Abstract:
The projection lithographic method for producing integrated circuits and forming patterns with extremely small feature dimensions includes an illumination sub-system (36) for producing and directing an extreme ultraviolet soft x-ray radiation λ from an extreme ultraviolet soft x-ray source (38); a mask stage (22) illuminated by the extreme ultraviolet soft x-ray radiation λ produced by illumination stage and the mask stage (22) includes a pattern when illuminated by radiation λ. A protection sub-system includes reflective multilayer coated Ti doped high purity SiO2 glass defect free surface (32) and printed media subject wafer which has a radiation sensitive surface.
Abstract:
Glass powders and methods for producing glass powders. The powders preferably have a small particle size, narrow size distribution and a spherical morphology. The method includes forming the particles by a spray pyrolysis technique. The invention also includes novel devices and products formed from the glass powders.
Abstract:
Highly durable silica glass containing 0.01% to 2% by weight of at least one element selected from magnesium, calcium, strontium, barium, yttrium, hafnium and zirconium. The silica glass is produced by melting a powdery material comprising a finely divided silica powder and a finely divided zirconium-containing substance by oxyhydrogen flame or plasma are to form an accumulated molten material layer, and extending the molten material layer outwardly in radial directions.
Abstract:
An optical member made of silica glass manufactured by the direct method where a material gas comprising an organosilicon compound is allowed to react in an oxidizing flame, said optical member having a 2null1014 molecules/cm3 or less concentration of formyl radical generated by X-ray irradiation whose dose is 0.01 Mrad or more and 1 Mrad or less.
Abstract translation:通过直接法制造的由石英玻璃制成的光学构件,其中包含有机硅化合物的材料气体在氧化火焰中反应,所述光学构件具有2×10 14分子/ cm 3或更低浓度的甲酰基 其剂量为0.01Mrad以上且1Mrad以下的X射线照射产生。
Abstract:
A method for making silica includes delivering a silica precursor comprising a perfluorinated group to a conversion site and passing the silica precursor through a conversion flame to produce silica soot.
Abstract:
An object of the present invention is to provide a synthetic quartz glass optical material having a high optical transmittance for a radiation 157 nm in wavelength emitted from F2 excimer laser and a high resistance against irradiation of a F2 excimer laser radiation, yet having a uniformity suitable for such a fine patterning using a F2 excimer laser, and to provide an optical member using the same. The problems above are solved by a synthetic quartz glass optical material for F2 excimer lasers having an OH group concentration of 0.5 ppm or lower, a fluorine concentration of 0.1 to 2 mol %, a hydrogen molecule concentration of 5×1016 molecules/cm3 or lower, a difference between the maximum and minimum fluorine concentrations within 20 mol ppm, and a difference between the maximum and minimum refraction indices of 2×10−5 or lower.
Abstract translation:本发明的目的是提供一种合成石英玻璃光学材料,其对于从F2准分子激光器发射的波长为157nm的辐射具有高的透光率,并且具有高的对F2准分子激光辐射照射的抗性,但具有适合的均匀性 对于使用F2准分子激光器的精细图案化,并提供使用其的光学部件。 上述问题由OH基浓度为0.5ppm以下,氟浓度为0.1〜2mol%,氢分子浓度为5×10 16分子/ cm 2的F2准分子激光的合成石英玻璃光学材料解决, 3>以下,最大和最小氟浓度在20mol ppm内的差异,以及最大和最小折射率之间的差异为2×10 -5或更低。
Abstract:
Dental glass powders, methods for producing the powders and dental compositions including the glass powders. The powders preferably have a well-controlled particle size, narrow size distribution and a spherical morphology. The method includes forming the particles by a spray pyrolysis technique. The invention also includes dental filler and restorative compositions that include the glass powders.
Abstract:
High purity direct deposit vitrified silicon oxyfluoride glass suitable for use as a photomask substrates for photolithography applications in the VUV wavelength region below 190 nm is disclosed. The inventive direct deposit vitrified silicon oxyfluoride glass is transmissive at wavelengths around 157 nm, making it particularly useful as a photomask substrate at the 157 nm wavelength region. The inventive photomask substrate is a dry direct deposit vitrified silicon oxyfluoride glass which exhibits very high transmittance in the vacuum ultraviolet (VUV) wavelength region while maintaining the excellent thermal and physical properties generally associated with high purity fused silica. In addition to containing fluorine and having little or no OH content, the inventive direct deposit vitrified silicon oxyfluoride glass suitable for use as a photomask substrate at 157 nm is also characterized by having less than 1null1017 molecules/cm3 of molecular hydrogen and low chlorine levels.
Abstract:
High purity direct deposit vitrified silicon oxyfluoride glass suitable for use as a photomask substrates for photolithography applications in the VUV wavelength region below 190 nm is disclosed. The inventive direct deposit vitrified silicon oxyfluoride glass is transmissive at wavelengths around 157 nm, making it particularly useful as a photomask substrate at the 157 nm wavelength region. The inventive photomask substrate is a dry direct deposit vitrified silicon oxyfluoride glass which exhibits very high transmittance in the vacuum ultraviolet (VUV) wavelength region while maintaining the excellent thermal and physical properties generally associated with high purity fused silica. In addition to containing fluorine and having little or no OH content, the inventive direct deposit vitrified silicon oxyfluoride glass suitable for use as a photomask substrate at 157 nm is also characterized by having less than 1×1017 molecules/cm3 of molecular hydrogen and low chlorine levels.
Abstract:
A synthetic quartz glass for optical use, to be used by irradiation with light within a range of from the ultraviolet region to the vacuum ultraviolet region, which contains fluorine, which has a ratio of the scattering peak intensity of 2250 cm−1 (I2250) to the scattering peak intensity of 800 cm−1 (I800), i.e. I2250/I800, of at most 1×10−4 in the laser Raman spectrum, and which has an absorption coefficient of light of 245 nm of at most 2×10−3 cm−1.