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    Electronic module arranged in system board
    102.
    发明专利
    Electronic module arranged in system board 审中-公开
    电子模块安装在系统板上

    公开(公告)号：JP2006178967A

    公开(公告)日：2006-07-06

    申请号：JP2005361403

    申请日：2005-12-15

    Applicant: Hewlett-Packard Development Co Lp ,  ヒューレット−パッカード デベロップメント カンパニー エル.ピー.

    Inventor： BELADY CHRISTIAN L ,  WILLIAMS GARY W ,  HARRIS SHAUN L ,  BELSON STEVEN A ,  PETERSON ERIC C

    IPC: G06F1/20

    CPC classification number: G06F1/20 ,  G06F2200/201 ,  H05K1/0203 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/144 ,  H05K3/0061 ,  H05K2201/045 ,  H05K2201/064 ,  H05K2201/09054 ,  H05K2201/10189 ,  H05K2201/1056 ,  H05K2201/10689 ,  H05K2203/1572

    Abstract: PROBLEM TO BE SOLVED: To attain the convenience and efficient heat dissipation of an electronic module to be arranged in a system board by improving the design and layout of the electronic module. SOLUTION: The electronic module connectable to a system board in a attachable and detachable manner is provided with: a first portion (192) which connects to the the system board and includes a thermal dissipation device (120A) and a printed circuit board (104) with a processor (110) connected to a first side (168) of the printed circuit board, wherein the thermal dissipation device (120A) dissipates heat from the processor (110) through heat exchange; and a second portion (190) which is disposed between the first portion (192) and the system board and includes a power source system board (130) for supplying power to the processor (110), wherein the power source system board (130) is extended adjacent and parallel to the second side (172) of the printed circuit board (104). COPYRIGHT: (C)2006,JPO&NCIPI

    Abstract translation: 要解决的问题：通过改进电子模块的设计和布局来实现要布置在系统板中的电子模块的便利和有效的散热。 解决方案：可连接和可拆卸地连接到系统板的电子模块设置有：连接到系统板的第一部分（192），其包括散热装置（120A）和印刷电路板 （104），其具有连接到所述印刷电路板的第一侧（168）的处理器（110），其中所述散热装置（120A）通过热交换从所述处理器（110）散热; 以及设置在所述第一部分（192）和所述系统板之间的第二部分（190），并且包括用于向所述处理器（110）供电的电源系统板（130），其中所述电源系统板（130） 相邻并平行于印刷电路板（104）的第二侧（172）延伸。 版权所有（C）2006，JPO＆NCIPI

    Engine controlling circuit device
    104.
    发明专利
    Engine controlling circuit device 审中-公开
    发动机控制电路设备

    公开(公告)号：JP2006032490A

    公开(公告)日：2006-02-02

    申请号：JP2004206218

    申请日：2004-07-13

    Applicant: Hitachi Ltd ,  株式会社日立製作所

    Inventor： SUMIYA KIYOOMI ,  EGUCHI KUNIYUKI ,  SASAKI MASAHIRO ,  MAYUZUMI TAKUYA

    IPC: H05K7/20 ,  F02D41/00 ,  H05K1/02

    CPC classification number: H05K7/20872 ,  H05K1/0203 ,  H05K1/0272 ,  H05K1/189 ,  H05K3/284 ,  H05K2201/064 ,  H05K2201/066 ,  H05K2203/1316

    Abstract: PROBLEM TO BE SOLVED: To provide an engine controlling circuit device that is improved in heat resistance and, therefore, can be installed to a location having severe heat environment.
    SOLUTION: The engine controlling circuit device is provided with a circuit board 2 mounted with a plurality of packaged electronic components 1 and connectors 3 mounted on the circuit board 2 to connect the components 1 to an external circuit. The circuit device is also provided with a resin 4 formed of a thermosetting resin to cover the portions of the connector 3 except connections 3a and the circuit board 2, and cooling piping 5 which is integrally formed with the resin 4 and through which a cooling medium is made to flow to cool the resin 4.
    COPYRIGHT: (C)2006,JPO&NCIPI

    Abstract translation: 要解决的问题：提供一种耐热性提高的发动机控制电路装置，因此可以安装在具有严重的热环境的位置。 发动机控制电路装置设置有安装有多个封装的电子部件1和安装在电路板2上的连接器3的电路板2，以将部件1连接到外部电路。 该电路装置还设置有由热固性树脂形成的树脂4，以覆盖除了连接3a和电路板2之外的连接器3的部分，以及与树脂4一体形成的冷却管道5，并且冷却介质 制成流动以冷却树脂4.版权所有（C）2006，JPO＆NCIPI

    INTEGRATED HEAT SPREADER AND EMI SHIELD
    106.
    发明申请
    INTEGRATED HEAT SPREADER AND EMI SHIELD 审中-公开
    集成散热器和EMI屏蔽

    公开(公告)号：WO2017066302A1

    公开(公告)日：2017-04-20

    申请号：PCT/US2016/056612

    申请日：2016-10-12

    Applicant: GOOGLE INC.

    Inventor： COOPER, James ,  LILJE, Joshua Norman

    IPC: H05K9/00 ,  H01L23/552 ,  H01L23/36 ,  H01L23/367 ,  H01L23/373

    CPC classification number: H05K1/0203 ,  H01L23/36 ,  H01L23/3672 ,  H01L23/373 ,  H01L23/427 ,  H01L23/552 ,  H05K1/0209 ,  H05K1/0216 ,  H05K1/111 ,  H05K1/181 ,  H05K3/303 ,  H05K3/321 ,  H05K2201/0323 ,  H05K2201/064 ,  H05K2201/0707 ,  H05K2201/10371 ,  H05K2201/2018

    Abstract: An electronic device includes a printed circuit board (PCB), the PCB including at least one grounding pad, an integrated circuit mounted on the PCB; an electrically conductive frame mounted on the PCB and surrounding the integrated circuit, the frame being electrically connected to the at least one grounding pad, and a pliant electrically conductive, high-thermal-conductivity heat spreader in electrical contact with the frame and in thermal contact with the integrated circuit. The frame, the heat spreader, and the at least one grounding pad form an EMI shield that reduces EMI leakage from the integrated circuit outside a volume defined by the frame, the heat spreader, and the at least one grounding pad.

    Abstract translation: 一种电子设备，包括印刷电路板（PCB），所述PCB包括至少一个接地焊盘，安装在所述PCB上的集成电路; 安装在所述PCB上并包围所述集成电路的导电框架，所述框架电连接到所述至少一个接地垫;以及柔性导电高导热散热器，与所述框架电接触并且处于热接触 与集成电路。 框架，散热器和至少一个接地垫形成EMI屏蔽，其减少了由框架，散热器和至少一个接地垫限定的体积之外的来自集成电路的EMI泄漏。

    TECHNIQUES FOR IMPLEMENTING A SYNTHETIC JET TO COOL A DEVICE
    107.
    发明申请
    TECHNIQUES FOR IMPLEMENTING A SYNTHETIC JET TO COOL A DEVICE 审中-公开
    用于实施合成喷嘴以冷却装置的技术

    公开(公告)号：WO2016200521A1

    公开(公告)日：2016-12-15

    申请号：PCT/US2016/031143

    申请日：2016-05-06

    Applicant: QUALCOMM INCORPORATED

    Inventor： SAEIDI, Mehdi ,  MITTAL, Arpit ,  RAHIM, Emil ,  MITTAL, Rajat ,  SAMADI, Kambiz

    IPC: H05K7/20 ,  H05K1/02

    CPC classification number: H05K1/0203 ,  G05B15/02 ,  H05K1/0209 ,  H05K1/0272 ,  H05K7/20145 ,  H05K7/20172 ,  H05K7/20209 ,  H05K2201/064

    Abstract: Methods and apparatus for implementing a synthetic jet to cool a device are provided. Examples of the techniques keep a device case cool enough to be hand-held, while allowing a higher temperature of a circuit component located in the case, to maximize circuit performance. In an example, provided is a mobile device including a synthetic jet configured to transfer heat within the mobile device. The synthetic jet can be embedded in a circuit board inside the mobile device such that the circuit board defines at least a portion of a chamber of the synthetic jet and defines an orifice of the synthetic jet. The device case can define at least one fluid channel inside the mobile device. Also, the circuit board can define a synthetic jet outlet configured to direct a fluid at the at least one fluid channel. Also provided are methods for controlling a synthetic jet.

    Abstract translation: 提供了用于实施合成射流以冷却装置的方法和装置。 这些技术的示例使得器件的壳体足够冷却成为手持式，同时允许位于壳体中的电路元件的较高温度以最大化电路性能。 在一个示例中，提供了包括被配置为在移动设备内传递热量的合成射流的移动设备。 合成射流可以嵌入在移动装置内的电路板中，使得电路板限定合成射流的室的至少一部分并且限定合成射流的孔口。 设备壳体可以在移动设备内定义至少一个流体通道。 此外，电路板可以限定配置成在至少一个流体通道处引导流体的合成射流出口。 还提供了用于控制合成射流的方法。

    MICRO-HOLE PERFORATED STRUCTURE
    108.
    发明申请
    MICRO-HOLE PERFORATED STRUCTURE 审中-公开
    微孔执行结构

    公开(公告)号：WO2016195930A1

    公开(公告)日：2016-12-08

    申请号：PCT/US2016/031694

    申请日：2016-05-11

    Applicant: MICROSOFT TECHNOLOGY LICENSING, LLC

    Inventor： DALY, Gregory M. ,  AAGAARD, Karsten ,  MUZZEY, Brett A.

    IPC: H05K1/02 ,  G06F1/20 ,  H05K5/02

    CPC classification number: G06F1/20 ,  B29C33/0033 ,  B29C70/467 ,  B29C70/545 ,  B29K2063/00 ,  B29K2105/08 ,  B29K2307/04 ,  B29L2031/3481 ,  G06F1/1626 ,  G06F1/1656 ,  G06F1/203 ,  H05K1/0209 ,  H05K1/0272 ,  H05K2201/064

    Abstract: Micro-hole structures are described herein that may be implemented for device ventilation, protection, and design. The micro-hole structures include multiple micro-holes that are imperceptible to users at ordinary viewing angles and distances, and are thus porous structures that appear to be solid. A micro-hole structure may be formed as a housing of a device or as a structure to be attached to the housing of the device. A device with a micro-hole structure housing enables thermal ventilation from heat-producing components located within the housing. Additionally, micro-holes of a micro-hole structure may be organized to operate as a design element for the device while simultaneously providing ventilation. The micro-holes are sufficiently small to allow for passage of air through the micro-hole structure while also prohibiting entrance of water and/or other contaminants into the housing of the device.

    Abstract translation: 本文描述了微孔结构，其可以实现用于装置通风，保护和设计。 微孔结构包括在普通视角和距离处用户不可察觉的多个微孔，并且因此是看起来是固体的多孔结构。 微孔结构可以形成为装置的壳体或作为要附接到装置的壳体的结构。 具有微孔结构外壳的装置能够通过位于壳体内的发热部件进行热通风。 此外，可以组织微孔结构的微孔作为设备的设计元件，同时提供通风。 微孔足够小以允许空气通过微孔结构，同时还禁止水和/或其它污染物进入装置的壳体。

    ELECTRONIC DEVICE INCLUDING AN EXTERNALLY-MOUNTED HEAT PIPE
    109.
    发明申请
    ELECTRONIC DEVICE INCLUDING AN EXTERNALLY-MOUNTED HEAT PIPE 审中-公开
    包括外部安装的热管的电子设备

    公开(公告)号：WO2016160356A1

    公开(公告)日：2016-10-06

    申请号：PCT/US2016/022870

    申请日：2016-03-17

    Applicant: MOTOROLA SOLUTIONS, INC.

    Inventor： YEINI, Avraham ,  AKENS, Jody ,  GILMORE, Peter ,  MTCHEDLISHVILI, George

    IPC: H05K7/20

    CPC classification number: H05K1/0203 ,  H01L23/427 ,  H05K1/18 ,  H05K5/061 ,  H05K7/20336 ,  H05K9/0022 ,  H05K2201/064

    Abstract: An electronic device including a housing having a container and a cover. The cover defines an opening. The electronic device also includes a circuit board positioned within the container. The circuit board includes an electrical component that is aligned with the opening. The electronic device further includes a heat pipe mounted to the cover. A portion of the heat pipe extends into the opening of the cover to thermally communicate with the electrical component.

    Abstract translation: 一种电子设备，包括具有容器和盖的壳体。 盖子定义一个开口。 电子设备还包括位于容器内的电路板。 电路板包括与开口对准的电气部件。 电子装置还包括安装到盖的热管。 热管的一部分延伸到盖的开口中以与电气部件热连通。

    LIQUID COOLED METAL CORE PRINTED CIRCUIT BOARD
    110.
    发明申请
    LIQUID COOLED METAL CORE PRINTED CIRCUIT BOARD 审中-公开
    液体冷却金属核心印刷电路板

    公开(公告)号：WO2016044246A1

    公开(公告)日：2016-03-24

    申请号：PCT/US2015/050147

    申请日：2015-09-15

    Applicant: D'ONOFRIO, Nicholas, Michael

    Inventor： D'ONOFRIO, Nicholas, Michael

    IPC: H05K7/20

    CPC classification number: H05K7/20218 ,  H05K1/0209 ,  H05K1/05 ,  H05K3/0061 ,  H05K2201/064 ,  H05K2201/10409 ,  H05K2201/10969

    Abstract: The present disclosure further contemplates a system and method that cools metal core printed circuit boards by circulating a liquid coolant so that it contacts the base metal of the metal core printed circuit board. In one example the present disclosure contemplates a direct liquid cooled MCPCB system that may include a liquid cavity creating component coupled to the base plate of a MCPCB allowing a liquid coolant to come into contact with the base plate of the MCPCB for cooling of the MCPCB. The direct liquid cooled MCPCB system may minimize thermal bottlenecks between the electrical components and the cooling fluid while reducing the number of components required in previous liquid cooled electronics systems.

    Abstract translation: 本公开进一步设想一种通过使液体冷却剂循环使金属芯印刷电路板与金属芯印刷电路板的基底金属接触来冷却金属芯印刷电路板的系统和方法。 在一个示例中，本公开涉及直接液体冷却的MCPCB系统，其可以包括耦合到MCPCB的基板的液体腔产生部件，允许液体冷却剂与MCPCB的基板接触以冷却MCPCB。 直接液体冷却的MCPCB系统可以减少电气部件和冷却流体之间的热瓶颈，同时减少以前的液冷电子系统所需的部件数量。

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