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    Semiconductor device with surface mount package adapted for vertical mounting
    91.
    发明授权
    Semiconductor device with surface mount package adapted for vertical mounting 失效
    具有适用于垂直安装的表面贴装封装的半导体器件

    公开(公告)号：US5451815A

    公开(公告)日：1995-09-19

    申请号：US215614

    申请日：1994-03-22

    Applicant: Norio Taniguchi ,  Kazuto Tsuji ,  Junichi Kasai ,  Michio Sono

    Inventor： Norio Taniguchi ,  Kazuto Tsuji ,  Junichi Kasai ,  Michio Sono

    IPC: H01L23/04 ,  H01L23/12 ,  H01L23/498 ,  H05K3/30 ,  H05K3/34 ,  H01L23/48

    CPC classification number: H05K3/303 ,  H01L23/49811 ,  H01L23/49833 ,  H01L23/49838 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K2201/09781 ,  H05K2201/10454 ,  H05K2201/10568 ,  H05K2201/10659 ,  H05K2201/10696 ,  H05K3/3426 ,  Y02P70/613

    Abstract: A semiconductor device includes vertical placement part for mounting the semiconductor device on a surface of a circuit board in a vertical position, and a connection part for making electrical connections between the circuit board and a semiconductor element. A stage is provided on which the semiconductor element is placed. The stage has supporting members causing the semiconductor device to vertically stand on the circuit board. Wiring boards, stacked on a side of the stage on which the semiconductor element is placed, have windows in which the semiconductor element is located. The vertical placement part includes wiring lines extending between edges of the wiring boards facing the circuit board and peripheries of the windows. The wiring lines have ends located in the vicinity of the edges of the wiring boards and have a shape enabling the semiconductor device to be mounted on the circuit board.

    Abstract translation: 半导体器件包括用于将半导体器件安装在垂直位置的电路​​板的表面上的垂直放置部分和用于在电路板和半导体元件之间进行电连接的连接部分。 提供放置半导体元件的平台。 舞台具有使半导体器件垂直站立在电路板上的支撑构件。 堆叠在其上放置半导体元件的台的一侧的布线板具有半导体元件所在的窗口。 垂直放置部分包括在布线板的面向电路板的边缘和窗口的周边之间延伸的布线。 布线具有位于布线板的边缘附近的端部，并且具有能够将半导体器件安装在电路板上的形状。

    Gull-wing zig-zag inline lead package having end-of-package anchoring pins
    92.
    再颁专利
    Gull-wing zig-zag inline lead package having end-of-package anchoring pins 失效
    鸥翼形Z字形在线导线封装，具有封装端锚固销

    公开(公告)号：USRE34794E

    公开(公告)日：1994-11-22

    申请号：US10022

    申请日：1993-01-28

    Applicant: Warren M. Farnworth

    Inventor： Warren M. Farnworth

    IPC: H01L23/495 ,  H01L25/10 ,  H05K1/18 ,  H05K3/30 ,  H01L39/02 ,  H01L23/16 ,  H01L23/42 ,  H01L23/44

    CPC classification number: H05K1/181 ,  H01L23/49555 ,  H01L25/105 ,  H05K3/303 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2225/1076 ,  H01L2924/0002 ,  H05K2201/09709 ,  H05K2201/10454 ,  H05K2201/10522 ,  H05K2201/10545 ,  H05K2201/10568 ,  H05K2201/10696 ,  H05K2203/1572 ,  H05K2203/167 ,  Y02P70/611 ,  Y02P70/613

    Abstract: A semiconductor package having a gull-wing, zig-zag, inline-lead configuration and end-of-package anchoring devices for rigidly affixing the package to a circuit board such that each lead is in compressibe contact with its associated mounting pad on the board. The anchoring devices of a first embodiment comprise anchoring pins having fish-hook-type barbs which lock against the under side of the board when the pegs are inserted through holes in the board; a second embodiment utilizes anchoring pins which are adhesively bonded in recesses that have been drilled or molded into the board; a third embodiment utilizes anchoring pins, the ends of which can be bonded directly to planar peg-bonding regions on the surface of the board; and a fourth utilizes tapered anchoring ping which may be inserted with an interference fit into holes in the board. The invention eliminates the need for mechanical support of the packages during solder reflow operations used during board assembly and repair.

    Abstract translation: 一种半导体封装，具有鸥翼，锯齿形，在线引线配置和封装终端固定装置，用于将封装刚性地固定到电路板上，使得每个引线与板上相关联的安装垫压缩接触 。 第一实施例的锚固装置包括具有鱼钩型倒钩的锚定销，当钉通过板中的孔插入时，锁钩相对于板的下侧锁定; 第二实施例利用粘结在已经钻孔或模制到板中的凹槽中的锚定销; 第三实施例使用锚定销，其端部可以直接地接合到板的表面上的平面钉接合区域; 并且第四种使用锥形锚定平面，其可以以过盈配合插入板中的孔中。 本发明消除了在电路板组装和修理期间使用的焊料回流操作期间对包装的机械支撑的需要。

    Method of fabricating a vertically mountable IC package
    97.
    发明申请
    Method of fabricating a vertically mountable IC package 失效
    制造垂直安装IC封装的方法

    公开(公告)号：US20070090529A1

    公开(公告)日：2007-04-26

    申请号：US11250687

    申请日：2005-10-14

    Applicant: Daniel McCarthy ,  Lakshman Withanawasam

    Inventor： Daniel McCarthy ,  Lakshman Withanawasam

    IPC: H01L23/48

    CPC classification number: H01L23/3121 ,  H01L21/4846 ,  H01L23/49805 ,  H01L25/105 ,  H01L2224/48247 ,  H01L2225/1005 ,  H01L2225/1023 ,  H01L2225/1064 ,  H05K3/3442 ,  H05K2201/10454 ,  H05K2201/10696 ,  Y02P70/613

    Abstract: A method of fabricating a vertically mountable integrated circuit (IC) package is presented. An integrated circuit is mounted on a printed circuit board (PCB) and electrically coupled to a bond pad on the PCB. The bond pad is coupled with a via that is embedded in the PCB. The IC, the bond pad, the via, and a portion of the PCB are singulated in order to create a vertically mountable IC package. The via is cut through cross-sectionally during singulation so as to expose a portion of the via and thereby provide a mountable area for the IC package. The IC package may be encapsulated or housed in a dielectric material. In addition, the via may be treated with a preservative or other suitable electroless metal plating deposition that prevents oxidation and promotes solderability.

    Abstract translation: 提出了制造可垂直安装的集成电路（IC）封装的方法。 集成电路安装在印刷电路板（PCB）上并电耦合到PCB上的接合焊盘。 接合焊盘与嵌入在PCB中的通孔耦合。 将IC，接合焊盘，通孔和PCB的一部分分开以形成可垂直安装的IC封装。 在分割期间通孔横截面切割，以便露出通孔的一部分，从而为IC封装提供可安装区域。 IC封装可以封装或容纳在电介质材料中。 此外，通孔可以用防腐剂或其它合适的无电金属电镀沉积进行处理，防止氧化并促进可焊性。

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