Chun-Wen Pai

IPC: H05K007/20

CPC classification number: H05K7/20509 ,  H05K1/0203 ,  H05K1/144 ,  H05K1/148 ,  H05K2201/043

Abstract: A function module with a built-in heat dissipation fin. The function module includes a first circuit board, a second circuit board, and a heat dissipation fin. The first circuit board includes a first surface with a first ground layer formed thereon. The second circuit board is coupled to the first circuit board, and includes a second surface facing the first surface. A second ground layer is formed on the second surface. The heat dissipation fin is disposed between the first circuit board and the second circuit board, and abuts the first ground layer and the second ground layer respectively.

Abstract translation: 具有内置散热片的功能模块。 功能模块包括第一电路板，第二电路板和散热片。 第一电路板包括其上形成有第一接地层的第一表面。 第二电路板耦合到第一电路板，并且包括面向第一表面的第二表面。 在第二表面上形成第二接地层。 散热翅片设置在第一电路板和第二电路板之间，分别邻接第一接地层和第二接地层。

公开(公告)号：US3060076A

公开(公告)日：1962-10-23

申请号：US68729157

申请日：1957-09-30

Applicant: AUTOMATED CIRCUITS INC

Inventor： ROBINSON THOMAS L

IPC: H05K1/03 ,  H05K3/00 ,  H05K3/20 ,  H05K3/28 ,  H05K3/42 ,  H05K3/46

CPC classification number: H05K3/4617 ,  H05K1/036 ,  H05K3/005 ,  H05K3/007 ,  H05K3/205 ,  H05K3/28 ,  H05K3/421 ,  H05K2201/0394 ,  H05K2201/043 ,  H05K2201/09509 ,  H05K2201/09527 ,  H05K2201/096 ,  H05K2203/0108 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/1572 ,  Y10S425/811 ,  Y10T29/49126 ,  Y10T156/1056 ,  Y10T156/108

公开(公告)号：US12058807B2

公开(公告)日：2024-08-06

申请号：US17799917

申请日：2021-11-16

Applicant: Chengdu BOE Optoelectronics Technology Co., Ltd. ,  BOE Technology Group Co., Ltd.

Inventor： Qianlin Pu ,  Fei Li ,  Zijian Wang ,  Xu Lu

IPC: H05K1/02 ,  H05K1/14

CPC classification number: H05K1/0218 ,  H05K1/028 ,  H05K1/144 ,  H05K2201/043

Abstract: A circuit board and an electronic device, the circuit board includes a first wiring board including a first substrate and a first wiring layer disposed on a first side surface of the first substrate, and the first wiring layer includes a first ground wiring; the circuit board further includes a first protective layer and a first electromagnetic interference shielding layer sequentially stacked on a side of the first wiring layer away from the first substrate; the first protective layer has a first opening exposing at least a portion of a first ground wiring, the first opening is filled with a first conductive material, height difference between a surface of the first conductive material and a surface of the first protective layer away from the first substrate ranges from 0 to 2 microns, and the first conductive material connects the first electromagnetic interference shielding layer to the first grounding wiring.

公开(公告)号：US09823703B2

公开(公告)日：2017-11-21

申请号：US14626723

申请日：2015-02-19

Applicant: Google Inc.

Inventor： Paul Eremenko ,  Ara Knaian ,  Seth Newburg ,  David Fishman

IPC: H05K7/00 ,  G06F1/16 ,  H04W88/02 ,  H04M1/02 ,  H05K1/11 ,  H05K1/14 ,  H01L23/48

CPC classification number: G06F1/1658 ,  G06F1/1684 ,  H04M1/0254 ,  H04M1/0274 ,  H04W88/02 ,  H05K1/144 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/043 ,  H05K2201/044

Abstract: Examples herein include modules and connections for modules to couple to a computing device. An example module includes a housing comprising an end to couple to a computing device, multiple capacitive pads that each include data contacts to enable data transfer, a power contact pad to provide or receive power, and a ground contact pad to couple to ground. The ground contact pad is larger in size than the power contact pad, and the ground contact pad is positioned closer than the power contact pad to the end of the housing configured to couple to the computing device.