Abstract:
반도체소자의 스프터링 증착방법 및 이에 사용되는 스퍼터링 장치가 개시되어 있다. 반응성 가스를 기판 상부에서 기판 표면으로 직접 분사시키고, 상기 반응 가스를 기판 하부에서 하향 배기시키는 것을 특징으로 하는 스퍼터링 증착 방법 및 이에 사용되는 스퍼터링 장치를 제공한다. 본 발명에 의하면, 질소가스가 기판 위로 바로 투입되어 반응에 참여하게 되고, 미반응 가스는 바로 기판 하부로 하향배기 되기 때문에 미반응 가스에 의해 타겟 표면이 질화되는 것을 크게 감소시켜 종래의 스퍼터링 장치에 비해 증착속도를 크게 향상시킬 수 있으므로 제조공정시간 및 제조원자를 감소시킬 수 있다.
Abstract:
본 발명은 반도체 웨이퍼 세정장치에 관한하여 기술한다. 본 발명 의 세정장치는, 세정조에 펌프가 마련된 세정액 순환경로가 설치되고, 상기 순환 경로상의 광통과가 허용되는 부위의 일측에는 순환중인 세정액의 농도를 검지하는 광학적 검지부가 마련되고, 그리고, 상기 광학적 검지부로부터의 신호를 연산하여 세정액의 농도 또는 공급량을 연산하는 연산장치가 마련되는 구조를 가진다. 이러한 본 발명 세정장치는 세정액의 농도를 실시한 측정할 수 있다는 점에 그 특징이 있는 것으로서, 종래 레벨센서등의 오동작에 의한 농도의 오측정에 의한 문제점을 개선할 수 있어서, 세정공정중 웨이퍼 세정의 안정성을 확보하여 세정 잘못에 의한 웨이퍼의 불량화를 방지할 수 있다.
Abstract:
An image sensor includes photodetectors, and trench isolations which separate photodetectors, respectively. Each of the trench isolations includes films which have multilayer structures.
Abstract:
In an image sensor and a method of manufacturing the same, a semiconductor layer includes a first surface, a second surface opposite to the first surface, and a photodiode in the first surface. An anti-reflection layer of crystallizability for hydrogen penetration is formed on the semiconductor layer of the first surface. A hydrogen containing region including hydrogens combined with the defect part of the surface of the semiconductor layer, is formed in the semiconductor layer of the first surface. Driving transistors and a line are formed in the semiconductor layer of the second surface. A color filter and a micro lens are formed on the anti-reflection layer. The image sensor reduces a dark current and improves a white point phenomenon.
Abstract:
A FinFET and a method of manufacturing the same are provided to prevent effectively threshold voltage drop generated in a device which has an oxide layer having the same thickness at the upper part and a side part of a fin, and to prevent the deterioration of an electrical property. A semiconductor fin(210) is formed, including an upper part plane and a side plane which have different crystal planes respectively. A first gate insulating layer(250a) is formed at the side plane of the semiconductor fin, and a second insulating layer(250b) which is thicker than the first gate insulating layer is formed at the upper part plane. A gate electrode is formed on the first and second gate insulating layers.
Abstract:
An image sensor having a backside illumination structure and a method for manufacturing the same are provided to maximize saturation of a light receiving region by forming a structure of a photodiode including a transistor. A photodiode unit(100) includes a photodiode(120) and a transfer gate transistor(140) which are formed on a first wafer(110). A wiring line unit(200) includes a signal processing and control transistor(220) and a wiring line(230) which are formed on a second wafer(210). The second wafer is bonded with an upper part of the photodiode unit. A supporting substrate(300) is bonded with an upper part of the wiring line unit. A filter unit(400) is formed at a lower part of the first wafer. The second wafer is formed by performing a hydrogen implantation process. The wiring line unit is formed by installing the signal processing and control transistor and the wiring line on the residual part of the second wafer after a smart-cut process for the second wafer.
Abstract:
An image sensor and its manufacturing method are provided to improve photo sensitivity by reflecting and refracting the light in a high reflectivity using a reflective coating composed of a plurality of refractive layers. An image sensor includes a photoelectric transformation element(110) in a substrate(102), a reflective coating, and a microlens. The reflective coating(190) is formed on a surface of the substrate. The reflective coating is formed by stacking first and second refractive layers with each other. The microlens is formed on the other surface of the substrate corresponding to the position of the photoelectric transformation element. The refractive index of the first refractive layer is larger than that of the second refractive layer. The first refractive layer is made of silicon and the second refractive layer is made of silicon oxide.
Abstract:
수광 효율이 향상된 4공유 픽셀 이미지 센서가 제공된다. 4 공유 픽셀 이미지 센서는 열 방향으로 인접하며 독출 소자를 공유하는 4 개의 광전 변환 소자 액티브를 포함하는 4 공유 픽셀의 행렬 및 4 공유 픽셀당 2개씩 할당되며 광전 변환 소자 액티브와 분리되어 배열된 다수의 독립 독출 소자 액티브를 포함한다. 이미지 센서, 수광 효율, 4공유 픽셀
Abstract:
A 2 shared pixel image sensor with improved light receiving efficiency and a manufacturing method therefor are provided to optically and repeatedly receive light in photoelectric conversion elements arranged as an array type irrespective of a position. A matrix of 2 shared pixels includes two photoelectric conversion element actives, adjacent to a column direction, which share a read element. A plurality of independent read element actives are assigned per the 2 shared pixels by 1, and are separated from the photoelectric conversion element actives. Long sides of the independent read element actives are oriented in the column direction in a cross area of an inter-column space and an inter-row space of the matrix.