Wiring board and production method thereof, and semiconductor apparatus
    121.
    发明申请
    Wiring board and production method thereof, and semiconductor apparatus 审中-公开
    接线板及其制造方法以及半导体装置

    公开(公告)号:US20050271828A1

    公开(公告)日:2005-12-08

    申请号:US11185897

    申请日:2005-07-21

    Abstract: Provided is a wiring board and production method thereof, wherein production of wiring by a full additive method is achieved. This is extremely useful in forming fine copper wiring featuring a high adhesion on an insulating resin substrate. A resin having an excellent alkali resistance is used as the insulating resin substrate, and the copper wiring is formed on the insulating resin substrate through a degenerated layer containing amide group and a metallic oxide layer of a metal having a reduction potential more base than that of copper. The degenerated layer can be provided by, e.g., introduction of amide group into the surface of the insulating resin substrate. The copper can be formed by processes including electroless plating. The insulating resin substrate has superb heat resistance and dimensional stability, and the formed structure can provide a highly packed wiring board.

    Abstract translation: 本发明提供一种布线基板及其制造方法,其特征在于,通过全加法制造布线。 这对于在绝缘树脂基板上形成具有高粘附性的细铜布线非常有用。 使用耐碱性优异的树脂作为绝缘树脂基板,并且通过包含酰胺基的退化层和金属氧化物层,在绝缘树脂基板上形成铜布线,该金属氧化物层的还原电位比 铜。 退化层可以通过例如将酰胺基引入绝缘树脂基材的表面来提供。 铜可以通过包括无电镀的工艺形成。 绝缘树脂基板具有极好的耐热性和尺寸稳定性,并且所形成的结构可以提供高度封装的布线板。

    Wiring board and production method thereof, and semiconductor apparatus
    123.
    发明申请
    Wiring board and production method thereof, and semiconductor apparatus 审中-公开
    接线板及其制造方法以及半导体装置

    公开(公告)号:US20020148733A1

    公开(公告)日:2002-10-17

    申请号:US10105230

    申请日:2002-03-26

    Abstract: Provided is a wiring board and production method thereof, wherein production of wiring by a fall additive method is achieved. This is extremely useful in forming fine copper wiring featuring a high adhesion on an insulating resin substrate. A resin having an excellent alkali resistance is used as the insulating resin substrate, and the copper wiring is formed on the insulating resin substrate through a degenerated layer containing amide group and a metallic oxide layer of a metal having a reduction potential more base than that of copper. The degenerated layer can be provided by, e.g., introduction of amide group into the surface of the insulating resin substrate. The copper can be formed by processes including electroless plating. The insulating resin substrate has superb heat resistance and dimensional stability, and the formed structure can provide a highly packed wiring board.

    Abstract translation: 本发明提供一种布线基板及其制造方法,其特征在于,通过落下添加法制造布线。 这对于在绝缘树脂基板上形成具有高粘附性的细铜布线非常有用。 使用耐碱性优异的树脂作为绝缘树脂基板,并且通过包含酰胺基的退化层和金属氧化物层,在绝缘树脂基板上形成铜布线,该金属氧化物层的还原电位比 铜。 退化层可以通过例如将酰胺基引入绝缘树脂基材的表面来提供。 铜可以通过包括无电镀的工艺形成。 绝缘树脂基板具有极好的耐热性和尺寸稳定性,并且所形成的结构可以提供高度封装的布线板。

    Pretreating solution for electroless plating, electroless plating bath
and electroless plating process
    124.
    发明授权
    Pretreating solution for electroless plating, electroless plating bath and electroless plating process 失效
    化学镀,化学镀浴和化学镀工艺的预处理方案

    公开(公告)号:US6146700A

    公开(公告)日:2000-11-14

    申请号:US885917

    申请日:1997-06-30

    Abstract: As an electroless plating technique capable of surely promoting the plating reaction without Pd substitution reaction and fastening the plating deposition, there are proposed an electroless plating method of subjecting a primary plated film (or metal film) formed on a substrate to a secondary plating (or electroless plating), characterized in that the secondary plating is carried out after a surface potential of the primary plated film is adjusted so as to be more base than such a most base surface potential that a surface current density of the primary plated film is zero in an electroless plating solution for the secondary plating; and a pretreating solution for electroless plating comprising an alkali solution, reducing agent and complexing agent; and an electroless plating bath suitable for use in this method.

    Abstract translation: 作为无电解电镀技术,能够确保促进电镀反应而不进行Pd取代反应和紧固电镀沉积,提出了一种无电镀方法,其将形成在基板上的一次镀膜(或金属膜)进行二次电镀(或 化学镀),其特征在于,在将一次镀膜的表面电位调节至比初级镀膜的表面电流密度为零的最基本的表面电位为基准之后进行二次镀覆 用于二次电镀的化学镀溶液; 以及包含碱溶液,还原剂和络合剂的化学镀的预处理溶液; 以及适用于该方法的化学镀浴。

    Process for copper plating a wiring board
    126.
    发明授权
    Process for copper plating a wiring board 失效
    镀铜布线板的工艺

    公开(公告)号:US5538616A

    公开(公告)日:1996-07-23

    申请号:US457785

    申请日:1995-06-01

    Applicant: Keiji Arai

    Inventor: Keiji Arai

    Abstract: An electroless nickel plating is used as a primer for electroplating of copper. Preferably, electroless nickel plating is conducted after the surface of aluminum is subjected to nickel substitution with a nickel salt under a strongly acidic condition (pH: 1 or less). More preferably, the nickel substitution is carried out after the oxide film on the surface of aluminum is removed.

    Abstract translation: 使用化学镀镍作为电镀铜的底漆。 优选地,在强酸性条件(pH:1以下)下,用镍盐对铝的表面进行镍取代之后进行无电镀镍。 更优选地,在铝的表面上的氧化物膜被去除之后进行镍取代。

    Process for forming printed circuits
    128.
    发明授权
    Process for forming printed circuits 失效
    印刷电路成型工艺

    公开(公告)号:US5092967A

    公开(公告)日:1992-03-03

    申请号:US716400

    申请日:1991-06-17

    Inventor: Robert G. Guess

    Abstract: Printed electrical circuits are formed by coating an electrically insulating substrate with a layer of nickel metal followed by electroplating a second metal layer in a pattern of the desired circuit. Exposed nickel is removed from the substrate by reacting it with carbon monoxide to form nickel carbonyl vapor while the second metal remains unreacted. The nickel carbonyl vapor is heated to form nickel metal and carbon monoxide.

    Abstract translation: 通过用镍金属层涂覆电绝缘基板,然后以所需电路的图案电镀第二金属层,形成印刷电路。 通过使其与一氧化碳反应从基材除去暴露的镍,以形成镍羰基蒸汽,而第二金属保持未反应。 加热镍羰基蒸气以形成镍金属和一氧化碳。

    Process for coating at least one surface of a polyimide sheet with copper
    129.
    发明授权
    Process for coating at least one surface of a polyimide sheet with copper 失效
    用铜涂覆聚酰亚胺片材的至少一个表面的方法

    公开(公告)号:US4832799A

    公开(公告)日:1989-05-23

    申请号:US79532

    申请日:1987-07-30

    Abstract: At least one surface of a polyimide sheet surface is coated with copper in the absence of an adhesive. The polyimide surface is treated with a one phase aqueous solution comprising an alkylene diamine; an alkali metal hydroxide and a water miscible alcohol to render the surface uniformly and substantially completely textured. The treated surface then is treated with a catalyst, coated with cobalt or nickel and then coated with copper. The laminate produced passes the IPC tests for peel strength and solder float.

    Abstract translation: 在不存在粘合剂的情况下,聚酰亚胺片表面的至少一个表面涂覆有铜。 聚酰亚胺表面用包含亚烷基二胺的单相水溶液处理; 碱金属氢氧化物和水混溶性醇,以使表面均匀且基本上完全纹理化。 然后用催化剂处理经处理的表面,用钴或镍涂覆,然后用铜涂覆。 生产的层压板通过IPC测试剥离强度和焊料浮渣。

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