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公开(公告)号：CN103596352A
公开(公告)日：2014-02-19
申请号：CN201210289930.4
申请日：2012-08-15
Applicant: 鸿富锦精密工业(深圳)有限公司 , 鸿海精密工业股份有限公司
CPC classification number: H05K1/0281 , H04N5/225 , H04N5/2253 , H05K1/0215 , H05K1/141 , H05K3/323 , H05K2201/041 , H05K2201/09781 , H05K2201/10121
Abstract: 一种软性电路板装置，其包括一软板基材。所述软板基材包括一第一表面、一背对所述第一表面的第二表面。所述第一表面上设置有多个软板焊垫。所述第一表面用于涂布异方性导电胶以使所述异方性导电胶覆盖所述多个软板焊垫。所述软性电路板装置进一步包括多个金属片。所述多个金属片固设在所述第二表面上，且所述多个金属片与多个软板焊垫一一对应设置。所述多个金属片用于加强所述软性电路板装置的硬度并接地。本发明还涉及一种应用上述软性电路板装置的相机模组。
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公开(公告)号：CN103493606A
公开(公告)日：2014-01-01
申请号：CN201280019645.9
申请日：2012-04-20
Applicant: 罗伯特·博世有限公司
Inventor： U·汉森
CPC classification number: H05K1/148 , G01L19/06 , G01P15/0802 , G01P15/09 , G01P15/125 , G01P2015/0882 , H05K1/0271 , H05K1/14 , H05K1/141 , H05K1/142 , H05K1/144 , H05K1/145 , H05K3/0064 , H05K3/4611 , H05K5/0056 , H05K2201/0133 , H05K2201/041 , H05K2201/09063 , H05K2201/09081 , H05K2201/10083 , H05K2201/10151
Abstract: 本发明涉及一种电路板组件、特别是多层电路板。所述电路板组件包括至少两块彼此平行地布置且相互连接的电路板。根据本发明，在开头提及的类型的电路板组件中，使其中一块电路板的至少一个面区域借助于弹性地和/或减振地构造的元件与所述电路板组件的另一块电路板相连接，使得借助于所述电路板的所述面区域和所述元件形成抗振的系统、特别是弹簧-质量系统、抗振的弯曲条带或抗弯曲振动的板。
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公开(公告)号：CN103443886A
公开(公告)日：2013-12-11
申请号：CN201280013739.5
申请日：2012-03-16
Applicant: 株式会社村田制作所
CPC classification number: H01G4/12 , H01G2/06 , H01G4/01 , H01G4/224 , H01G4/30 , H05K1/0271 , H05K1/141 , H05K1/181 , H05K3/3442 , H05K2201/041 , H05K2201/049 , H05K2201/09181 , H05K2201/10015 , H05K2201/2045 , Y02P70/611
Abstract: 本发明实现一种构造且安装较为容易，具有所需充分的安装强度及电气特性且可抑制振动声的产生的电子部件。层叠陶瓷电容器（20）是将平板状的内部电极（200）层叠规定层的构造。中介片（30）包含较层叠陶瓷电容器（20）的外形更广的绝缘性基板（31）。在绝缘性基板（31）的第1主面形成有用以安装层叠陶瓷电容器（20）的第1安装用电极（321、331），在第2主面形成有用以连接到外部电路基板（90）的第1外部连接用电极（322、332）。层叠陶瓷电容器（20）以内部电极（200）的主面相对于中介片（30）的主面即绝缘性基板（31）的第1主面及第2主面平行的方式，安装至中介片（30）。
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公开(公告)号：CN101507379A
公开(公告)日：2009-08-12
申请号：CN200680041380.7
申请日：2006-09-06
Applicant: 超刀片公司
Inventor： 阿维夫·索弗
IPC: H05K7/20
CPC classification number: G06F1/18 , F28D15/0266 , F28D15/0275 , G06F1/20 , G06F2200/1635 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/19105 , H05K1/0284 , H05K1/185 , H05K7/205 , H05K2201/041 , H01L2924/00
Abstract: 本发明提供了用于构建和实施三维多层模块化计算机体系结构的新且独特的装置、系统和方法，其通过使用三维分层结构大大提高了计算机质量、体积和功率密度。
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105.发明授权
公开(公告)号：EP2559327B1
公开(公告)日：2018-05-16
申请号：EP11730863.5
申请日：2011-04-11
Inventor： STAHR, Johannes , LEITGEB, Markus
CPC classification number: H05K1/185 , H05K1/0218 , H05K1/0298 , H05K1/115 , H05K1/14 , H05K1/144 , H05K1/181 , H05K1/186 , H05K3/4623 , H05K3/4697 , H05K2201/041 , H05K2201/042 , H05K2201/043 , H05K2201/045 , H05K2201/0723 , H05K2201/09036 , H05K2201/09072 , H05K2201/09618 , H05K2201/10 , H05K2201/10083 , H05K2201/10151 , Y10T29/49126 , Y10T29/49144
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Patent Agency Ranking106.发明公开
公开(公告)号：EP3288246A1
公开(公告)日：2018-02-28
申请号：EP17185937.4
申请日：2017-08-11
Inventor： ZHANG, Wenzhen
CPC classification number: H05K1/189 , G06F1/1684 , G06F2203/0338 , G06K9/00006 , H04M1/026 , H04M2250/12 , H05K1/0281 , H05K1/111 , H05K1/144 , H05K3/301 , H05K3/305 , H05K3/363 , H05K5/03 , H05K2201/041 , H05K2201/10151 , H05K2201/10318 , H05K2201/10325 , H05K2201/10757
Abstract: A fingerprint module includes a cover plate, a fingerprint chip, an intermediate board, and a circuit board. An assembling region is disposed on the cover plate. The fingerprint chip is fixed in the assembling region. The intermediate board is bonded to one surface of the fingerprint chip opposite to the cover plate to press the fingerprint chip. The circuit board is electrically connected to the fingerprint chip via the intermediate board.
Abstract translation: 指纹模块包括盖板，指纹芯片，中间板和电路板。 装配区域设置在盖板上。 指纹芯片固定在组装区域。 将中间板键合到指纹芯片的与盖板相对的一个表面以按压指纹芯片。 电路板通过中间板电连接到指纹芯片。
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公开(公告)号：EP1934668B1
公开(公告)日：2016-03-16
申请号：EP06780470.8
申请日：2006-09-06
Applicant: BEYOND BLADES LTD.
Inventor： SOFFER, Aviv
CPC classification number: G06F1/18 , F28D15/0266 , F28D15/0275 , G06F1/20 , G06F2200/1635 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/19105 , H05K1/0284 , H05K1/185 , H05K7/205 , H05K2201/041 , H01L2924/00
Abstract: A 3-Dimensional multi-layered modular computer (3DMC) is disclosed that comprises removable layers of at least one CPU layer, at least one volatile memory layer, and at least one Input/Output (I/O) interface layers. The layers are stacked in parallel and are electrically connected to create a computing apparatus. Each of the layers is formed from encapsulating material having one or more internal cavities for chip dice, passive components, active components, and conductor's traces. A plurality of Thermal Conducting Rods (TCRs) is capable of conducting and removing heat generated by the components in the layers from the 3DMC apparatus to an external medium. Each TCR perpendicularly passes through the layers.
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公开(公告)号：EP2702841A1
公开(公告)日：2014-03-05
申请号：EP12717660.0
申请日：2012-04-20
Applicant: Robert Bosch GmbH
Inventor： HANSEN, Uwe
CPC classification number: H05K1/148 , G01L19/06 , G01P15/0802 , G01P15/09 , G01P15/125 , G01P2015/0882 , H05K1/0271 , H05K1/14 , H05K1/141 , H05K1/142 , H05K1/144 , H05K1/145 , H05K3/0064 , H05K3/4611 , H05K5/0056 , H05K2201/0133 , H05K2201/041 , H05K2201/09063 , H05K2201/09081 , H05K2201/10083 , H05K2201/10151
Abstract: The invention relates to a printed circuit board arrangement, more particularly a multilayer printed circuit board. The printed circuit board arrangement comprises at least two printed circuit boards which are arranged parallel to one another and connected to one another. According to the invention, in the case of the printed circuit board arrangement of the type mentioned initially, at least one surface region of one printed circuit board is connected to another printed circuit board of the printed circuit board arrangement by means of an element embodied in an elastic and/or damping fashion in such a way that an oscillatory system, more particularly a spring-mass system, an oscillatory bending strip or a flexurally oscillatory board is formed by means of the surface region of the printed circuit board and the element.
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公开(公告)号：EP2566298A1
公开(公告)日：2013-03-06
申请号：EP11775043.0
申请日：2011-04-27
Applicant: Lumiotec Inc.
Inventor： KAGOTANI Akihito , ARISAWA Makoto , KAMADA Hideki
CPC classification number: H05B33/06 , B32B17/10036 , B32B17/10541 , F21V29/74 , F21V29/89 , F21Y2105/00 , F21Y2115/20 , H01L51/5203 , H01L51/524 , H01L51/5253 , H01L51/529 , H01L2251/5361 , H05B33/02 , H05B33/04 , H05K1/14 , H05K3/323 , H05K3/361 , H05K2201/041 , H05K2201/09027 , H05K2201/09836 , H05K2201/10128
Abstract: Disclosed is an organic EL illumination device-which is provided with: an organic EL element (13) on a glass substrate (10); and a plurality of anode terminal electrodes (11) and cathode terminal electrodes (12) for evenly supplying current to the aforementioned organic EL element (13) on the aforementioned glass substrate (10)-wherein the organic EL illumination device is provided with a wiring board (1) to which a circuit having anode wiring (1a) corresponding to the position of each of the aforementioned anode terminal electrodes (11), and a circuit having cathode wiring (1b) corresponding to the position of each of the aforementioned cathode terminal electrodes (12) are formed.
Abstract translation: 公开了一种有机EL照明装置，其设置有：玻璃基板（10）上的有机EL元件（13）。 以及用于向上述玻璃基板（10）上的上述有机EL元件（13）均匀地供给电流的多个阳极端子电极（11）和阴极端子电极（12），其中在有机EL照明装置中设置有布线 具有与上述阳极端子电极（11）的位置对应的阳极配线（1a）的电路的电路板（1）和与上述阴极端子的位置对应的阴极配线（1b）的电路 形成电极（12）。
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公开(公告)号：EP0213675A3
公开(公告)日：1988-12-14
申请号：EP86201452
申请日：1986-08-22
Applicant: PHILIPS ELECTRONIC AND ASSOCIATED INDUSTRIES LIMITED , N.V. Philips' Gloeilampenfabrieken
Inventor： Francis, Leslie Herbert , Baker, Robert John
CPC classification number: H01J29/92 , H01J2329/00 , H05K1/118 , H05K3/4046 , H05K2201/041 , H05K2201/052 , H05K2201/10401
Abstract: A cathode ray tube has a thin flexible circuit (48) comprising one or more films of polyimide with a plurality of conductive tracks deposited directly thereon for establishing electrical connection between a multi-pin leadthrough (45) passing through the wall of the tube's envelope (31) and terminals of electrically operable components within the envelope, e.g. electron gun (35) and beam-deflection electrodes (36,39 and 40). A number of track-carrying films may be stacked together to form a laminate structure. Such a flexible circuit avoids outgassing problems and, being thin and flexible, occupies minimal space and is easily routed around internal components to ease assembly
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