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    반도체 패키지 및 그 제조 방법
    91.
    发明公开
    반도체 패키지 및 그 제조 방법 无效
    半导体器件的制造和制造半导体器件的方法

    公开(公告)号：KR1020090108954A

    公开(公告)日：2009-10-19

    申请号：KR1020080034318

    申请日：2008-04-14

    Applicant: 삼성전자주식회사

    Inventor： 한성찬 ,  양진규 ,  이동춘 ,  천광호

    IPC: H01L21/60 ,  H01L23/48

    CPC classification number: H05K1/112 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/15311 ,  H05K3/3436 ,  H05K3/429 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09572 ,  H05K2201/10666 ,  H05K2203/0455 ,  Y02P70/613

    Abstract: PURPOSE: A semiconductor package is provided to reduce the damage of the solder ball caused by the external shock. CONSTITUTION: A semiconductor package includes substrates(110,120) and a connection terminal(130). The substrate has socket portions. The connection terminals have the solder ball and the supporting part. The solder ball is located on the top of the substrate. The supporting part supports the solder ball by being inserted into the socket portion and extended from the solder ball. The socket portion includes a depression or a hole. The depression is defined by the side wall and the bottom part. The hole passes through the substrate. The substrate is the multilayer board in which the insulating layer and the inner wire are repeated or the printed circuit board which has the inner wire.

    Abstract translation: 目的：提供半导体封装，以减少由外部冲击引起的焊球的损坏。 构成：半导体封装包括衬底（110,120）和连接端子（130）。 基板具有插座部分。 连接端子具有焊球和支撑部。 焊球位于基板的顶部。 支撑部分通过插入插座部分并从焊球延伸来支撑焊球。 插座部分包括凹陷或孔。 凹陷由侧壁和底部限定。 孔穿过衬底。 衬底是重复绝缘层和内部电线的多层板或具有内部电线的印刷电路板。

    방열층을 갖는 배선기판 및 그를 이용한 반도체 패키지
    93.
    发明公开
    방열층을 갖는 배선기판 및 그를 이용한 반도체 패키지 失效
    具有加热层的基板和使用该散热层的半导体封装

    公开(公告)号：KR1020070010915A

    公开(公告)日：2007-01-24

    申请号：KR1020050065905

    申请日：2005-07-20

    Applicant: 삼성전자주식회사

    Inventor： 조상귀

    IPC: H01L23/36

    CPC classification number: H05K1/0206 ,  H01L23/36 ,  H01L23/3677 ,  H01L23/3735 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15321 ,  H01L2924/15787 ,  H01L2924/181 ,  H05K2201/09572 ,  H05K2203/049 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

    Abstract: An interconnection substrate having a heat radiation layer is provided to effectively radiate the heat generated from a semiconductor chip to the outside while minimizing a thickness increase of a semiconductor package by forming a heat radiation layer on a second surface of an interconnection substrate wherein the second surface is opposite to a first surface on which a semiconductor chip is mounted and by interconnecting a chip mounting region with a heat radiation layer by a heat pipe. A substrate body(110) has a first surface(112) on which a semiconductor chip is mounted and a second surface(114) confronting the first surface. A metal layer(120) is formed on both surfaces of the substrate body. An interconnection layer(121) includes a chip mounting region(122) formed in the center of the first surface, a plurality of substrate pads(123) formed on the circumference of the chip mounting region, and a terminal pad(124) respectively connected to the substrate pads. A metal layer has a heat radiation layer(125) formed on the entire surface of the second surface. A plurality of heat pipes(130) penetrate the substrate body to connect the chip mounting region with the heat radiation layer. In the heat pipe, a thermal conductive material is filled in a through hole penetrating the substrate body.

    Abstract translation: 提供具有散热层的互连基板，以通过在互连基板的第二表面上形成散热层来最小化半导体封装的厚度增加，从而有效地将从半导体芯片产生的热辐射到外部，其中第二表面 与其上安装半导体芯片的第一表面相对，并且通过热管将芯片安装区域与散热层互连。 基板主体（110）具有安装有半导体芯片的第一表面（112）和面对第一表面的第二表面（114）。 金属层（120）形成在基板主体的两个表面上。 互连层（121）包括形成在第一表面的中心的芯片安装区域（122），形成在芯片安装区域的圆周上的多个基板焊盘（123）和分别连接 到基板焊盘。 金属层具有形成在第二表面的整个表面上的散热层（125）。 多个热管（130）穿透基板主体以将芯片安装区域与散热层连接。 在热管中，导热材料填充在贯穿基体的通孔中。

    Heat dissipating assembly
    96.
    发明公开
    Heat dissipating assembly 审中-公开
    散热装置

    公开(公告)号：EP2388812A2

    公开(公告)日：2011-11-23

    申请号：EP10013354.5

    申请日：2010-10-06

    Applicant: Sunonwealth Electric Machine Industry Co., Ltd.

    Inventor： Horng, Alex ,  Kuo, Chi-Hung ,  Chung, Chih-Hao

    IPC: H01L23/367 ,  H01L21/50

    CPC classification number: H01L23/3677 ,  F21V29/673 ,  F21Y2115/10 ,  H01L21/50 ,  H01L33/642 ,  H01L2924/0002 ,  H05K1/0206 ,  H05K2201/09572 ,  H05K2201/10106 ,  H05K2201/10969 ,  H01L2924/00

    Abstract: A heat dissipating assembly includes a circuit board (1) having opposite first and second faces (11, 12). The circuit board (1) further includes a through-hole (13) extending from the first face (11) through the second face (12). A heat generating element (2) is mounted on the first face (11) of the circuit board (1) and electrically coupled to the circuit board (1). The heat generating element (2) includes a heat conducting portion (22) aligned with the through-hole (13). A heat dissipating unit (3) includes a base (31) having an engaging face (311) in contact with the second face (12) of the circuit board (1). A heat conducting adhesive (4) is filled in the through-hole (13). The heat conducting adhesive (4) is engaged with the engaging face (311) of the base (31) and the heat conducting portion (22) of the heat generating element (2). The heat generating element (2) is directly engaged with the heat dissipating unit (3) by the heat conducting adhesive (4) to effectively enhance the overall heat dissipating efficiency while reducing the number of members to lower the manufacturing costs.

    A package for power converters with improved transformer operations
    98.
    发明公开
    A package for power converters with improved transformer operations 有权
    用于改进变压器操作的电源转换器封装

    公开(公告)号：EP2166826A3

    公开(公告)日：2010-04-28

    申请号：EP09016073.0

    申请日：1999-05-27

    Applicant: DET International Holding Limited

    Inventor： Jitaru, Ionel

    IPC: H05K1/14 ,  H05K1/16

    CPC classification number: H05K1/165 ,  H01F27/06 ,  H05K1/0203 ,  H05K1/0206 ,  H05K1/05 ,  H05K3/0061 ,  H05K7/209 ,  H05K2201/066 ,  H05K2201/086 ,  H05K2201/09054 ,  H05K2201/09063 ,  H05K2201/09572 ,  H05K2201/09745 ,  H05K2201/10166 ,  Y10T29/49165

    Abstract: An electronic assembly comprising:
    a) an electronic board (234) having an opening therein, said electronic board (234) further including two pads (2552B) positioned on a first surface of said electronic board (234) proximate to said opening;
    b) a multilayer circuit board (232) having secured thereto a transformer, said multilayer circuit board (232) positioned such that a portion of a first surface of said multilayer circuit board (232) engages the first surface of said electronic board (234) such that a portion of a core (2310) of said transformer extends into the opening of said electronic board (234), said multilayer circuit board (232) having at least two channels (2524) there through, each of said channels (2524) aligned with one of said at least two pads (2552B) of said electronic board (234); and
    c) solder (2522) extending through said at least two channels (2524) in said multilayer circuit board (232), said solder (2522) bonded to the channel (2524) and to an associated pad (254B) on said electronic board (234).

    Abstract translation: 一种电子组件，包括：a）其中具有开口的电子板（234），所述电子板（234）还包括位于所述电子板（234）的靠近所述开口的第一表面上的两个垫（2552B） b）具有固定于其上的变压器的多层电路板（232），所述多层电路板（232）定位成使得所述多层电路板（232）的第一表面的一部分接合所述电子板（234）的第一表面， 使得所述变压器的芯部（2310）的一部分延伸到所述电子板（234）的开口中，所述多层电路板（232）具有穿过其中的至少两个通道（2524），每个所述通道（2524） 与所述电子板（234）的所述至少两个焊盘（2552B）中的一个对齐; 以及c）延伸穿过所述多层电路板（232）中的所述至少两个通道（2524）的焊料（2522），所述焊料（2522）结合到所述沟道（2524）并且结合到所述电子板上的相关焊盘（254B） （234）。

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