公开(公告)号：DE102005042035A1

公开(公告)日：2007-03-08

申请号：DE102005042035

申请日：2005-09-02

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MAHLER JOACHIM ,  HAIMERL ALFRED ,  SCHOBER WOLFGANG ,  BAUER MICHAEL ,  KESSLER ANGELA

IPC: C08L101/00 ,  B29C45/14 ,  B29C45/20 ,  C08J5/04 ,  C08J5/10 ,  C08K5/17 ,  C09D5/25 ,  C09D163/00 ,  H01L23/29

公开(公告)号：DE102005037321A1

公开(公告)日：2007-02-15

申请号：DE102005037321

申请日：2005-08-04

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MAHLER JOACHIM ,  HAIMERL ALFRED ,  SCHOBER WOLFGANG ,  BAUER MICHAEL ,  KESSLER ANGELA

IPC: H01L23/48 ,  H01L21/48 ,  H01L21/60

Abstract: The invention relates to a semiconductor device with conductor tracks between a semiconductor chip and a circuit carrier, and to a method for producing the same. The conductor tracks extend from contact areas on the top side of the semiconductor chip to contact pads on the circuit carrier. The conductor tracks include an electrically conductive polymer in the semiconductor device.

公开(公告)号：DE102005025465A1

公开(公告)日：2006-12-14

申请号：DE102005025465

申请日：2005-05-31

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MAHLER JOACHIM ,  HOSSEINI KHALIL ,  KNAUER EDUARD ,  ROESL KONRAD ,  MEDERER PETER

IPC: H01L23/16 ,  C08G59/18 ,  C08G73/06 ,  C09D163/00 ,  C09D167/00 ,  C09D177/00 ,  C09D179/08 ,  H01L21/56 ,  H01L21/60 ,  H01L23/28 ,  H01L23/49

Abstract: Semiconductor unit comprises: a circuit carrier (2) with interior contact areas (5), exhibiting a first material with a first electro-chemical potential; a semiconductor chip (3) with an active surface (13) and a flipside (11), where the active surface exhibits chip contact areas (14) having a second material with second electro-chemical potential; and bonding wire connections (15) between the chip contact areas and the interior contact areas of the circuit carrier, where the bonding wire connection exhibits a third material with a third electro-chemical potential. Semiconductor unit comprises: a circuit carrier (2) with interior contact areas (5), exhibiting a first material with a first electro-chemical potential; a semiconductor chip (3) with an active surface (13) and a flipside (11), where the active surface exhibits chip contact areas (14) having a second material with second electro-chemical potential; and bonding wire connections (15) between the chip contact areas and the interior contact areas of the circuit carrier, where the bonding wire connection exhibits a third material with a third electro-chemical potential, and the connection place between the chip contact areas and the bonding wire connection and/or the connection place between the interior contact areas and the bonding wire connection are coated with a corrosion protecting layer. An independent claim is included for the preparation of the semiconductor unit.

公开(公告)号：DE102005020453A1

公开(公告)日：2006-11-09

申请号：DE102005020453

申请日：2005-04-29

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BAUER MICHAEL ,  WIENEKE-KESSLER ANGELA ,  SCHOBER WOLFGANG ,  HAIMERL ALFRED ,  MAHLER JOACHIM

IPC: H01L23/495 ,  B82B1/00 ,  B82B3/00 ,  H01L21/48

Abstract: A lead structure for a semiconductor component includes: external leads for external connections outside a plastic housing composition, internal leads for electrical connections within the plastic housing composition, and a chip mounting island composed of the lead material. While leaving free contact pads of the internal leads, the top sides of the chip mounting island and the internal leads are equipped with nanotubes as an anchoring layer. The plastic housing composition is arranged in the interspaces between the nanotubes arranged on the internal leads, while an adhesive composition for the semiconductor chip is arranged in the interspaces between the nanotubes arranged on the chip mounting island. The adhesive composition and the plastic housing composition fill the interspaces in a manner free of voids.

公开(公告)号：DE102005015454A1

公开(公告)日：2006-10-05

申请号：DE102005015454

申请日：2005-04-04

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BAUER MICHAEL ,  KESSLER ANGELA ,  SCHOBER WOLFGANG ,  MAHLER JOACHIM ,  HAIMERL ALFRED

IPC: H01L23/48 ,  B32B15/02 ,  B81B1/00 ,  B81C1/00 ,  C08K3/10 ,  C08K5/56 ,  C08L83/00 ,  C08L101/00 ,  G01N33/50 ,  H01L21/48 ,  H01L23/057 ,  H01L23/16

Abstract: Semiconductor sensor component comprises a cavity container (2) and components arranged in a cavity (3) of the container, which exhibit a sensor chip (4) with sensor range (5), where the cavity container exhibits an opening (6), the sensor range is turned to the opening, the sensor chip is embedded in the cavity of the container into back or edges of a rubber elastic layer (7) that exhibits cleavable store-metal-organic or inorganic metal containing-complex (11), which lies freely at the top side of the elastic layer and forms metallic-germs for wiring lines (14). Semiconductor sensor component comprises a cavity container (2) and components arranged in a cavity (3) of the container, which exhibit a sensor chip (4) with sensor range (5), where the cavity container exhibits an opening (6) for adjacency and the sensor range is turned to the opening, the sensor chip is embedded in the cavity of the container into back or edges of a rubber elastic layer (7) that exhibits cleavable store-metal-organic or inorganic metal containing-complex (11), which lies freely at the top side of the elastic layer and forms metallic-germs for wiring lines (14), the wiring lines electrically connects to the sensor range of the sensor chip with contact connection areas in the cavity of the cavity container, the top of the components within the cavity container is arranged to an elastic sealing layer (17). An independent claim is included for the preparation of semiconductor sensor components.

公开(公告)号：DE102004058877A1

公开(公告)日：2006-04-13

申请号：DE102004058877

申请日：2004-12-06

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BAUER MICHAEL ,  KESSLER ANGELA ,  SCHOBER WOLFGANG ,  HAIMERL ALFRED ,  MAHLER JOACHIM

IPC: B81B1/00 ,  B81C1/00 ,  H01L21/50 ,  H01L29/06 ,  H01L31/0248 ,  H01L33/00

Abstract: Semiconductor chip (1) comprises a front section (3) with a semiconductor functional element, and a rear section (4). The rear section has at least one cut out (2). A section of the rear surface has a solderable metal layer (8).

公开(公告)号：DE102004047522B3

公开(公告)日：2006-04-06

申请号：DE102004047522

申请日：2004-09-28

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BAUER MICHAEL ,  KESSLER ANGELA ,  SCHOBER WOLFGANG ,  HAIMERL ALFRED ,  MAHLER JOACHIM

IPC: H01L23/50 ,  H01L21/768 ,  H01L23/52 ,  H01L23/522

Abstract: A semiconductor chip (1) has a metal coating structure (2) which has on an active upper side (3) of the semiconductor chip (1) at least one lower metal layer (8) with copper or copper alloy, on which a central metal layer (9) with nickel is arranged. The metal coating structure (2) is terminated by an upper metal layer (10) of palladium and/or a precious metal. The central metal layer (9) with nickel and/or nickel phosphide has a rough interface (11) with respect to the plastic package molding compound surrounding the metal coating structure (2).

公开(公告)号：DE102004032605A1

公开(公告)日：2006-01-26

申请号：DE102004032605

申请日：2004-07-05

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MAHLER JOACHIM

IPC: H01L21/50 ,  H01L23/42 ,  H01L23/50

Abstract: A semiconductor device with a semiconductor chip and electrical connecting elements to a conductor structure, and a method for producing the same is disclosed. In one embodiment, the conductor structure has a chip island and contact terminal areas. These are arranged in a coplanar manner in relation to each other. The semi-conductor structure is selectively coated by a filled plastic film. Both the semiconductor chip and the electrical connecting elements are mechanically fixed and electrically connected by means of the film-covered chip island and the film-covered contact terminal areas, respectively.

公开(公告)号：DE102004027787A1

公开(公告)日：2006-01-05

申请号：DE102004027787

申请日：2004-06-08

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HAIMERL ALFRED ,  KESSLER ANGELA ,  SCHOBER WOLFGANG ,  BAUER MICHAEL ,  MAHLER JOACHIM

IPC: H01L21/50 ,  H01L21/56 ,  H01L23/055 ,  H01L23/28 ,  H01L23/31

Abstract: The invention relates to a semiconductor component having a plastic housing and a semiconductor chip (2). The semiconductor chip (2) is mounted on a mounting side (3) of a system support (4). The system support (4) comprises a wiring structure (5), which is mechanically and electrically connected to the semiconductor chip (2) via electrical connecting elements (6). The plastic housing has a flattened thermoplastic material (7), which embeds the semiconductor chip (2) and the connecting elements (6) and which is placed on the mounting side (3) of the system support (4).

公开(公告)号：DE10204016A1

公开(公告)日：2003-04-30

申请号：DE10204016

申请日：2002-01-31

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MAHLER JOACHIM

IPC: H01L21/56 ,  H01L23/32 ,  H01L23/50

Abstract: Electronic component comprises a semiconductor chip (3) arranged on a substrate (2) in flip-chip technology and having outer contacts (6) arranged on contact surfaces (5) on its active upper side (4). The component has a buffer layer (7) arranged between the active upper side of the chip and substrate and between the outer contacts. An Independent claim is also included for a process for the production of the electronic component.