公开(公告)号：JP4541141B2

公开(公告)日：2010-09-08

申请号：JP2004510011

申请日：2003-05-14

Applicant: シリコン・ライト・マシーンズ・コーポレイション

Inventor： ハンター，ジェイムス，エイ

IPC: G02B5/18 ,  G02B26/08 ,  G02B26/00 ,  G02F1/00 ,  G02F1/03 ,  G02F1/07 ,  G02F1/13 ,  G02F1/1368 ,  H01L21/00 ,  H01L21/28 ,  H01L21/302 ,  H01L21/82 ,  H01L21/8234 ,  H01L27/06 ,  H01L29/423 ,  H01L29/49 ,  H01L31/153

CPC classification number: G02B26/0808 ,  B81B2201/045 ,  B81B2207/015 ,  B81B2207/07 ,  B81C1/00246 ,  B81C2201/016 ,  B81C2203/0735 ,  B81C2203/0778 ,  H01L27/0611

公开(公告)号：JP2005506910A

公开(公告)日：2005-03-10

申请号：JP2003540075

申请日：2002-09-05

Applicant: ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツングRobert Bosch Gmbh

Inventor： レルマー フランツ

IPC: B81B3/00 ,  B81C1/00 ,  G01C19/5712 ,  G01P15/00 ,  G01C19/56 ,  G01P9/04

CPC classification number: G01C19/5712 ,  B81B3/0086 ,  B81B2201/0242 ,  B81B2203/0136 ,  B81B2203/033 ,  B81C1/00801 ,  B81C2201/0104 ,  B81C2201/016

Abstract: A micromechanical component and a method for producing the component are provided. The micromechanical component includes a substrate and a micromechanical functional layer of a first material provided over the substrate. The functional layer has a first and second regions, which are connected by a third region of a second material, and at least one of the regions is part of a movable structure, which is suspended over the substrate.

公开(公告)号：JP3493068B2

公开(公告)日：2004-02-03

申请号：JP29865594

申请日：1994-12-01

Applicant: ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング

Inventor： オッフェンベルク ミヒャエル

IPC: B81B3/00 ,  G01P15/08 ,  G01P15/125 ,  H01L49/00

CPC classification number: B81B3/0086 ,  B81B3/0035 ,  B81B3/0078 ,  B81B2201/0235 ,  B81B2203/0118 ,  B81B2203/0136 ,  B81C1/00595 ,  B81C2201/0107 ,  B81C2201/0109 ,  B81C2201/016 ,  G01P15/0802 ,  G01P15/125 ,  G01P2015/0814

公开(公告)号：US11905166B2

公开(公告)日：2024-02-20

申请号：US17446898

申请日：2021-09-03

Applicant: Robert Bosch GmbH

Inventor： Heribert Weber ,  Peter Schmollngruber ,  Thomas Friedrich ,  Andreas Scheurle ,  Joachim Fritz ,  Sophielouise Mach

IPC: B81C1/00 ,  B81B3/00 ,  H04R3/00

CPC classification number: B81C1/00158 ,  B81B3/0021 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81C2201/016 ,  B81C2201/0132 ,  H04R3/00

Abstract: A production method for a micromechanical component for a sensor or microphone device. The method includes: patterning a plurality of first trenches through a substrate surface of a monocrystalline substrate made of at least one semiconductor material using anisotropic etching, covering the lateral walls of the plurality of first trenches with a passivation layer, while bottom areas of the plurality of first trenches are kept free or are freed of the passivation layer, etching at least one first cavity, into which the plurality of first trenches opens, into the monocrystalline substrate using an isotropic etching method, in which an etching medium of the isotropic etching method is conducted through the plurality of first trenches, and by covering the plurality of first trenches by epitaxially growing a monocrystalline sealing layer on the substrate surface of the monocrystalline substrate made of the at least one identical semiconductor material as the monocrystalline substrate.

公开(公告)号：US20230312337A1

公开(公告)日：2023-10-05

申请号：US18023904

申请日：2021-09-01

Applicant: 3C PROJECT MANAGEMENT LIMITED

Inventor： Gregory John MCAVOY

IPC: B81B7/02 ,  B41J2/14 ,  H10N30/20 ,  B81C1/00 ,  B41J2/045

CPC classification number: B81C1/00246 ,  B41J2/04581 ,  B41J2/14 ,  B81B7/02 ,  H10N30/20 ,  B81B2201/03 ,  B81B2203/0118 ,  B81B2203/0127 ,  B81B2207/015 ,  B81C2201/0132 ,  B81C2201/016

Abstract: A method of manufacturing a MEMS device, the MEMS device comprising a movable Micro-Electro-Mechanical piezoelectric component and a CMOS circuit configured to be in conductive communication with the Micro-Electro-Mechanical component. A plurality of CMOS circuit layers are formed on a substrate to form the CMOS circuit, the plurality of CMOS circuit layers comprising a plurality of CMOS passivation and metallisation layers. A portion of at least one of the plurality of CMOS passivation and metallisation layers is removed in a component region of the device. One or more component region layers are formed in place of the removed portion in the component region to form the movable Micro-Electro-Mechanical piezoelectric component. The one or more component region layers are different from the portion of the at least one of the plurality of CMOS passivation and metallisation layers.

公开(公告)号：US11708264B2

公开(公告)日：2023-07-25

申请号：US17827437

申请日：2022-05-27

Applicant: SiTime Corporation

Inventor： Pavan Gupta ,  Aaron Partridge ,  Markus Lutz

IPC: B81B7/00 ,  B81C1/00 ,  H10N30/30 ,  H01L23/34 ,  H01L23/498 ,  H01L23/31

CPC classification number: B81B7/0083 ,  B81B7/007 ,  B81B7/0077 ,  B81C1/0023 ,  B81C1/00301 ,  B81C1/00333 ,  B81C1/00341 ,  H01L23/34 ,  H01L23/498 ,  H10N30/302 ,  B81B2201/0271 ,  B81B2207/07 ,  B81B2207/094 ,  B81C2201/016 ,  B81C2203/0118 ,  B81C2203/0154 ,  H01L23/3107 ,  H01L2224/48091 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A low-profile packaging structure for a microelectromechanical-system (MEMS) resonator system includes an electrical lead having internal and external electrical contact surfaces at respective first and second heights within a cross-sectional profile of the packaging structure and a die-mounting surface at an intermediate height between the first and second heights. A resonator-control chip is mounted to the die-mounting surface of the electrical lead such that at least a portion of the resonator-control chip is disposed between the first and second heights and wire-bonded to the internal electrical contact surface of the electrical lead. A MEMS resonator chip is mounted to the resonator-control chip in a stacked die configuration and the MEMS resonator chip, resonator-control chip and internal electrical contact and die-mounting surfaces of the electrical lead are enclosed within a package enclosure that exposes the external electrical contact surface of the electrical lead at an external surface of the packaging structure.

公开(公告)号：US20170029269A1

公开(公告)日：2017-02-02

申请号：US15187748

申请日：2016-06-20

Applicant: SiTime Corporation

Inventor： Pavan Gupta ,  Aaron Partridge ,  Markus Lutz

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0083 ,  B81B7/007 ,  B81B7/0077 ,  B81B2201/0271 ,  B81B2207/07 ,  B81B2207/094 ,  B81C1/0023 ,  B81C1/00301 ,  B81C1/00333 ,  B81C1/00341 ,  B81C2201/016 ,  B81C2203/0118 ,  B81C2203/0154 ,  H01L23/3107 ,  H01L23/34 ,  H01L23/498 ,  H01L2224/48091 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A low-profile packaging structure for a microelectromechanical-system (MEMS) resonator system includes an electrical lead having internal and external electrical contact surfaces at respective first and second heights within a cross-sectional profile of the packaging structure and a die-mounting surface at an intermediate height between the first and second heights. A resonator-control chip is mounted to the die-mounting surface of the electrical lead such that at least a portion of the resonator-control chip is disposed between the first and second heights and wire-bonded to the internal electrical contact surface of the electrical lead. A MEMS resonator chip is mounted to the resonator-control chip in a stacked die configuration and the MEMS resonator chip, resonator-control chip and internal electrical contact and die-mounting surfaces of the electrical lead are enclosed within a package enclosure that exposes the external electrical contact surface of the electrical lead at an external surface of the packaging structure.

Abstract translation: 用于微机电系统（MEMS）谐振器系统的薄型封装结构包括电引线，其具有在封装结构的横截面轮廓内的相应的第一和第二高度处的内部和外部电接触表面，以及模具安装表面 第一和第二高度之间的中间高度。 谐振器控制芯片安装到电引线的管芯安装表面，使得谐振器控制芯片的至少一部分设置在第一和第二高度之间并且引线接合到电气的内部电接触表面 铅。 MEMS谐振器芯片以堆叠的管芯配置安装到谐振器控制芯片，并且电机的谐振器芯片，谐振器控制芯片和内部电接触和管芯安装表面被封装在暴露外部的封装外壳内 电气引线的电接触表面在包装结构的外表面。

公开(公告)号：US20160355398A1

公开(公告)日：2016-12-08

申请号：US14731433

申请日：2015-06-05

Applicant: UNITED MICROELECTRONICS CORPORATION

Inventor： YAN-DA CHEN ,  WENG YI CHEN ,  CHANG-SHENG HSU ,  KUAN-YU WANG ,  YUAN SHENG LIN

IPC: B81C1/00 ,  B81B7/00 ,  B81B3/00

CPC classification number: H01L21/02107 ,  B81B2207/015 ,  B81C1/00801 ,  B81C2201/014 ,  B81C2201/016

Abstract: Provided herein is a semiconductor device is provided. The semiconductor device includes a substrate including a MEMS region and a connection region thereon; a dielectric layer disposed on the substrate in the connection region; a poly-silicon layer disposed on the dielectric layer, wherein the poly-silicon layer serves as an etch-stop layer; a connection pad disposed on the poly-silicon layer; and a passivation layer covering the dielectric layer, wherein the passivation layer includes an opening that exposes the connection pad and a transition region between the connection pad and the passivation layer.

Abstract translation: 本文提供了一种半导体器件。 半导体器件包括：衬底，其包括MEMS区域及其上的连接区域; 设置在所述连接区域中的所述基板上的电介质层; 设置在所述电介质层上的多晶硅层，其中所述多晶硅层用作蚀刻停止层; 设置在所述多晶硅层上的连接焊盘; 以及覆盖所述电介质层的钝化层，其中所述钝化层包括暴露所述连接焊盘的开口和所述连接焊盘与所述钝化层之间的过渡区域。

公开(公告)号：US09371221B2

公开(公告)日：2016-06-21

申请号：US14597825

申请日：2015-01-15

Applicant: SiTime Corporation

Inventor： Pavan Gupta ,  Aaron Partridge ,  Markus Lutz

IPC: H01L23/48 ,  B81B7/00 ,  B81C1/00 ,  H01L23/34 ,  H01L23/498 ,  H01L23/31

CPC classification number: B81B7/0083 ,  B81B7/007 ,  B81B7/0077 ,  B81B2201/0271 ,  B81B2207/07 ,  B81B2207/094 ,  B81C1/0023 ,  B81C1/00301 ,  B81C1/00333 ,  B81C1/00341 ,  B81C2201/016 ,  B81C2203/0118 ,  B81C2203/0154 ,  H01L23/3107 ,  H01L23/34 ,  H01L23/498 ,  H01L2224/48091 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A low-profile packaging structure for a microelectromechanical-system (MEMS) resonator system includes an electrical lead having internal and external electrical contact surfaces at respective first and second heights within a cross-sectional profile of the packaging structure and a die-mounting surface at an intermediate height between the first and second heights. A resonator-control chip is mounted to the die-mounting surface of the electrical lead such that at least a portion of the resonator-control chip is disposed between the first and second heights and wire-bonded to the internal electrical contact surface of the electrical lead. A MEMS resonator chip is mounted to the resonator-control chip in a stacked die configuration and the MEMS resonator chip, resonator-control chip and internal electrical contact and die-mounting surfaces of the electrical lead are enclosed within a package enclosure that exposes the external electrical contact surface of the electrical lead at an external surface of the packaging structure.

Abstract translation: 用于微机电系统（MEMS）谐振器系统的薄型封装结构包括电引线，其在封装结构的横截面轮廓内的相应的第一和第二高度处具有内部和外部电接触表面，并且模具安装表面 第一和第二高度之间的中间高度。 谐振器控制芯片安装到电引线的管芯安装表面，使得谐振器控制芯片的至少一部分设置在第一和第二高度之间并且引线接合到电气的内部电接触表面 铅。 MEMS谐振器芯片以堆叠的管芯配置安装到谐振器控制芯片，并且电机的谐振器芯片，谐振器控制芯片和内部电接触和管芯安装表面被封装在暴露外部的封装外壳内 电气引线的电接触表面在包装结构的外表面。

公开(公告)号：US20150035090A1

公开(公告)日：2015-02-05

申请号：US14191978

申请日：2014-02-27

Applicant: SiTime Corporation

Inventor： Pavan Gupta ,  Aaron Partridge ,  Markus Lutz

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0083 ,  B81B7/007 ,  B81B7/0077 ,  B81B2201/0271 ,  B81B2207/07 ,  B81B2207/094 ,  B81C1/0023 ,  B81C1/00301 ,  B81C1/00333 ,  B81C1/00341 ,  B81C2201/016 ,  B81C2203/0118 ,  B81C2203/0154 ,  H01L23/3107 ,  H01L23/34 ,  H01L23/498 ,  H01L2224/48091 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: In a packaging structure for a microelectromechanical-system (MEMS) resonator system, a resonator-control chip is mounted on a lead frame having a plurality of electrical leads, including electrically coupling a first contact on a first surface of the resonator-control chip to a mounting surface of a first electrical lead of the plurality of electrical leads through a first electrically conductive bump. A MEMS resonator chip is mounted to the first surface of the resonator-control chip, including electrically coupling a contact on a first surface of the MEMS resonator chip to a second contact on the first surface of the resonator-control chip through a second electrically conductive bump. The MEMS resonator chip, resonator-control chip and mounting surface of the first electrical lead are enclosed within a package enclosure that exposes a contact surface of the first electrical lead at an external surface of the packaging structure.

Abstract translation: 在微机电系统（MEMS）谐振器系统的封装结构中，谐振器控制芯片安装在具有多个电引线的引线框架上，包括将谐振器控制芯片的第一表面上的第一触点电耦合到 所述多个电引线中的第一电引线的安装表面通过第一导电凸块。 MEMS谐振器芯片安装在谐振器控制芯片的第一表面上，包括将MEMS谐振器芯片的第一表面上的触点与谐振器控制芯片的第一表面上的第二触点电耦合通过第二导电 磕碰。 MEMS谐振器芯片，谐振器控制芯片和第一电引线的安装表面封装在封装外壳内，该封装外壳暴露出封装结构的外表面处的第一电引线的接触表面。