公开(公告)号：WO2011097462A2

公开(公告)日：2011-08-11

申请号：PCT/US2011/023724

申请日：2011-02-04

Applicant: KODADEK, III, Robert, E.

Inventor： KODADEK, III, Robert, E.

IPC: H05K7/20 ,  H01L33/64

CPC classification number: F21V29/67 ,  F21V29/02 ,  F21V29/673 ,  F21Y2115/10 ,  H05K1/0206 ,  H05K1/0209 ,  H05K1/0272 ,  H05K2201/064 ,  H05K2201/066 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/10106 ,  H05K2201/10242 ,  H05K2201/10257 ,  H05K2201/10545

Abstract: A thermal management system for an electrical component includes a printed circuit board (PCB) capable of receiving the electrical component on a first side of the PCB. An elongate member has one end attached to a second side of the PCB, and another end disposed away from the PCB. The elongate member also has an open interior that facilitates fluid communication between the two ends. One of the ends defines an at least partially closed boundary on the PCB. The PCB includes an aperture disposed therethrough proximate the boundary such that fluid communication is facilitated between the first side of the PCB and the second side of the PCB, and along at least a portion of the elongate member.

Abstract translation: 用于电气部件的热管理系统包括能够接收PCB的第一侧上的电气部件的印刷电路板（PCB）。 细长构件具有连接到PCB的第二侧的一端，以及远离PCB设置的另一端。 细长构件还具有有利于两端之间的流体连通的开放内部。 端部中的一个限定了PCB上的至少部分闭合的边界。 PCB包括邻近边界设置穿过的孔，使得在PCB的第一侧和PCB的第二侧之间以及沿着细长构件的至少一部分便于流体连通。

公开(公告)号：WO2006077163A3

公开(公告)日：2007-02-15

申请号：PCT/EP2006000612

申请日：2006-01-24

Applicant: JUMA PCB GMBH ,  WOELFEL MARKUS

Inventor： WOELFEL MARKUS

IPC: H05K1/02 ,  H05K3/10 ,  H05K3/22

CPC classification number: H05K3/103 ,  H05K1/0272 ,  H05K3/222 ,  H05K2201/064 ,  H05K2201/098 ,  H05K2201/10257 ,  H05K2201/1028 ,  H05K2201/10287

Abstract: The invention relates to a wire-printed circuit board or card (1) comprising conductors (6) that run on and/or in the circuit board or card between connection points (4). The aim of the invention is to improve a circuit board of this type. To achieve this, at least one of the conductors (6) has a rectangular or square cross-section. In addition, at least some of the conductors have a hollow cross-section, in which a coolant or heating agent circulates.

Abstract translation: 本发明涉及的线描述的印刷电路板或板（1）上和/或在连接点之间的印刷电路板或卡（4）延伸的线（6）。 为了改善这样的电路板，它提供了引线（6）中的至少一个具有矩形或正方形横截面。 还可以设想的是，至少一些引线的中空横截面，其中autweisen的循环的冷却剂或加热装置。

公开(公告)号：WO1998028793A1

公开(公告)日：1998-07-02

申请号：PCT/US1997023615

申请日：1997-12-19

Applicant: GENERAL ELECTRIC COMPANY

Inventor： GENERAL ELECTRIC COMPANY ,  WOJNAROWSKI, Robert, John

IPC: H01L23/48

CPC classification number: H01L24/02 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L2224/0401 ,  H01L2224/16225 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01021 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3511 ,  H05K3/326 ,  H05K3/3436 ,  H05K3/4092 ,  H05K2201/0373 ,  H05K2201/10257 ,  H05K2201/10378 ,  Y02P70/613 ,  Y10S428/901 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T428/24917 ,  H01L2924/00

Abstract: An interface includes floating pad metallization (30 or 630) patterned over a dielectric interface layer with a first portion forming a central pad (26 or 626) and a second portion forming an extension (28 or 628) from the central pad extending into an interface via. Another interface includes a floating contact structure including electrically conductive material (214) coating a hole with at least some of the floating pad metallization forming an extension (216) from the hole. A conductive contact area interface includes at least one interface structure (22, 24, 26, 28, or 30) coupled between first and second contact areas (112 and 118) and including an electrical conductor having a partially open interior to form a compliant joint between the first and second contact areas.

Abstract translation: 接口包括在介电界面层上图案化的浮动衬垫金属化（30或630），第一部分形成中心焊盘（26或626），第二部分形成从中心焊盘延伸到接口中的延伸部（28或628） 通过。 另一接口包括浮动接触结构，其包括涂覆孔的导电材料（214），其中至少一些浮垫金属化从孔形成延伸部（216）。 导电接触区界面包括耦合在第一和第二接触区域（112和118）之间的至少一个界面结构（22,24,26,28或30），并且包括具有部分开放的内部以形成柔顺接头 在第一和第二接触区域之间。

公开(公告)号：WO1997044859A1

公开(公告)日：1997-11-27

申请号：PCT/US1997008783

申请日：1997-05-22

Applicant: TESSERA, INC.

Inventor： TESSERA, INC. ,  FJELSTAD, Joseph ,  DISTEFANO, Thomas, H. ,  KARAVAKIS, Konstantine ,  FARACI, Anthony, B. ,  NGUYEN, Tan

IPC: H01R09/09

CPC classification number: H01L23/32 ,  H01L23/49827 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/45144 ,  H01L2224/73251 ,  H01L2224/81191 ,  H01L2224/81385 ,  H01L2224/81901 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/351 ,  H01R12/52 ,  H05K3/326 ,  H05K3/3436 ,  H05K3/4092 ,  H05K7/1061 ,  H05K2201/0397 ,  H05K2201/049 ,  H05K2201/10257 ,  H05K2201/10378 ,  H05K2203/041 ,  Y02P70/613 ,  Y10T29/49149 ,  H01L2924/00 ,  H01L2224/16 ,  H01L2224/72

Abstract: A connector (10) for microelectronic elements includes a sheetlike body (24) having a plurality of active contacts (22) arranged in a regular grid pattern. The active contacts (22) may include several metallic projections (28) extending inwardly around a hole (27) in the sheetlike element (24), on a first major surface (32). A support structure such as a grid array of noncollapsing structural posts (23) is on a second major surface (33), and each of the posts (23) is electrically connected to one of the active contacts (22). The grid array of the posts (23) and the grid array of active contacts (22) are offset from one another so that an active contact (22) is surrounded by several posts (23). The posts (23) support the sheetlike element (24) spaced away from a substrate (41) to which the posts (23) are attached. A microelectronic element (45) having bump leads (46) thereon may be engaged by contacting the bump leads (46) with the active contacts (22), and deflecting the sheetlike element (24) between the bump leads (46) on one side and the posts (23) on the other side.

Abstract translation: 用于微电子元件的连接器（10）包括具有以规则网格图案布置的多个有源触点（22）的片状体（24）。 活动触头（22）可以包括在第一主表面（32）上在片状元件（24）内围绕孔（27）向内延伸的几个金属突起（28）。 诸如非隔离结构柱（23）的网格阵列之类的支撑结构位于第二主表面（33）上，并且每个柱（23）电连接到一个有源触点（22）。 柱（23）的格栅阵列和活动触点（22）的网格阵列彼此偏移，使得活动触点（22）被多个柱（23）包围。 支柱（23）支撑与柱（23）连接的基板（41）间隔开的片状元件（24）。 在其上具有凸起引线（46）的微电子元件（45）可以通过使凸块引线（46）与有源触头（22）接触而接合，并且使片状元件（24）在一侧的凸块引线（46）之间偏转 和另一侧的柱（23）。

公开(公告)号：EP3182811A1

公开(公告)日：2017-06-21

申请号：EP16202383.2

申请日：2016-12-06

Applicant: LG Display Co., Ltd.

Inventor： LEE, Jaeseung

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/14 ,  H05K1/0215 ,  H05K1/0298 ,  H05K1/181 ,  H05K2201/04 ,  H05K2201/10128 ,  H05K2201/10136 ,  H05K2201/10257 ,  H05K2201/1031 ,  H05K2201/10409 ,  H05K2201/20 ,  H05K2201/2036 ,  Y02P70/611

Abstract: A printed circuit board (100) and a display device (200) are provided. The printed circuit board (100) includes a plurality of insulation layers (110a-110e); at least one metal layer (120a-120d) between the plurality of insulation layers (110a-110e); and a fixing member (130) fixed to a surface of one (120d) of the at least one metal layer (120a-120d) and passing through an outermost one (110e) of the insulation layers (110a-110e) to protrude to the outside.

Abstract translation: 印刷电路板（100）和显示装置（200）被提供。 印刷电路板（100）包括多个绝缘层（110a-110e）; 在所述多个绝缘层（110a-110e）之间的至少一个金属层（120a-120d）; 以及固定到所述至少一个金属层（120a-120d）中的一个（120d）的表面并且穿过所述绝缘层（110a-110e）的最外面的一个（110e）以突出到所述绝缘层 外。

公开(公告)号：EP3170375A1

公开(公告)日：2017-05-24

申请号：EP15759500.0

申请日：2015-07-09

Applicant: Valeo Equipements Electriques Moteur

Inventor： GUERIN, Fabien ,  CANCIANI, Thierry ,  DUARTE, Johnny

IPC: H05K1/05 ,  H05K3/34 ,  H05K7/20 ,  H05K7/14

CPC classification number: H05K7/1432 ,  F02B33/40 ,  F02B39/10 ,  F04D25/068 ,  F04D25/0693 ,  H02K3/522 ,  H02K5/225 ,  H02K11/33 ,  H05K1/05 ,  H05K3/3447 ,  H05K3/4015 ,  H05K3/445 ,  H05K2201/10015 ,  H05K2201/10257 ,  H05K2201/1031 ,  H05K2201/10916 ,  H05K2201/10962 ,  Y02P70/611

Abstract: DC/AC power converter, said converter comprising an electronic power board produced in an insulated metal substrate (11) comprising: a metal carrier (43) forming the back side of said insulated metal substrate (11); and an insulating layer (42) covering the metal carrier, forming the front side of said insulated metal substrate (11), the converter furthermore comprising at least one component (30) mounted on the back side of the insulated metal substrate (11), said component (30) comprising at least one pin (32) that passes through the insulated metal substrate (11) via a through-hole (46) in said insulated metal substrate (11), said component (30) being soldered to at least one electrical connection track (41) by means of an intermediate part (70) placed on the front side of said insulated metal substrate (11) and allowing said at least one electrical connection track and the pin of the component (30) to be interfaced.

Abstract translation: 本发明涉及一种电动增压压缩机，其包括：用于驱动压缩机的旋转电机（200），用于为旋转电机（200）供电并且被配置为安装在电动机（200）的壳体（50）上的电源装置 所述电源装置包括至少一个电子部件（30），所述电子部件（30）安装在所述电源装置的一侧上，使得所述电子部件位于所述旋转电机（200）的上方。

公开(公告)号：EP1842402B2

公开(公告)日：2012-11-28

申请号：EP06706388.3

申请日：2006-01-24

Applicant: JUMATECH GmbH

Inventor： WÖLFEL, Markus

IPC: H05K1/02 ,  H05K3/10 ,  H05K3/22

CPC classification number: H05K3/103 ,  H05K1/0272 ,  H05K3/222 ,  H05K2201/064 ,  H05K2201/098 ,  H05K2201/10257 ,  H05K2201/1028 ,  H05K2201/10287

公开(公告)号：EP1842402A2

公开(公告)日：2007-10-10

申请号：EP06706388.3

申请日：2006-01-24

Applicant: JUMATECH GmbH

Inventor： WÖLFEL, Markus

IPC: H05K1/02 ,  H05K3/10 ,  H05K3/22

CPC classification number: H05K3/103 ,  H05K1/0272 ,  H05K3/222 ,  H05K2201/064 ,  H05K2201/098 ,  H05K2201/10257 ,  H05K2201/1028 ,  H05K2201/10287

Abstract: The invention relates to a wire-printed circuit board or card (1) comprising conductors (6) that run on and/or in the circuit board or card between connection points (4). The aim of the invention is to improve a circuit board of this type. To achieve this, at least one of the conductors (6) has a rectangular or square cross-section. In addition, at least some of the conductors have a hollow cross-section, in which a coolant or heating agent circulates.

公开(公告)号：EP1041616A4

公开(公告)日：2005-05-11

申请号：EP98953052

申请日：1998-11-13

Applicant: MATSUSHITA ELECTRIC IND CO LTD

Inventor： TAKEZAWA HIROAKI ,  TSUKAMOTO MASAHIDE ,  ITAGAKI MINEHIRO ,  BESSHO YOSHIHIRO ,  HATANAKA HIDEO ,  FUKUMURA YASUSHI ,  EDA KAZUO ,  ISHIDA TORU

IPC: H01L23/12 ,  H01L21/60 ,  H01L23/32 ,  H01L23/498 ,  H05K1/02 ,  H05K3/10 ,  H05K3/32 ,  H05K3/34 ,  H01L21/768

CPC classification number: H05K3/3436 ,  H01L23/49816 ,  H01L2224/16225 ,  H05K1/0271 ,  H05K3/105 ,  H05K3/321 ,  H05K2201/0212 ,  H05K2201/0379 ,  H05K2201/10257 ,  H05K2201/10992 ,  H05K2203/121 ,  Y02P70/613 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/254 ,  Y10T428/31681

Abstract: A stress relaxation electronic part to be mounted on a wiring board and having a conductive stress relaxing mechanism body on the side where the part is connected to the wiring board.

公开(公告)号：EP0920711A1

公开(公告)日：1999-06-09

申请号：EP97952567.0

申请日：1997-12-19

Applicant: GENERAL ELECTRIC COMPANY

Inventor： WOJNAROWSKI, Robert, John

IPC: H01L23 ,  H01L21 ,  H05K3

CPC classification number: H01L24/02 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L2224/0401 ,  H01L2224/16225 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01021 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3511 ,  H05K3/326 ,  H05K3/3436 ,  H05K3/4092 ,  H05K2201/0373 ,  H05K2201/10257 ,  H05K2201/10378 ,  Y02P70/613 ,  Y10S428/901 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T428/24917 ,  H01L2924/00

Abstract: An interface includes floating pad metallization (30 or 630) patterned over a dielectric interface layer with a first portion forming a central pad (26 or 626) and a second portion forming an extension (28 or 628) from the central pad extending into an interface via. Another interface includes a floating contact structure including electrically conductive material (214) coating a hole with at least some of the floating pad metallization forming an extension (216) from the hole. A conductive contact area interface includes at least one interface structure (22, 24, 26, 28, or 30) coupled between first and second contact areas (112 and 118) and including an electrical conductor having a partially open interior to form a compliant joint between the first and second contact areas.