公开(公告)号：US20160330835A1

公开(公告)日：2016-11-10

申请号：US15110977

申请日：2015-01-23

Applicant: TOPPAN FORMS CO., LTD.

Inventor： Kumi Hirose ,  Takuya Sekiguchi ,  Nariaki Nawa

IPC: H05K1/09 ,  H05K3/12 ,  G06F3/041 ,  H05K1/02

CPC classification number: H05K1/092 ,  G06F3/041 ,  G06F3/044 ,  G06F2203/04103 ,  G06F2203/04112 ,  H05K1/0225 ,  H05K1/0274 ,  H05K3/1275 ,  H05K2201/032 ,  H05K2201/09681 ,  H05K2201/098

Abstract: A wiring board includes: thin silver wires formed on a substrate by a printing method, in which the thin silver wires are configured so that the width thereof in a cross-section in a direction perpendicular to a wire length direction thereof is 20 μm or less, a top thereof has a smaller width than that of a contact portion that comes into contact with the substrate, and a volume resistivity of the thin silver wire is 15 μΩ·cm or less.

Abstract translation: 布线板包括：通过印刷方法形成在基板上的细银线，其中细银线被构造成使得其在与其线长度方向垂直的方向上的横截面中的宽度为20μm或更小 ，其顶部的宽度小于与基板接触的接触部分的宽度，并且细银线的体积电阻率为15μΩ·cm以下。

公开(公告)号：US09485856B2

公开(公告)日：2016-11-01

申请号：US14291201

申请日：2014-05-30

Applicant: FUJIFILM Corporation

Inventor： Akira Ichiki

IPC: G06F3/041 ,  H05K1/02 ,  G06F3/044 ,  H05K1/03 ,  H05K3/10

CPC classification number: H05K1/0274 ,  G06F3/044 ,  G06F2203/04103 ,  G06F2203/04112 ,  H05K1/03 ,  H05K3/106 ,  H05K2201/0108 ,  H05K2201/0317 ,  H05K2201/032

Abstract: A transparent electrode sheet includes a transparent support having thereon a patterned electrode, wherein the electrode is made from a metal thin wire, a thickness of the metal thin wire is 0.1 μm or more, and an absolute value of a difference between a reflection chromaticity b1* of a surface of the electrode at far side from the transparent support and a reflection chromaticity b2* of a surface of the electrode at near side to the transparent support is not more than 2.

Abstract translation: 透明电极片包括其上具有图案化电极的透明支撑体，其中电极由金属细线制成，金属细线的厚度为0.1μm以上，反射色度b1 *远离透明支撑体的电极表面的反射色度b *和透明支撑体附近的电极表面的反射色度b2 *不大于2。

公开(公告)号：US09167690B1

公开(公告)日：2015-10-20

申请号：US14299701

申请日：2014-06-09

Applicant: SCIENTIFIC COMPONENTS CORPORATION

Inventor： Harvey L. Kaylie ,  Aron Raklyar

IPC: H05K7/10 ,  H05K7/12 ,  H05K1/11 ,  H05K1/09

CPC classification number: H05K1/111 ,  H01L23/13 ,  H01L23/15 ,  H01L23/49805 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/113 ,  H05K2201/032 ,  H05K2201/0753 ,  H05K2201/10378 ,  H01L2924/00

Abstract: An LTCC carrier composed of thermosetting polymer, woven glass fiber and ceramic has gold over nickel contact pads on top and bottom surfaces and conductive vias therethrough between aligned pairs of top and bottom pads. The vias prevent undesirable inductive paths from limiting high frequency operation of the circuitry. Solder deposits on the top pads attach the LTCC component, which is further secured to the carrier by epoxy, thus improving resistance to thermal stress and mechanical shock. A slot through the carrier body between top and bottom surfaces further reduces thermal stress and mechanical shock. Metallized castellations on opposite carrier sides provide additional surface area for reflow solder joints with the PCB, and a means for visually inspecting the solder joint quality. A gap in the metallization on the top layer of the carrier prevents solder spreading during multiple soldering cycles, which may result in poor solder joints.

Abstract translation: 由热固性聚合物，编织玻璃纤维和陶瓷组成的LTCC载体在顶部和底部表面上的镍接触焊盘上具有金，并且在对准的顶部和底部焊盘对之间穿过其中的导电通孔。 通孔防止不期望的电感路径限制电路的高频操作。 顶部焊盘上的焊料沉积物连接LTCC部件，其通过环氧树脂进一步固定到载体上，从而改善对热应力和机械冲击的抗性。 在顶面和底面之间穿过承载体的槽进一步降低了热应力和机械冲击。 在相对的载体侧上的金属化的蓖耳体为PCB的回流焊接提供额外的表面积，以及用于目视检查焊点质量的手段。 载体顶层上的金属化中的间隙防止在多个焊接周期期间的焊料扩散，这可能导致差的焊接点。

公开(公告)号：US09155201B2

公开(公告)日：2015-10-06

申请号：US14094841

申请日：2013-12-03

Applicant: Yongcai Wang ,  John Andrew Lebens ,  Mitchell Lawrence Wright ,  Julie A. Cummings

Inventor： Yongcai Wang ,  John Andrew Lebens ,  Mitchell Lawrence Wright ,  Julie A. Cummings

IPC: H05K1/09 ,  H05K3/00 ,  H05K1/02 ,  H05K3/04 ,  H05K3/22

CPC classification number: H05K1/09 ,  G03F7/0002 ,  G03F7/0035 ,  H05K1/0274 ,  H05K1/028 ,  H05K1/0296 ,  H05K1/0313 ,  H05K3/0023 ,  H05K3/04 ,  H05K3/22 ,  H05K2201/0108 ,  H05K2201/032

Abstract: Conductive articles and devices have conductive micro-wires formed by curing a photocurable layer on a transparent flexible substrate that has a distortion temperature of less than 150° C. The photocurable layer has a viscosity

Abstract translation: 导电性物品和器件具有通过在变形温度低于150℃的透明柔性基底上固化光固化层形成的导电微线。光固化层在温度微通道形成时的粘度<5,000帕斯卡 - 秒 微通道的平均宽度小于或等于4μm，平均深度和平均宽度比大于或等于1.光固化层暴露于固化紫外线辐射以形成光固化微观图案 并且在光固化微通道中形成包含金属纳米颗粒的导电组合物。 导电组合物以光固化微通道的图案固化，以在透明柔性基底上的光固化微通道的图案中提供导电微线图案。 至少50％的导电微细线中的每一个具有小于0.025欧姆/平方的薄层电阻。

公开(公告)号：US20150282310A1

公开(公告)日：2015-10-01

申请号：US14438004

申请日：2013-10-21

Applicant: NATIONAL INSTITUTE FOR MATERIALS SCIENCE

Inventor： Jin Kawakita ,  Toyohiro Chikyo ,  Yasuo Hashimoto ,  Barbara Horvath

IPC: H05K1/09

CPC classification number: H05K1/095 ,  C08G73/0266 ,  C08G2261/3221 ,  C08G2261/3223 ,  C08G2261/43 ,  C08G2261/964 ,  C08K3/08 ,  C08L65/00 ,  C08L79/02 ,  C09D17/00 ,  C09D201/00 ,  C09J7/20 ,  C09J165/00 ,  C09J2205/102 ,  C09J2465/00 ,  H01B1/22 ,  H01L21/76898 ,  H01L23/49883 ,  H05K1/097 ,  H05K3/4069 ,  H05K2201/032 ,  Y10T428/24339

Abstract: A conductive polymer-metal complex becomes to be adhered simply and strongly on the surface of a substrate such as PTFE. By subjecting a solution containing a monomer which provides a conductive polymer, an anion, and a metal ions such as Ag+, Cu2+, Cu+ and the like to an irradiation with light having an energy required for exciting an electron to an energy level capable of reducing the metal ion, such as ultraviolet light, under an appropriated condition, thereby precipitating the conductive polymer-metal complex as being dispersed in the reaction liquid. By supplying this dispersion liquid onto various substrates, the complex microparticles in the dispersion liquid enter into and mate with the narrow holes on the surface of the substrate. As a result, the complex precipitate formed on the surface of the substrate and the substrate can be adhered strongly to each other.

Abstract translation: 导电聚合物 - 金属络合物变得简单而强烈地粘附在诸如PTFE的基底的表面上。 通过使含有提供导电聚合物，阴离子和金属离子如Ag +，Cu 2+，Cu +等的单体的溶液经受使具有能够使电子激发所需的能量的光照射到能够降低能级的溶液 金属离子如紫外光，在适当的条件下，由此使导电聚合物 - 金属络合物分散在反应液中而沉淀。 通过将该分散液供给到各种基板上，分散液中的复合微粒进入基板表面的窄孔并配合。 结果，形成在基板表面和基板上的复合沉积物可以彼此强烈地粘合。

公开(公告)号：US20150162112A1

公开(公告)日：2015-06-11

申请号：US14361057

申请日：2014-04-03

Applicant: Nuovo Film, Inc.

Inventor： Hakfei Poon

IPC: H01B5/14 ,  H01B13/00 ,  H01B13/30

CPC classification number: H01B13/30 ,  G06F3/041 ,  G06F2203/04103 ,  G06F2203/04112 ,  H01B1/02 ,  H01B1/22 ,  H01L31/022466 ,  H01L31/1884 ,  H05K1/0274 ,  H05K1/0298 ,  H05K1/03 ,  H05K1/09 ,  H05K2201/0302 ,  H05K2201/032

Abstract: Discloses herein is a method to make a transparent conductive electrode. The methods comprises providing a substrate, forming a film comprising a first region having a plurality of metal nanowires, wherein at least some of metal nanowires are surface functionalized and inert to oxidation or acid reactions; evaporating away the solvent in the metal nanowire film; exposing the nanowire film to a chemical reagent; forming a second region comprising nanowires, and annealing the film having the first and second region, wherein the resistivity difference between the first and second region is more than 1000.

Abstract translation: 本文公开了制造透明导电电极的方法。 所述方法包括提供基底，形成包含具有多个金属纳米线的第一区域的膜，其中至少一些金属纳米线被表面官能化并对氧化或酸反应是惰性的; 蒸发掉金属纳米线膜中的溶剂; 将纳米线膜暴露于化学试剂; 形成包括纳米线的第二区域，以及退火具有第一和第二区域的膜，其中第一和第二区域之间的电阻率差大于1000。

公开(公告)号：US20150079415A1

公开(公告)日：2015-03-19

申请号：US14388838

申请日：2013-03-29

Applicant: JX Nippon Mining & Metals Corporation

Inventor： Ryo Fukuchi

IPC: H05K1/09 ,  H05K1/03 ,  H05K1/02

CPC classification number: H05K1/09 ,  C23C22/24 ,  C23C22/83 ,  C23C30/00 ,  C23C30/005 ,  C23C2222/20 ,  H05K1/0242 ,  H05K1/0393 ,  H05K3/382 ,  H05K3/389 ,  H05K2201/0141 ,  H05K2201/032 ,  H05K2201/0355 ,  Y10T428/12056 ,  Y10T428/12556 ,  Y10T428/12569 ,  Y10T428/12847 ,  Y10T428/12882 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/12917 ,  Y10T428/12937 ,  Y10T428/26 ,  Y10T428/263 ,  Y10T428/27 ,  Y10T428/273

Abstract: This surface-treated copper foil is characterized in that the amount of adhesion of Si on the copper foil surface is from 3.1 to 300 μg/dm2, and the amount of adhesion of N on the copper foil surface is from 2.5 to 690 μg/dm2. The objective of the present invention is to obtain a copper foil having improved peel strength in providing a copper foil for a flexible printed substrate (FPC), in which a copper foil is laminated to a liquid crystal polymer (LCP) suitable for high-frequency applications.

Abstract translation: 该表面处理铜箔的特征在于，铜箔表面的Si的附着量为3.1〜300μg/ dm 2，铜箔表面的N的附着量为2.5〜690μg/ dm 2 。 本发明的目的是获得在提供用于柔性印刷基板（FPC）的铜箔时具有改善的剥离强度的铜箔，其中将铜箔层压到适合于高频的液晶聚合物（LCP） 应用程序。

公开(公告)号：US20150021071A1

公开(公告)日：2015-01-22

申请号：US14383972

申请日：2013-02-28

Applicant: ISHIHARA CHEMICAL CO. LTD.

Inventor： Yuichi Kawato ,  Tomohiro Mita ,  Yusuke Maeda ,  Tomio Kudo

IPC: H05K3/38 ,  H05K1/02 ,  H05K3/24 ,  H05K1/03

CPC classification number: H05K3/38 ,  H05K1/0296 ,  H05K1/0313 ,  H05K1/097 ,  H05K3/245 ,  H05K3/246 ,  H05K3/386 ,  H05K2201/0129 ,  H05K2201/0137 ,  H05K2201/0154 ,  H05K2201/032 ,  H05K2203/1126 ,  H05K2203/1131 ,  Y10T29/49163

Abstract: In a conductive film formed by photo sintering of a film composed of copper particulates, adhesiveness to a base material of the conductive film is improved. A circuit board includes a circuit including a conductive film, and a substrate. The circuit board further includes a resin layer between the substrate and the conductive film. The substrate is made of a non-thermoplastic base material. The resin layer contains a thermoplastic resin. The conductive film is formed by photo sintering of a film composed of copper particulates, and thus improving adhesiveness of the conductive film to the base material through the resin layer.

Abstract translation: 在由铜微粒构成的薄膜进行光烧结而形成的导电膜中，与导电膜的基材的粘附性提高。 电路板包括具有导电膜和基板的电路。 电路板还包括在基板和导电膜之间的树脂层。 基材由非热塑性基材制成。 树脂层含有热塑性树脂。 导电膜由铜微粒构成的薄膜进行光烧结而形成，从而提高导电膜与基材通过树脂层的密合性。

公开(公告)号：US20140321069A1

公开(公告)日：2014-10-30

申请号：US14328989

申请日：2014-07-11

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Naoki Gouchi ,  Takahiro Baba

IPC: H05K1/18 ,  H05K1/11 ,  H05K1/16

CPC classification number: H05K1/185 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49894 ,  H01L23/5389 ,  H01L23/562 ,  H01L23/585 ,  H01L23/66 ,  H01L24/19 ,  H01L25/165 ,  H01L25/18 ,  H01L2224/16225 ,  H01L2924/19105 ,  H01L2924/351 ,  H05K1/115 ,  H05K1/16 ,  H05K3/4632 ,  H05K3/4697 ,  H05K2201/032 ,  H05K2201/042 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T428/24917 ,  H01L2924/00

Abstract: A high-frequency module has a multilayer board formed by laminating a plurality of sheets made of a thermoplastic resin material and subjecting the laminated sheets to thermocompression bonding, and an IC chip placed in a cavity provided in the multilayer board. A gap is provided between a side of the IC chip and an inner wall of the cavity. The multilayer board includes a via-hole conductor provided near the inner wall of the cavity for preventing the resin sheets from being softened and flowing into the cavity upon thermocompression bonding.

Abstract translation: 高频模块具有通过层压由热塑性树脂材料制成的多个片材并对层压片材进行热压接而形成的多层板，以及设置在多层板中的空腔中的IC芯片。 在IC芯片的一侧和空腔的内壁之间设置间隙。 多层板包括设置在空腔内壁附近的通孔导体，用于防止树脂片在热压接时软化并流入空腔。

公开(公告)号：US20140267954A1

公开(公告)日：2014-09-18

申请号：US14291201

申请日：2014-05-30

Applicant: FUJIFILM Corporation

Inventor： Akira ICHIKI

IPC: H05K1/02 ,  G06F3/044

CPC classification number: H05K1/0274 ,  G06F3/044 ,  G06F2203/04103 ,  G06F2203/04112 ,  H05K1/03 ,  H05K3/106 ,  H05K2201/0108 ,  H05K2201/0317 ,  H05K2201/032

Abstract: A transparent electrode sheet includes a transparent support having thereon a patterned electrode, wherein the electrode is made from a metal thin wire, a thickness of the metal thin wire is 0.1 μm or more, and an absolute value of a difference between a reflection chromaticity b1* of a surface of the electrode at far side from the transparent support and a reflection chromaticity b2* of a surface of the electrode at near side to the transparent support is not more than 2.

Abstract translation: 透明电极片包括其上具有图案化电极的透明支撑体，其中电极由金属细线制成，金属细线的厚度为0.1μm以上，反射色度b1 *远离透明支撑体的电极表面的反射色度b *和透明支撑体附近的电极表面的反射色度b2 *不大于2。