公开(公告)号：EP1771051B1

公开(公告)日：2008-02-27

申请号：EP05021506.0

申请日：2005-09-30

Applicant: Delphi Technologies, Inc.

Inventor： Gärtner, Markus ,  Schmitz, Klaus Dieter

IPC: H05K3/32 ,  H01R12/04

CPC classification number: H01R12/58 ,  H01R12/592 ,  H01R13/41 ,  H01R43/205 ,  H05K3/308 ,  H05K3/326 ,  H05K2201/091 ,  H05K2201/09118 ,  H05K2201/10303 ,  H05K2201/1059 ,  H05K2201/10787

公开(公告)号：EP1121006B1

公开(公告)日：2007-10-03

申请号：EP00311220.8

申请日：2000-12-15

Applicant: ALPS ELECTRIC CO., LTD.

Inventor： Watanabe, Yoshikiyo, Alps Electric Co., Ltd.

IPC: H05K3/34 ,  H05K9/00

CPC classification number: H05K9/0032 ,  H05K3/341 ,  H05K3/3426 ,  H05K9/0035 ,  H05K2201/10371 ,  H05K2201/1078 ,  H05K2201/10787 ,  H05K2201/2018 ,  Y02P70/613

公开(公告)号：EP1121006A2

公开(公告)日：2001-08-01

申请号：EP00311220.8

申请日：2000-12-15

Applicant: ALPS ELECTRIC CO., LTD.

Inventor： Watanabe, Yoshikiyo, Alps Electric Co., Ltd.

IPC: H05K3/34 ,  H05K9/00

CPC classification number: H05K9/0032 ,  H05K3/341 ,  H05K3/3426 ,  H05K9/0035 ,  H05K2201/10371 ,  H05K2201/1078 ,  H05K2201/10787 ,  H05K2201/2018 ,  Y02P70/613

Abstract: A transmitter-receiver unit is disclosed wherein a frame is provided with solder-rise preventing means (H) between a circuit board (1) and retaining portions (4c), thereby preventing solder from rising up to the retaining portions. Thus, the engagement between engaging holes and the retaining portions is ensured in comparison with the prior art. The transmitter-receiver unit permits a cover to be mounted positively to the frame and is suitable for the reduction of size and weight.

Abstract translation: 发射器 - 接收器单元是游离缺失盘worin框架上设置有电路板之间焊接材料向上防止装置（H）（1）和保持部（4c）中，由此从上升到保持部分防止焊料。 因此，接合孔和所述保持部分之间的接合与现有技术相比得到保证。 另外，发送接收单元允许能可靠地安装到所述框架的罩，适合于尺寸和重量的减小。

公开(公告)号：EP0350977B1

公开(公告)日：1992-05-13

申请号：EP89201466.3

申请日：1989-06-08

Applicant: PHILIPS ELECTRONIQUE GRAND PUBLIC ,  Philips Electronics N.V.

Inventor： Guilleminot, Pierre

IPC: H05K3/30 ,  F16B19/00

CPC classification number: F16B21/088 ,  H05K3/308 ,  H05K2201/10568 ,  H05K2201/10598 ,  H05K2201/10787 ,  H05K2201/10878

公开(公告)号：US10076042B2

公开(公告)日：2018-09-11

申请号：US15341378

申请日：2016-11-02

Applicant: Nuvotronics, Inc.

Inventor： David W. Sherrer ,  James R. Reid

IPC: H01L23/48 ,  H02G15/00 ,  H05K3/34 ,  B81C1/00 ,  H01L23/00 ,  H05K1/11 ,  H05K3/40 ,  H05K1/18 ,  H05K3/32

CPC classification number: H05K3/341 ,  B81C1/00357 ,  B81C2201/019 ,  H01L24/26 ,  H01L24/83 ,  H01L2224/26175 ,  H01L2224/291 ,  H01L2224/3015 ,  H01L2224/32227 ,  H01L2224/83191 ,  H01L2224/83815 ,  H01L2924/12042 ,  H05K1/111 ,  H05K1/181 ,  H05K3/321 ,  H05K3/34 ,  H05K3/4007 ,  H05K2201/10674 ,  H05K2201/10787 ,  H05K2201/10984 ,  H05K2203/0465 ,  H05K2203/1173 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/014

Abstract: Structures, materials, and methods to control the spread of a solder material or other flowable conductive material in electronic and/or electromagnetic devices are provided.

公开(公告)号：US09949378B2

公开(公告)日：2018-04-17

申请号：US14251988

申请日：2014-04-14

Applicant: Presidio Components, Inc.

Inventor： Hung Van Trinh

IPC: H01L23/48 ,  H01L23/52 ,  H05K3/34 ,  H01L23/495 ,  H01L23/00 ,  H01L23/498 ,  H01G2/06 ,  B23K1/00 ,  B23K35/26 ,  C22C13/00 ,  H01G4/38 ,  H01G4/232

CPC classification number: H05K3/3426 ,  B23K1/0016 ,  B23K35/262 ,  C22C13/00 ,  H01G2/06 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/38 ,  H01L23/495 ,  H01L23/49548 ,  H01L23/49582 ,  H01L23/498 ,  H01L23/562 ,  H05K2201/10015 ,  H05K2201/10628 ,  H05K2201/10787 ,  H05K2203/047 ,  H05K2203/1173 ,  H05K2203/1377 ,  Y02P70/613

Abstract: An electrical device for soldering to a circuit board with a solder includes a capacitor, a lead frame including a solder dam, and a solder joint electrically coupling the capacitor to the lead frame. The solder dam includes one of a physical barrier to flow or an area of reduced wettability to the solder. The solder dam is between the solder joint and the circuit board. The solder dam is on one or both of a lead portion and main portion of the lead frame. In one embodiment, the first solder dam extends substantially the full width of the first lead portion. The solder dam may be a barrier and/or include a metal oxide. A method of manufacturing the device includes soldering a lead frame to a capacitor with a solder and modifying a surface on the lead frame to include a physical barrier and/or an area of reduced wettability.

公开(公告)号：US09585260B2

公开(公告)日：2017-02-28

申请号：US14260007

申请日：2014-04-23

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jae Hyun Lim ,  Jong In Ryu ,  Sun Ho Kim ,  Eun Jung Jo ,  Kyu Hwan Oh ,  Do Jae Yoo

IPC: H05K1/11 ,  H05K3/34 ,  H05K3/28 ,  H05K3/40 ,  H01L23/00 ,  H05K3/00 ,  H05K3/32

CPC classification number: H05K3/3478 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/111 ,  H05K1/115 ,  H05K3/0052 ,  H05K3/284 ,  H05K3/321 ,  H05K3/4015 ,  H05K2201/09409 ,  H05K2201/09436 ,  H05K2201/10318 ,  H05K2201/10424 ,  H05K2201/10787 ,  H05K2203/0228 ,  H05K2203/1316 ,  H01L2924/00012

Abstract: There are provided an electronic component module capable of increasing a degree of integration by mounting electronic components on both surfaces of a substrate, and a manufacturing method thereof. The electronic component module according to an exemplary embodiment of the present disclosure includes: a substrate; a plurality of electronic components mounted on both surfaces of the substrate; connection conductors each having one end bonded to one surface of the substrate using an conductive adhesive; and a molded portion having the connection conductor embedded therein and formed on one surface of the substrate, wherein the connection conductor may have at least one blocking member preventing a spread of the conductive adhesive.

Abstract translation: 提供一种能够通过将电子部件安装在基板的两个表面上而提高集成度的电子部件模块及其制造方法。 根据本公开的示例性实施例的电子部件模块包括：基板; 安装在所述基板的两个表面上的多个电子部件; 连接导体各自具有使用导电粘合剂结合到基板的一个表面的一端; 以及模制部分，其具有嵌入其中并且形成在基板的一个表面上的连接导体，其中连接导体可以具有防止导电粘合剂扩散的至少一个阻挡构件。

公开(公告)号：US20170055348A1

公开(公告)日：2017-02-23

申请号：US15341378

申请日：2016-11-02

Applicant: Nuvotronics, Inc.

Inventor： David W. Sherrer ,  James R. Reid

IPC: H05K1/11 ,  H01L23/00 ,  H05K1/18 ,  H05K3/34 ,  H05K3/40

CPC classification number: H05K3/341 ,  B81C1/00357 ,  B81C2201/019 ,  H01L24/26 ,  H01L24/83 ,  H01L2224/26175 ,  H01L2224/291 ,  H01L2224/3015 ,  H01L2224/32227 ,  H01L2224/83191 ,  H01L2224/83815 ,  H01L2924/12042 ,  H05K1/111 ,  H05K1/181 ,  H05K3/321 ,  H05K3/34 ,  H05K3/4007 ,  H05K2201/10674 ,  H05K2201/10787 ,  H05K2201/10984 ,  H05K2203/0465 ,  H05K2203/1173 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/014

Abstract: Structures, materials, and methods to control the spread of a solder material or other flowable conductive material in electronic and/or electromagnetic devices are provided.

Abstract translation: 提供了用于控制电子和/或电磁装置中焊料或其它可流动的导电材料的扩散的结构，材料和方法。

公开(公告)号：US09564697B2

公开(公告)日：2017-02-07

申请号：US14540480

申请日：2014-11-13

Applicant: LEAR CORPORATION

Inventor： Bert William Eakins ,  George E. Fox

IPC: H05K1/11 ,  H01R12/58 ,  H01R43/20 ,  H01R4/02 ,  H05K3/34 ,  H05K3/40

CPC classification number: H01R12/707 ,  H01R4/02 ,  H01R4/028 ,  H01R12/585 ,  H01R43/205 ,  H05K3/3447 ,  H05K3/4015 ,  H05K2201/097 ,  H05K2201/10295 ,  H05K2201/10787 ,  H05K2201/10871 ,  H05K2201/2072 ,  H05K2203/047 ,  H05K2203/1572

Abstract: A method of assembling a circuit board may include inserting a first electrical terminal into a first side of a circuit board, and applying a second layer of solder paste to a second side of the circuit board, the second side disposed opposite of the first side. The first electrical terminal may include a solder tab, a maximum length of the solder tab may be shorter than a minimum thickness of the circuit board, and if the first electrical terminal is inserted into the circuit board, the solder tab may extend at least partially into the circuit board without extending entirely through the circuit board. One or more electrical terminals with short and/or long solder tabs may be inserted into the second side of the circuit board and/or one or more electrical components may be attached to second side of circuit board.

Abstract translation: 组装电路板的方法可以包括将第一电端子插入电路板的第一侧，并且将第二层焊膏施加到电路板的第二侧，第二侧与第一侧相对设置。 第一电端子可以包括焊接片，焊接片的最大长度可以短于电路板的最小厚度，并且如果第一电端子插入到电路板中，则焊料片可以至少部分延伸 进入电路板，而不会完全延伸穿过电路板。 具有短和/或长焊料突片的一个或多个电端子可以插入电路板的第二侧和/或一个或多个电气部件可以附接到电路板的第二侧。

公开(公告)号：US20150296623A1

公开(公告)日：2015-10-15

申请号：US14251988

申请日：2014-04-14

Applicant: PRESIDIO COMPONENTS, INC.

Inventor： Hung Van Trinh

IPC: H05K1/18 ,  H05K3/30

CPC classification number: H05K3/3426 ,  B23K1/0016 ,  B23K35/262 ,  C22C13/00 ,  H01G2/06 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/38 ,  H01L23/495 ,  H01L23/49548 ,  H01L23/49582 ,  H01L23/498 ,  H01L23/562 ,  H05K2201/10015 ,  H05K2201/10628 ,  H05K2201/10787 ,  H05K2203/047 ,  H05K2203/1173 ,  H05K2203/1377 ,  Y02P70/613

Abstract: An electrical device for soldering to a circuit board with a solder includes a capacitor, a lead frame including a solder dam, and a solder joint electrically coupling the capacitor to the lead frame. The solder dam includes one of a physical barrier to flow or an area of reduced wettability to the solder. The solder dam is between the solder joint and the circuit board. The solder dam is on one or both of a lead portion and main portion of the lead frame. In one embodiment, the first solder dam extends substantially the full width of the first lead portion. The solder dam may be a barrier and/or include a metal oxide. A method of manufacturing the device includes soldering a lead frame to a capacitor with a solder and modifying a surface on the lead frame to include a physical barrier and/or an area of reduced wettability.

Abstract translation: 用于焊接到具有焊料的电路板的电气装置包括电容器，包括焊料坝的引线框架和将电容器电耦合到引线框架的焊接接头。 焊料坝包括流动的物理阻挡层或对焊料的润湿性降低的区域之一。 焊点位于焊点和电路板之间。 焊料坝在引线框架的引线部分和主要部分中的一个或两个上。 在一个实施例中，第一焊料坝基本上延伸第一引线部分的整个宽度。 焊料坝可以是阻挡层和/或包括金属氧化物。 一种制造该器件的方法包括用引线焊接引线框架到电容器，并修改引线框架上的表面以包括物理屏障和/或具有降低的润湿性的区域。