公开(公告)号：US06875367B2

公开(公告)日：2005-04-05

申请号：US10696075

申请日：2003-10-28

Applicant: George Hsieh ,  Terrance J. Dishongh ,  Norman J. Armendariz ,  David V. Spaulding

Inventor： George Hsieh ,  Terrance J. Dishongh ,  Norman J. Armendariz ,  David V. Spaulding

IPC: C03C10/02 ,  H05K3/32 ,  H01B1/20 ,  H01L29/43 ,  H01L35/24 ,  C23C38/00

CPC classification number: H05K3/321 ,  H05K2201/0248 ,  H05K2201/083 ,  H05K2201/10636 ,  H05K2203/104 ,  Y02P70/611 ,  Y10T428/2852 ,  Y10T428/2896 ,  Y10T428/32

Abstract: Coupling components to an underlying substrate using a composition of a polymer and magnetic material particles. Upon applying the composition between the component and the printed circuit board, the composition may be subjected to a magnetic field to align the magnetic material particles into a conductive path between the component and the underlying substrate. At the same time the polymer-based material may be cured or otherwise solidified to affix the conductive path formed by the magnetic material particles.

公开(公告)号：US20040163245A1

公开(公告)日：2004-08-26

申请号：US10703122

申请日：2003-11-06

Inventor： James J. deBlanc ,  David Dickey ,  Andrew Michael Cherniski

IPC: H01P003/08 ,  H05K003/02

CPC classification number: H01P3/085 ,  H05K1/024 ,  H05K2201/0248 ,  H05K2201/0278 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49135 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: A circuit board or microelectronic device in which conductive signal lines are suspended or supported by filaments in air, rather than surrounded by a solid dielectric material. Dry air has a low relative permittivity and extremely low loss tangent compared with common dielectric substrates in which signal lines are currently embedded within circuit boards and microelectronic devices. The signal intensity attenuation for filament-suspended or filament-supported signal lines is much lower than signal lines embedded in solid dielectric materials, allowing for transmission of significantly higher frequency signals within filament-suspended and filament-supported signal lines.

Abstract translation: 电路板或微电子器件，其中导电信号线由细丝悬挂或支撑在空气中，而不是被固体电介质材料包围。 与其中信号线当前嵌入电路板和微电子器件的普通介质基板相比，干燥空气具有低的相对介电常数和极低的损耗角正切。 长丝悬挂或灯丝支撑的信号线的信号强度衰减比嵌入固体电介质材料的信号线要低得多，允许在灯丝悬挂和灯丝支持的信号线中传输明显更高的频率信号。

公开(公告)号：US4943606A

公开(公告)日：1990-07-24

申请号：US236721

申请日：1988-08-26

Applicant: Masakazu Inoue ,  Kuniaki Asai ,  Kazuo Hieda ,  Tadayasu Kobayashi

Inventor： Masakazu Inoue ,  Kuniaki Asai ,  Kazuo Hieda ,  Tadayasu Kobayashi

IPC: C08L67/00 ,  C08J7/00 ,  C08K3/26 ,  C08K7/04 ,  H05K1/03

CPC classification number: H05K1/0373 ,  C08K3/26 ,  C08K7/04 ,  H05K1/0326 ,  H05K2201/0141 ,  H05K2201/0209 ,  H05K2201/0248 ,  H05K2201/0251

Abstract: A resin composition for printed circuit board comprising:(A) 30-90% by weight of a liquid crystal polyester,(B) 3-50% by weight of an inorganic fibrous or acicular material having an average diameter of 15 .mu.m or below and an average length of 200 .mu.m or below, and(C) 3-30% by weight of an alkaline earth metal carbonate.

公开(公告)号：EP2883430A4

公开(公告)日：2016-05-11

申请号：EP12882879

申请日：2012-08-10

Applicant: ERICSSON TELEFON AB L M

Inventor： PEREZ-URIA IGOR ,  FERM PER ,  GUSTAFSON BENNY

IPC: H05K3/40

CPC classification number: H05K1/144 ,  H05K1/115 ,  H05K1/141 ,  H05K3/10 ,  H05K3/303 ,  H05K3/3436 ,  H05K3/3494 ,  H05K3/4015 ,  H05K3/4046 ,  H05K3/4053 ,  H05K3/42 ,  H05K2201/0248 ,  H05K2201/0305 ,  H05K2201/09563 ,  H05K2201/09572 ,  H05K2201/10234 ,  H05K2201/10734 ,  H05K2201/10878 ,  H05K2201/10916 ,  H05K2203/0338 ,  H05K2203/0455 ,  H05K2203/1105 ,  Y10T29/49124

公开(公告)号：EP2450911A1

公开(公告)日：2012-05-09

申请号：EP11783348.3

申请日：2011-04-13

Applicant: Tokai Rubber Industries, Ltd.

Inventor： TAKAHASHI Wataru ,  YOSHIKAWA Hitoshi ,  KOBAYASHI Jun

IPC: H01B5/14 ,  C08K7/04 ,  C08L21/00 ,  G01L1/20 ,  H01L29/84 ,  H02N1/00 ,  H05K1/09

CPC classification number: H05K1/095 ,  C08K2201/001 ,  G06F3/044 ,  H01L41/0478 ,  H02N1/006 ,  H05K1/162 ,  H05K2201/0133 ,  H05K2201/0245 ,  H05K2201/0248

Abstract: To provide a conductive film that is flexible, extendable and contractible, and for which the electrical resistance hardly increases even when the conductive film is extended. The conductive film contains an elastomer and metallic filler particles, and satisfies a condition (A) [an average value of reference numbers is 0.8 (1/µm) or more, or the metallic filler particles include flake-like metallic filler particles having a thickness of 1 µm or less and an aspect ratio of 26 or more and the average value of the reference numbers is 0.4 (1/µm) or more] and a condition (B) [a number of unit areas for which an area percentage of the elastomer is 60% or more is 20 or more], the condition (A) being a conductivity indicator and the condition (B) being a flexibility indicator.

公开(公告)号：EP2445322A1

公开(公告)日：2012-04-25

申请号：EP11192444.5

申请日：2010-05-18

Applicant: Sumitomo Electric Industries, Ltd. ,  Sumitomo Electric Printed Circuits, Inc.

Inventor： Yamamoto, Masamichi ,  Nakatsugi, Kyouichirou ,  Yamaguchi, Takashi ,  Kawakami, Shigeki ,  Kimura, Michihiro

IPC: H05K3/32 ,  H05K3/36 ,  H05K3/34 ,  H05K3/28

CPC classification number: H05K3/361 ,  C23F11/149 ,  H01L2924/0002 ,  H05K3/282 ,  H05K3/305 ,  H05K3/323 ,  H05K3/3431 ,  H05K3/4007 ,  H05K2201/0248 ,  H05K2201/0373 ,  H05K2201/094 ,  H05K2201/10977 ,  H05K2201/10992 ,  H05K2203/308 ,  Y10T156/10 ,  H01L2924/00

Abstract: [Object] Provided are a connection method and an electronic device, in which the manufacturing process can be simplified, and a connection structure using an adhesive can be produced at low cost.
[Solution] A connection method according to the present invention includes a step (a3) of preparing a base material (321) including an electrode (322) for connection using an adhesive and an electrode (326) for connection using solder; a step (b3) of covering the electrode for connection using an adhesive and the electrode for connection using solder with oxidation preventing films (325); after the step (b3), a step (c3) of bonding the electrode (322) for connection using an adhesive to a connection conductor (312) with an adhesive (330) containing a thermosetting resin to establish electrical connection; and after the step (c3), a step (d3) of joining the electrode (326) for connection using solder to a connection conductor (342) using solder (350) by solder reflow treatment in a non-oxidizing atmosphere, wherein an increase in connection resistance between the electrode for connection using an adhesive and the connection conductor before and after the step (d3) is within a predetermined range.

Abstract translation: 提供了一种连接方法和电子设备，其中可以简化制造过程，并且可以以低成本生产使用粘合剂的连接结构。 [解决方案]根据本发明的连接方法包括制备包括用于使用粘合剂连接的电极（322）和用于使用焊料进行连接的电极（326）的基材（321）的步骤（a3） 使用粘合剂覆盖用于连接的电极的步骤（b3）和使用具有防氧化膜的焊料的连接用电极（325）; 在步骤（b3）之后，使用粘合剂（330）将用粘合剂连接的电极（322）与含有热固性树脂的连接导体（312）接合以建立电连接的步骤（c3） 在步骤（c3）之后，在非氧化性气氛中通过焊锡回流处理使用焊料（350）将用于使用焊料进行连接的电极（326）连接到连接导体（342）的步骤（d3），其中增加 在步骤（d3）之前和之后，使用粘合剂连接的电极与连接导体之间的连接电阻在预定范围内。

公开(公告)号：EP2069429A2

公开(公告)日：2009-06-17

申请号：EP07837857.7

申请日：2007-09-06

Applicant: Siemens Energy, Inc.

Inventor： STEVENS, Gary ,  SMITH, James, D., B. ,  WOOD, John, W.

IPC: C08K3/14 ,  C08K3/22 ,  C08K3/28 ,  C08K9/08 ,  H05K1/03

CPC classification number: H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0224 ,  H05K2201/0248 ,  Y10T428/25 ,  Y10T428/251 ,  Y10T428/254 ,  Y10T428/256 ,  Y10T428/257 ,  Y10T428/258 ,  Y10T428/259 ,  Y10T428/31511 ,  Y10T428/31993

Abstract: A high thermal conductivity resin that is made up of a host resin matrix (42) and high thermal conductivity fillers (30) that are mixed within the host resin to form a resin mixture. The fillers comprise at least 3-5% by weight of the resin mixture, and the fillers are from an average of 1 -100 nm in at least one dimension, and where the particles are smaller than an average of 1000 nm in the particles' longest dimension. The host resin matrix forms an ordered resin shell (40) around the high thermal conductivity fillers (30), whereby resin molecules are aligned perpendicular to the surface of the high thermal conductivity fillers. An overlap of the ordered resin shells (44) is formed between the high thermal conductivity fillers such that continuous pathways for ordered resin shells are created through the resin mixture.

公开(公告)号：EP1272550A1

公开(公告)日：2003-01-08

申请号：EP01918815.0

申请日：2001-03-16

Applicant: PPG Industries Ohio, Inc.

Inventor： LAWTON, Ernest, L. ,  VELPARI, Vedagiri ,  RICE, William, B. ,  ROBERTSON, Walter, J. ,  NOVICH, Bruce, E. ,  WU, Xiang ,  LAMMON-HILINSKI, Kami

IPC: C08J5/08 ,  H05K1/03 ,  C03C25/10

CPC classification number: C03C25/26 ,  C03C25/00 ,  C03C25/10 ,  C03C25/28 ,  C03C25/32 ,  C03C25/42 ,  C03C25/47 ,  C03C25/48 ,  C08J5/08 ,  H05K1/0366 ,  H05K3/0047 ,  H05K2201/0166 ,  H05K2201/0175 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0215 ,  H05K2201/0239 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/0254 ,  H05K2201/029 ,  H05K2203/127 ,  Y10T428/2927 ,  Y10T428/2933 ,  Y10T428/2938 ,  Y10T428/2964 ,  Y10T442/20 ,  Y10T442/3049

Abstract: The present invention provides a fabric comprising at least one fiber strand comprising a plurality of fibers and having a resin compatible coating composition on at least a surface of the at least one fiber strand, wherein the at least one fiber strand has an Air Jet Transport Drag Force value of greater than 100,000 gram force per gram mass of strand as determined by a needle air jet nozzle unit having an internal air jet chamber having a diameter of 2 millimeters and a nozzle exit tube having a length of 20 centimeters at a strand feed rate of 274 meters per minute and an air pressure of 310 kiloPascals. The present invetion also provides a reinforced laminate comprising: (a) at least one matrix material; and (b) at least one fabric comprising at least one fiber strand comprising a plurality of fibers and having a resin compatible coating composition on at least a surface of the at least one fiber strand, wherein the at least one fiber strand has an Air Jet Transport Drag Force value of greater than 100,000 gram force per gram mass of strand as determined by a needle air jet nozzle unit having an internal air jet chamber having a diameter of 2 millimeters and a nozzle exit tube having a length of 20 centimeters at a strand feed rate of 274 meters per minute and an air pressure of 310 kiloPascals.

公开(公告)号：EP0633295B1

公开(公告)日：2002-01-02

申请号：EP94905218.7

申请日：1994-01-27

Applicant: OTSUKA KAGAKU KABUSHIKI KAISHA

Inventor： TASAKA, Takio, 332-9, Aza Hachikitakaitaku ,  MONDE, Hiroyuki, Mezondofurora 505

IPC: C08L101/00 ,  C08K7/04

CPC classification number: C08K7/08 ,  C08K7/10 ,  H05K1/0373 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0248 ,  H05K2201/0251

Abstract: The invention aims at providing a resin composition for electronic parts which is in great demand as a circuit board material for electric and electronic equipments, and which has a low dielectric constant, low dielectric dissipation factor and a thermal resistance. This resin consists of a thermoplastic resin or a thermosetting resin, and wollastonite or zonotolite, fibrous material containing CaO.SiO2 as a main component, mixed as reinforcing fiber with the resin at a mixing ratio of 5-60 % based on the total weight of the resin and fiber.

公开(公告)号：EP1124769A1

公开(公告)日：2001-08-22

申请号：EP99952920.9

申请日：1999-10-08

Applicant: PPG Industries Ohio, Inc. ,  Lawton, Ernest L. ,  Wu, Xiang ,  Rice, William B. ,  Novich, Bruce E.

Inventor： LAWTON, Ernest, L. ,  WU, Xiang ,  RICE, William, B. ,  NOVICH, Bruce, E.

IPC: C03C25/00

CPC classification number: H05K1/0366 ,  C03C25/47 ,  C08J5/08 ,  H05K3/0047 ,  H05K2201/0166 ,  H05K2201/0175 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0239 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/0254 ,  H05K2201/029 ,  H05K2203/127

Abstract: The present invention provides a coated fiber strand comprising at least one fiber having a layer of a dried residue of a resin compatible coating composition on at least a portion of a surface of the at least one fiber, the resin compatible coating composition comprising: a) a plurality of discrete, dimensionally stable particles formed from materials selected from the group consisting of organic materials, polymeric materials, composite materials and mixtures thereof that provide an interstitial space between the at least one fiber and at least one adjacent fiber, the particles having an average particle size of about 0.1 to 5 micrometers; b) at least one lubricious material; c) at least one polymeric film former; and d) at least one coupling agent, and a fabric incorporating at least one of the fiber strands.