In-situ cleaning using hydrogen peroxide as co-gas to primary dopant or purge gas for minimizing carbon deposits in an ion source

    公开(公告)号:US10170286B2

    公开(公告)日:2019-01-01

    申请号:US15281844

    申请日:2016-09-30

    Abstract: An ion source assembly and method is provided for improving ion implantation performance. The ion source assembly has an ion source chamber and a source gas supply provides a molecular carbon source gas such as toluene to the ion source chamber. A source gas flow controller controls a flow of the molecular carbon source gas to the ion source chamber. An excitation source excites the molecular carbon source gas, forming carbon ions and atomic carbon. An extraction electrode extracts the carbon ions from the ion source chamber, forming an ion beam. A hydrogen peroxide co-gas supply provides a predetermined concentration of hydrogen peroxide co-gas to the ion source chamber, and a hydrogen peroxide co-gas flow controller controls a flow of the hydrogen peroxide gas to the ion source chamber. The hydrogen peroxide co-gas decomposes within the ion source chamber and reacts with the atomic carbon from the molecular carbon source gas in the ion source chamber, forming hydrocarbons within the ion source chamber. An inert gas is further introduced and ionized to counteract oxidation of a cathode due to the decomposition of the hydrogen peroxide. A vacuum pump system removes the hydrocarbons from the ion source chamber, wherein deposition of atomic carbon within the ion source chamber is reduced and a lifetime of the ion source chamber is increased.

    IN SITU BEAM CURRENT MONITORING AND CONTROL IN SCANNED ION IMPLANTATION SYSTEMS

    公开(公告)号:US20180068828A1

    公开(公告)日:2018-03-08

    申请号:US15258723

    申请日:2016-09-07

    Abstract: A system and method for controlling an ion implantation system as a function of sampling ion beam current and uniformity thereof. The ion implantation system includes a plurality of ion beam optical elements configured to selectively steer and/or shape the ion beam as it is transported toward a workpiece, wherein the ion beam is sampled at a high frequency to provide a plurality of ion beam current samples, which are then analyzed to detect fluctuations and/or nonuniformities or unpredicted variations amongst the plurality of ion beam current samples. Beam current samples are compared against predetermined threshold levels, and/or predicted nonuniformity levels to generate a control signal when a detected nonuniformity in the plurality of ion beam current density samples exceeds a predetermined threshold. A control system can be configured to generate a control signal for interlocking the ion beam transport in the ion implantation system or for varying an input to at least one beam optical element to control variations in beam current.

    HIGH THROUGHPUT SERIAL WAFER HANDLING END STATION

    公开(公告)号:US20170178933A1

    公开(公告)日:2017-06-22

    申请号:US15391086

    申请日:2016-12-27

    Abstract: An ion implantation apparatus, system, and method are provided for transferring a plurality of workpieces between vacuum and atmospheric pressures, wherein an alignment mechanism is operable to align a plurality of workpieces for generally simultaneous transportation to a dual-workpiece load lock chamber. The alignment mechanism comprises a characterization device, an elevator, and two vertically-aligned workpiece supports for supporting two workpieces. First and second atmospheric robots are configured to generally simultaneously transfer two workpieces at a time between load lock modules, the alignment mechanism, and a FOUP. Third and fourth vacuum robots are configured to transfer one workpiece at a time between the load lock modules and a process module.

    HIGH THROUGHPUT COOLED ION IMPLANTATION SYSTEM AND METHOD
    130.
    发明申请
    HIGH THROUGHPUT COOLED ION IMPLANTATION SYSTEM AND METHOD 有权
    高通量冷却离子植入系统和方法

    公开(公告)号:US20170040141A1

    公开(公告)日:2017-02-09

    申请号:US14817893

    申请日:2015-08-04

    Abstract: An ion implantation system has a process chamber having a process environment, and an ion implantation apparatus configured to implant ions into a workpiece supported by a chuck within the process chamber. A load lock chamber isolates the process (vacuum) environment from an atmospheric environment, wherein a load lock workpiece support supports the workpiece therein. An isolation chamber is coupled to the process chamber with a pre-implant cooling environment defined therein. An isolation gate valve selectively isolates the pre-implant cooling environment from the process environment wherein the isolation chamber comprises a pre-implant cooling workpiece support for supporting and cooling the workpiece. The isolation gate valve is the only access path for the workpiece to enter and exit the isolation chamber. A pressurized gas selectively pressurizes the pre-implant cooling environment to a pre-implant cooling pressure that is greater than the process pressure for expeditious cooling of the workpiece. A workpiece transfer arm transfer the workpiece between the load lock chamber, isolation chamber, and chuck. A controller controls the workpiece transfer arm selectively cools the workpiece to a pre-implant cooling temperature in the isolation chamber at the pre-implant cooling pressure via a control of the isolation gate valve, pre-implant cooling workpiece support, and pressurized gas source.

    Abstract translation: 离子注入系统具有处理室,其具有工艺环境,以及离子注入装置,被配置为将离子注入到由处理室内的卡盘支撑的工件中。 加载锁定室将工艺(真空)环境与大气环境隔离,其中负载锁定工件支撑件支撑其中的工件。 隔离室通过在其中限定的植入前冷却环境耦合到处理室。 隔离闸阀选择性地将植入前冷却环境与过程环境隔离,其中隔离室包括用于支撑和冷却工件的植入物前冷却工件支撑件。 隔离闸阀是工件进出隔离室的唯一进入路径。 加压气体选择性地将植入物前冷却环境加压到大于工艺压力的植入前冷却压力,以便于快速冷却工件。 工件传送臂在加载锁定室,隔离室和卡盘之间传送工件。 控制器控制工件传送臂通过隔离闸阀,预植入物冷却工件支撑件和加压气体源的控制,以预植入物冷却压力选择性地将工件冷却至隔离室中的植入前冷却温度。

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