公开(公告)号：US20050271828A1

公开(公告)日：2005-12-08

申请号：US11185897

申请日：2005-07-21

Applicant: Toshiro Saito ,  Haruo Akahoshi ,  Takeyuki Itabashi

Inventor： Toshiro Saito ,  Haruo Akahoshi ,  Takeyuki Itabashi

IPC: H05K3/18 ,  H01L21/48 ,  H05H1/00 ,  H05K1/03 ,  H05K3/38 ,  H05K3/46

CPC classification number: H01L21/4846 ,  H01L2224/16225 ,  H01L2924/00014 ,  H05K3/381 ,  H05K3/389 ,  H05K3/4623 ,  H05K3/4661 ,  H05K2201/0344 ,  H05K2203/0315 ,  H05K2203/0793 ,  H05K2203/095 ,  Y10T29/49126 ,  H01L2224/0401

Abstract: Provided is a wiring board and production method thereof, wherein production of wiring by a full additive method is achieved. This is extremely useful in forming fine copper wiring featuring a high adhesion on an insulating resin substrate. A resin having an excellent alkali resistance is used as the insulating resin substrate, and the copper wiring is formed on the insulating resin substrate through a degenerated layer containing amide group and a metallic oxide layer of a metal having a reduction potential more base than that of copper. The degenerated layer can be provided by, e.g., introduction of amide group into the surface of the insulating resin substrate. The copper can be formed by processes including electroless plating. The insulating resin substrate has superb heat resistance and dimensional stability, and the formed structure can provide a highly packed wiring board.

Abstract translation: 本发明提供一种布线基板及其制造方法，其特征在于，通过全加法制造布线。 这对于在绝缘树脂基板上形成具有高粘附性的细铜布线非常有用。 使用耐碱性优异的树脂作为绝缘树脂基板，并且通过包含酰胺基的退化层和金属氧化物层，在绝缘树脂基板上形成铜布线，该金属氧化物层的还原电位比 铜。 退化层可以通过例如将酰胺基引入绝缘树脂基材的表面来提供。 铜可以通过包括无电镀的工艺形成。 绝缘树脂基板具有极好的耐热性和尺寸稳定性，并且所形成的结构可以提供高度封装的布线板。

公开(公告)号：US20040134682A1

公开(公告)日：2004-07-15

申请号：US10751428

申请日：2004-01-06

Applicant: IBIDEN CO., LTD.

Inventor： Honchin En ,  Tohru Nakai ,  Takeo Oki ,  Naohiro Hirose ,  Kouta Noda

IPC: H05K001/00

CPC classification number: H05K3/4644 ,  C23C18/1607 ,  C23C18/1653 ,  C23C18/22 ,  C23C18/30 ,  C23C18/34 ,  C23C18/405 ,  C23C28/00 ,  C23C28/023 ,  C23C28/42 ,  C25D3/38 ,  C25D5/022 ,  C25D5/18 ,  C25D5/34 ,  C25D7/123 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K3/0038 ,  H05K3/108 ,  H05K3/181 ,  H05K3/241 ,  H05K3/381 ,  H05K3/382 ,  H05K3/384 ,  H05K3/421 ,  H05K3/423 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4652 ,  H05K3/4661 ,  H05K2201/0215 ,  H05K2201/0344 ,  H05K2201/0347 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/0353 ,  H05K2203/0723 ,  H05K2203/1476 ,  H05K2203/1492 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: The present invention has for its object to provide a process for manufacturing multilayer printed circuit boards which is capable of simultaneous via hole filling and formation of conductor circuit and via holes of good crystallinity and uniform deposition can be constructed on a substrate and high-density wiring and highly reliable conductor connections can be realized without annealing. The present invention is related to a process for manufacturing multilayer printed circuit boards which comprises disposing an interlayer resin insulating layer on a substrate formed with a conductor circuit, creating openings for formation of via holes in said interlayer resin insulating layer, forming an electroless plated metal layer on said interlayer resin insulating layer, disposing a resist thereon, performing electroplating, stripping the resist off and etching the electroless plated metal layer to provide a conductor circuit and via holes, wherein the electroplating is performed intermittently using said electroless plated metal layer as cathode and a plating metal as anode at a constant voltage between said anode and said cathode.

Abstract translation: 本发明的目的是提供一种制造多层印刷电路板的方法，其能够同时通孔填充和形成导体电路，并且可以在基板和高密度布线上构造具有良好结晶度和均匀沉积的通孔 并且可以实现高可靠性的导体连接而不退火。 本发明涉及一种多层印刷电路板的制造方法，其特征在于，在形成有导体电路的基板上设置层间树脂绝缘层，在所述层间树脂绝缘层上形成用于形成通孔的开口，形成无电镀金属 层，在其上设置抗蚀剂，进行电镀，剥离抗蚀剂并蚀刻无电镀金属层以提供导体电路和通孔，其中使用所述无电镀金属层作为阴极间歇地进行电镀 以及在所述阳极和所述阴极之间的恒定电压下的电镀金属作为阳极。

公开(公告)号：US20020148733A1

公开(公告)日：2002-10-17

申请号：US10105230

申请日：2002-03-26

Inventor： Toshiro Saito ,  Haruo Akahoshi ,  Takeyuki Itabashi

IPC: C25D005/02 ,  C25D011/00

CPC classification number: H01L21/4846 ,  H01L2224/16225 ,  H01L2924/00014 ,  H05K3/381 ,  H05K3/389 ,  H05K3/4623 ,  H05K3/4661 ,  H05K2201/0344 ,  H05K2203/0315 ,  H05K2203/0793 ,  H05K2203/095 ,  Y10T29/49126 ,  H01L2224/0401

Abstract: Provided is a wiring board and production method thereof, wherein production of wiring by a fall additive method is achieved. This is extremely useful in forming fine copper wiring featuring a high adhesion on an insulating resin substrate. A resin having an excellent alkali resistance is used as the insulating resin substrate, and the copper wiring is formed on the insulating resin substrate through a degenerated layer containing amide group and a metallic oxide layer of a metal having a reduction potential more base than that of copper. The degenerated layer can be provided by, e.g., introduction of amide group into the surface of the insulating resin substrate. The copper can be formed by processes including electroless plating. The insulating resin substrate has superb heat resistance and dimensional stability, and the formed structure can provide a highly packed wiring board.

Abstract translation: 本发明提供一种布线基板及其制造方法，其特征在于，通过落下添加法制造布线。 这对于在绝缘树脂基板上形成具有高粘附性的细铜布线非常有用。 使用耐碱性优异的树脂作为绝缘树脂基板，并且通过包含酰胺基的退化层和金属氧化物层，在绝缘树脂基板上形成铜布线，该金属氧化物层的还原电位比 铜。 退化层可以通过例如将酰胺基引入绝缘树脂基材的表面来提供。 铜可以通过包括无电镀的工艺形成。 绝缘树脂基板具有极好的耐热性和尺寸稳定性，并且所形成的结构可以提供高度封装的布线板。

公开(公告)号：US6146700A

公开(公告)日：2000-11-14

申请号：US885917

申请日：1997-06-30

Applicant: Benzhen Yuan ,  Motoo Asai

Inventor： Benzhen Yuan ,  Motoo Asai

IPC: C23C18/18 ,  C23C18/28 ,  H05K3/06 ,  H05K3/10 ,  H05K3/18 ,  H05K3/24 ,  B05D3/10 ,  B05D1/18 ,  B05D1/36

CPC classification number: H05K3/244 ,  C23C18/1651 ,  C23C18/166 ,  C23C18/1834 ,  H05K3/108 ,  H05K2201/0344 ,  H05K2203/0392 ,  H05K2203/072 ,  H05K3/062 ,  H05K3/181 ,  H05K3/184

Abstract: As an electroless plating technique capable of surely promoting the plating reaction without Pd substitution reaction and fastening the plating deposition, there are proposed an electroless plating method of subjecting a primary plated film (or metal film) formed on a substrate to a secondary plating (or electroless plating), characterized in that the secondary plating is carried out after a surface potential of the primary plated film is adjusted so as to be more base than such a most base surface potential that a surface current density of the primary plated film is zero in an electroless plating solution for the secondary plating; and a pretreating solution for electroless plating comprising an alkali solution, reducing agent and complexing agent; and an electroless plating bath suitable for use in this method.

Abstract translation: 作为无电解电镀技术，能够确保促进电镀反应而不进行Pd取代反应和紧固电镀沉积，提出了一种无电镀方法，其将形成在基板上的一次镀膜（或金属膜）进行二次电镀（或 化学镀），其特征在于，在将一次镀膜的表面电位调节至比初级镀膜的表面电流密度为零的最基本的表面电位为基准之后进行二次镀覆 用于二次电镀的化学镀溶液; 以及包含碱溶液，还原剂和络合剂的化学镀的预处理溶液; 以及适用于该方法的化学镀浴。

公开(公告)号：US5648200A

公开(公告)日：1997-07-15

申请号：US726546

申请日：1996-10-07

Applicant: Raymond Letize ,  Peter Kukanskis

Inventor： Raymond Letize ,  Peter Kukanskis

IPC: C23C18/16 ,  G03F7/40 ,  H05K3/00 ,  H05K3/38 ,  H05K3/46 ,  G03F7/00

CPC classification number: G03F7/40 ,  C23C18/1605 ,  C23C18/2006 ,  C23C18/32 ,  C23C18/40 ,  H05K3/389 ,  H05K3/4661 ,  C23C18/1653 ,  C23C18/2086 ,  C23C18/24 ,  C23C18/26 ,  H05K2201/0344 ,  H05K2203/1105 ,  H05K3/0023

Abstract: A process is proposed for creating circuitry on the surface of a photoimageable dielectric. Specifically the process uses electroless means with controlled pH and an organosilane conditioning agent to fabricate circuitry and interconnects directly upon the surface of a photoimageable dielectric, such circuitry and interconnects having good adhesion to and coverage of the dielectric surface.

Abstract translation: 提出了一种在可光成象电介质的表面上产生电路的方法。 具体地，该方法使用具有受控pH的无电解方法和有机硅烷调节剂来制造电路并直接在可光成像电介质的表面上互连，这种电介质和互连具有与电介质表面的良好粘合性和覆盖性。

公开(公告)号：US5538616A

公开(公告)日：1996-07-23

申请号：US457785

申请日：1995-06-01

Applicant: Keiji Arai

Inventor： Keiji Arai

IPC: H05K3/24 ,  C23C18/32 ,  H05K1/09 ,  H05K3/26 ,  H05K3/42 ,  H05K3/46 ,  C25D5/00

CPC classification number: H05K3/429 ,  H05K3/4641 ,  H05K1/09 ,  H05K2201/0344 ,  H05K3/422 ,  H05K3/427

Abstract: An electroless nickel plating is used as a primer for electroplating of copper. Preferably, electroless nickel plating is conducted after the surface of aluminum is subjected to nickel substitution with a nickel salt under a strongly acidic condition (pH: 1 or less). More preferably, the nickel substitution is carried out after the oxide film on the surface of aluminum is removed.

Abstract translation: 使用化学镀镍作为电镀铜的底漆。 优选地，在强酸性条件（pH：1以下）下，用镍盐对铝的表面进行镍取代之后进行无电镀镍。 更优选地，在铝的表面上的氧化物膜被去除之后进行镍取代。

公开(公告)号：US5355019A

公开(公告)日：1994-10-11

申请号：US845898

申请日：1992-03-04

Applicant: Harold E. Fuchs

Inventor： Harold E. Fuchs

IPC: H01L21/60 ,  H01L21/48 ,  H01L23/498 ,  H01L23/538 ,  H05K1/00 ,  H05K1/11 ,  H05K3/00 ,  H05K3/24 ,  H05K3/42 ,  H01L23/48 ,  H01L29/44 ,  H01L29/52 ,  H01L29/60

CPC classification number: H01L23/5389 ,  H01L21/486 ,  H01L23/4985 ,  H05K1/112 ,  H01L2224/16 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15173 ,  H05K1/0393 ,  H05K2201/0154 ,  H05K2201/0344 ,  H05K2201/10674 ,  H05K2203/0455 ,  H05K3/0032 ,  H05K3/243 ,  H05K3/426

Abstract: Disclosed is a method for fabricating devices, and the resulting products, using Tape Automated Bonding (TAB) technology. Via holes are formed through a flexible insulating layer, such as polyimide, and are plated through when conductive fingers are formed on one surface of the layer. The resulting structure is then bonded to a semiconductor chip by means of the conductive pads formed on the surface of the insulating layer opposite to the conductive fingers.

Abstract translation: 公开了一种用于制造器件的方法，以及使用带式自动接合（TAB）技术的所得产品。 通过柔性绝缘层（例如聚酰亚胺）形成通孔，并且当在该层的一个表面上形成导电指状物时，通孔被电镀。 然后通过形成在与导电指状物相对的绝缘层的表面上的导电焊盘将所得结构结合到半导体芯片。

公开(公告)号：US5092967A

公开(公告)日：1992-03-03

申请号：US716400

申请日：1991-06-17

Applicant: Robert G. Guess

Inventor： Robert G. Guess

IPC: G03F7/36 ,  H05K3/06 ,  H05K3/10

CPC classification number: H05K3/108 ,  G03F7/36 ,  H05K3/067 ,  H05K2201/0154 ,  H05K2201/0344 ,  H05K2203/087 ,  H05K3/062 ,  Y10S205/926

Abstract: Printed electrical circuits are formed by coating an electrically insulating substrate with a layer of nickel metal followed by electroplating a second metal layer in a pattern of the desired circuit. Exposed nickel is removed from the substrate by reacting it with carbon monoxide to form nickel carbonyl vapor while the second metal remains unreacted. The nickel carbonyl vapor is heated to form nickel metal and carbon monoxide.

Abstract translation: 通过用镍金属层涂覆电绝缘基板，然后以所需电路的图案电镀第二金属层，形成印刷电路。 通过使其与一氧化碳反应从基材除去暴露的镍，以形成镍羰基蒸汽，而第二金属保持未反应。 加热镍羰基蒸气以形成镍金属和一氧化碳。

公开(公告)号：US4832799A

公开(公告)日：1989-05-23

申请号：US79532

申请日：1987-07-30

Applicant: Philip D. Knudsen ,  Daniel P. Walsh

Inventor： Philip D. Knudsen ,  Daniel P. Walsh

IPC: H05K3/02 ,  H05K3/18 ,  H05K3/38

CPC classification number: H05K3/381 ,  H05K3/181 ,  H05K3/38 ,  H05K2201/0154 ,  H05K2201/0344 ,  H05K2203/122 ,  H05K3/022 ,  Y10S205/926

Abstract: At least one surface of a polyimide sheet surface is coated with copper in the absence of an adhesive. The polyimide surface is treated with a one phase aqueous solution comprising an alkylene diamine; an alkali metal hydroxide and a water miscible alcohol to render the surface uniformly and substantially completely textured. The treated surface then is treated with a catalyst, coated with cobalt or nickel and then coated with copper. The laminate produced passes the IPC tests for peel strength and solder float.

Abstract translation: 在不存在粘合剂的情况下，聚酰亚胺片表面的至少一个表面涂覆有铜。 聚酰亚胺表面用包含亚烷基二胺的单相水溶液处理; 碱金属氢氧化物和水混溶性醇，以使表面均匀且基本上完全纹理化。 然后用催化剂处理经处理的表面，用钴或镍涂覆，然后用铜涂覆。 生产的层压板通过IPC测试剥离强度和焊料浮渣。

公开(公告)号：USRE29784E

公开(公告)日：1978-09-26

申请号：US483972

申请日：1974-06-28

Applicant: Donald H. Chadwick ,  Ruben T. Apodaca

Inventor： Donald H. Chadwick ,  Ruben T. Apodaca

IPC: C23C18/16 ,  H05K1/05 ,  H05K1/09 ,  H05K3/06 ,  H05K3/18 ,  H05K3/38 ,  H05K3/42 ,  H05K3/44

CPC classification number: H05K1/09 ,  C23C18/1653 ,  H05K1/056 ,  H05K3/381 ,  H05K2201/0209 ,  H05K2201/0338 ,  H05K2201/0344 ,  H05K2203/025 ,  H05K2203/0723 ,  H05K2203/1105 ,  H05K3/062 ,  H05K3/181 ,  H05K3/426 ,  H05K3/445

Abstract: A metal core printed circuit board which includes multiple layers of synthetic plastic resin material on a sheet of metal, and wherein the surface of the plastic material is of such character that it provides an acceptable bond on which are built up sundry layers of different metals, the innermost layer on the plastic surface and the other layers positioned one upon another, ultimately comprising a built up circuit pattern, and wherein areas intermediate the circuit pattern comprise an exposed surface of the resin material.