公开(公告)号：WO1990004806A1

公开(公告)日：1990-05-03

申请号：PCT/US1989004667

申请日：1989-10-18

Applicant: JONAND, INC.

Inventor： JONAND, INC. ,  BEISWENGER, John, L. ,  CHELCUN, Darrell, N.

IPC: G02F01/13

CPC classification number: G02F1/13452 ,  G02F1/133604 ,  G02F2001/133622 ,  H05K1/0284 ,  H05K1/117 ,  H05K1/189 ,  H05K3/0082 ,  H05K3/321 ,  H05K2201/09018 ,  H05K2201/0999 ,  H05K2201/10113 ,  H05K2201/10136 ,  H05K2201/10689 ,  H05K2203/056 ,  H05K2203/302

Abstract: A liquid crystal display module (10) defines a housing (24) of essentially C-shaped cross-section for improved economy and for connection, protection, and support of the liquid crystal display (12) and backlighting elements (42, 44). Additionally, the drivers (22) for the LCD may be so located by this invention, as to make room for a more intense light source to illuminate the LCD display. Also, the LCD module may exhibit a software variable color display through the use of one or more white or different color light sources (42, 44) and color polarizers (54, 56). The invention also includes an improvement to the conventional process of applying printed circuitry (18, 32) to the unique housing.

公开(公告)号：WO1987001557A1

公开(公告)日：1987-03-12

申请号：PCT/GB1986000523

申请日：1986-09-03

Applicant: ALLEN-BRADLEY INTERNATIONAL LIMITED ,  ATKINSON, Anthony ,  GRAY, Richard

Inventor： ALLEN-BRADLEY INTERNATIONAL LIMITED

IPC: H05K03/20

CPC classification number: H05K1/00 ,  B29C45/0053 ,  B29C45/0055 ,  B29C45/1418 ,  B29C45/14639 ,  B29C45/14778 ,  B29C45/14827 ,  B29C51/082 ,  B29C51/10 ,  B29C51/14 ,  B29C70/78 ,  B29C2045/14237 ,  B29C2791/006 ,  B29K2067/00 ,  B29K2995/0005 ,  B29L2009/008 ,  B29L2031/3425 ,  H05K1/0284 ,  H05K1/095 ,  H05K1/165 ,  H05K3/0014 ,  H05K3/007 ,  H05K3/207 ,  H05K2201/0376 ,  H05K2201/09018 ,  H05K2201/09118 ,  H05K2201/0999 ,  H05K2201/2009 ,  H05K2203/0156 ,  H05K2203/1327 ,  Y10T29/4916

Abstract: A method of providing an electrical circuit on a surface of a three-dimensionally shaped substrate of insulating plastics material comprising providing a carrier film (33) of insulating plastics material with a circuit pattern (31) of electro-conductive or electro-resistive, heat-resistant synthetic resin applied to at least one face (32); supporting a face of the carrier; forming a carrier into a given three-dimensional shape; and, moulding, by the application of heat and pressure in a mould cavity (38), a substrate (34) of insulating plastics material against the unsupported face of the carrier; so that the circuit is embedded in or within a three-dimensional surface of the moulded substrate.

Abstract translation: 一种在绝缘塑料材料的三维成形基片的表面上提供电路的方法，包括提供绝缘塑料材料的载体膜（33）和电导或电阻的热电路（31） 施加到至少一个面（32）上的耐性合成树脂; 支持承运人的面孔; 将载体形成给定的三维形状; 以及通过在模具腔（38）中施加热和压力来模制绝缘塑料材料的衬底（34）抵靠所述载体的未支撑面; 使得电路嵌入在模制基板的三维表面中或内部。

公开(公告)号：WO2018054623A1

公开(公告)日：2018-03-29

申请号：PCT/EP2017/070883

申请日：2017-08-17

Applicant: IMEC VZW ,  UNIVERSITEIT GENT

Inventor： VANFLETEREN, Jan ,  PLOVIE, Bart ,  BOSSUYT, Frederick

IPC: H05K3/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/28

CPC classification number: H05K3/0005 ,  H05K1/0283 ,  H05K1/189 ,  H05K3/0014 ,  H05K3/284 ,  H05K2201/0129 ,  H05K2201/057 ,  H05K2201/09018 ,  H05K2201/09263

Abstract: Methods are provided for manufacturing shape-retaining non-flat devices comprising elements such as components integrated on a device surface, the non-flat devices being made by deformation of a flat device. Based on the layout of a non-flat device, a layout of a flat device is first designed. A method for designing the layout of such a flat device is provided, in which the method includes inserting mechanical interconnections between pairs of elements to unambiguously define the position of the elements on a surface of the non-flat device, thus leaving zero or less than zero degrees of freedom for the location of the components. Based on the layout of a flat device thus obtained, the flat device is manufactured and next transformed into the shape-retaining non-flat device by means of a thermoforming process, thereby accurately and reproducibly positioning the elements at a predetermined location on a surface of the non-flat device.

Abstract translation: 提供了用于制造形状保持非平坦装置的方法，所述非平坦装置包括诸如集成在装置表面上的部件等元件，所述非平坦装置通过平坦装置的变形而制成。 基于非平面设备的布局，首先设计平面设备的布局。 提供了一种用于设计这种平坦装置的布局的方法，其中该方法包括在成对元件之间插入机械互连以明确地限定元件在非平坦装置的表面上的位置，从而使得零或小于 零部件位置的零自由度。 基于如此获得的扁平装置的布局，制造扁平装置并且接下来通过热成形工艺将扁平装置转变成形状保持非扁平装置，由此准确且可重复地将元件定位在表面上的预定位置 非平坦的设备。

公开(公告)号：WO2017082995A1

公开(公告)日：2017-05-18

申请号：PCT/US2016/049865

申请日：2016-09-01

Applicant: EXATEC, LLC

Inventor： NELSON, Mark Kevin ,  SHULER, Stephen ,  SCHOUWENAAR, Richard

IPC: B41M5/00 ,  B41M1/12 ,  B41M1/30 ,  B41M1/34 ,  H01B1/22 ,  H05K1/09

CPC classification number: B41M5/0064 ,  B41M1/12 ,  B41M1/30 ,  B41M1/34 ,  B41M5/0023 ,  B41M5/0047 ,  C09D11/037 ,  C09D11/322 ,  C09D11/52 ,  H01B1/22 ,  H05K1/0284 ,  H05K3/1216 ,  H05K3/125 ,  H05K2201/09018 ,  H05K2201/10098 ,  H05K2201/10272

Abstract: In an embodiment, a printing method for forming a conductive line on a plastic substrate for use in an automobile, comprises one or both of inkjet printing and screen printing the conductive line on the plastic substrate while the plastic substrate is fixed in a fixture of an automatic printing machine; the conductive mixture comprises a conductive paste; a solvent; and an adhesion agent; and wherein the conductive line is a busbar, a grid line, or an antenna line in the automobile.

Abstract translation: 在一个实施例中，用于在汽车中使用的塑料基板上形成导线的印刷方法包括在塑料基板上喷墨印刷和丝网印刷导电线中的一种或两种，同时塑料 基板固定在自动印刷机的固定装置上; 该导电混合物包含导电浆料; 溶剂; 和粘合剂; 并且其中导电线是汽车中的母线，网格线或天线线。

公开(公告)号：WO2016042414A3

公开(公告)日：2016-05-12

申请号：PCT/IB2015002186

申请日：2015-09-18

Applicant: PLASTIC ELECTRONIC GMBH ,  HUECK FOLIEN GMBH

Inventor： SCHMIDEGG KLAUS ,  TRASSL STEPHAN ,  TANDA MAG DI ANDREAS ,  RAMSAUER CHRISTOPH ,  WEISSEL PHILIPP

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/00

CPC classification number: H05K1/0284 ,  H05K1/189 ,  H05K3/0014 ,  H05K2201/0145 ,  H05K2201/0158 ,  H05K2201/09018 ,  H05K2203/1545

Abstract: The invention relates to a method for producing a deformable printed-circuit substrate in the form of a laminate consisting of an adhesion promoter film (1), optionally an adhesive layer (2), a printed-circuit film substrate (3) and a purely metallic conductor track (4), the latter having a preferred thickness of the order of magnitude of 1000 atomic layers. The invention also relates to a deformable printed-circuit substrate (1-4). In the method according to the invention, the printed-circuit substrate (1-4) is shaped by means of a gaseous pressure medium, at a temperature above the glass transition temperature and below the melting temperature of the printed-circuit film substrate (3) being shaped, under a sudden, high gas pressure. Thanks to the invention, sharply deformed printed-circuit substrates, in particular freely or spherically shaped printed-circuit substrates can be produced, even with purely metallic conductor tracks. Optional back-moulding (9) and application of decorative layers (11) and/or coating layers (10) allow producing multifunctional, seamlessly and freely shaped plastic components with integrated electronic elements.

Abstract translation: 本发明涉及一种用于在粘接膜的层叠体的形式制备整形电路载体（1），可能的粘合剂层（2），该电路载体箔（3）和纯金属导体轨道（4），后者具有在1000原子层的顺序优选的厚度尺寸 ， 此外，本发明涉及一种重整的电路有关当局（1-4）。 在本发明的方法中，在电路载体（1-4）是通过气态压力介质的装置，其特征在于，上述玻璃化转变温度和低于整形电路载体箔的熔化温度的成形（3）突然发生在高的气体压力转化。 由于本发明的第一次大的变形，尤其是游离的或球形的电路载体也可以与纯的金属导体制成。 通过可选的背景注射UNG（9），装饰片材（11）和/或涂层（10）的应用程序可以与电子集成而得到的多官能的，无缝自由形成的塑料部件。

公开(公告)号：WO2016054958A1

公开(公告)日：2016-04-14

申请号：PCT/CN2015/089013

申请日：2015-09-07

Applicant: 深圳市大族元亨光电股份有限公司

Inventor： 邝野 ,  李鸥 ,  陆怡秋 ,  焦伟棋 ,  钟涛

IPC: G09F9/33

CPC classification number: H05K7/1427 ,  G09F9/3026 ,  G09F9/33 ,  H05K1/14 ,  H05K2201/09018 ,  H05K2201/10106 ,  H05K2201/10128

Abstract: 一种尖角过渡模组，包括模组底壳（1）、LED PCB板（2）和弧形面罩（3）。LED PCB板（2）位于模组底壳（1）与弧形面罩（3）所形成的空间内。模组底壳（1）内设于LED安装点（11）。弧形面罩（3）上设有与LED PCB板（2）上的LED相适应的孔。该尖角过渡模组解决了整体显示屏由两个平面显示屏尖角对接时，在尖角处产生的无显示黑线缺陷问题。使非平面显示屏实现了无缝对接，无显示空档，全屏显示无黑线缺陷。

公开(公告)号：WO2015108085A1

公开(公告)日：2015-07-23

申请号：PCT/JP2015/050843

申请日：2015-01-14

Applicant: 太陽インキ製造株式会社

Inventor： 嶋宮　歩 ,  米田　直樹 ,  宇敷　滋

IPC: H05K3/34 ,  H05K1/02 ,  H05K3/00 ,  H05K3/18 ,  H05K3/28

CPC classification number: H05K3/341 ,  H05K1/0284 ,  H05K1/181 ,  H05K3/0014 ,  H05K3/064 ,  H05K3/105 ,  H05K3/18 ,  H05K3/182 ,  H05K3/3452 ,  H05K2201/09018 ,  H05K2201/09118 ,  H05K2201/2072 ,  H05K2203/0568 ,  H05K2203/107 ,  Y02P70/613

Abstract: 部品実装時におけるはんだの流れやショートを防止することができる、信頼性の高い立体回路基板およびこれに用いるソルダーレジスト組成物を提供する。立体基板（１）上に形成された回路（２）と部品実装部（３）とを備えた立体回路基板（１０）である。部品実装部（３）が開口するようにソルダーレジスト（４）が形成されてなり、部品実装部（３）にはんだにて電子部品が実装されてなる。ソルダーレジスト（４）はフォトレジストであることが好ましく、また、立体基板１が樹脂成型品であり、樹脂成型品に回路（２）が形成されてなることが好ましい。

Abstract translation: 提供了一种高度可靠的三维电路板和用于其的阻焊剂组合物，使得可以防止在组件安装期间焊料的流动和电短路。 三维电路板（10）设置有形成在三维基板（1）上的电路（2）和部件安装部（3）。 形成防焊剂（4），使部件安装部（3）开放，电子部件通过焊料安装到部件安装部（3）。 阻焊剂（4）优选为光致抗蚀剂; 此外，优选的是，三维基板（1）是树脂模制品，并且在树脂模制品中形成电路（2）。

公开(公告)号：WO2015066462A1

公开(公告)日：2015-05-07

申请号：PCT/US2014/063406

申请日：2014-10-31

Applicant: PPG INDUSTRIES OHIO, INC. ,  SI-CAL TECHNOLOGIES, INC., A NISSHA COMPANY

Inventor： TYLER, Jaye ,  CHEETHAM, Paul F. ,  BURN, Darren ,  MCCOLLUM, Gregory J.

IPC: H05K3/20 ,  H05K1/09 ,  H05K3/38 ,  H05K1/16

CPC classification number: H05K3/207 ,  H05K1/095 ,  H05K1/16 ,  H05K3/0017 ,  H05K3/007 ,  H05K3/38 ,  H05K3/386 ,  H05K3/4611 ,  H05K2201/09018 ,  H05K2201/0999 ,  H05K2203/0156 ,  H05K2203/1545

Abstract: Methods of transferring an electrically conductive material to a substrate are disclosed. The methods include: a) contacting at least a portion of the substrate with an electrically conductive material disposed on a carrier film; and b) applying heat and pressure to the substrate and carrier film for a period of time ranging from 1 to 40 seconds, at a temperature ranging from 200°F to 450°F, and at a pressure ranging from 30 to 150 psi, such that the electrically conductive material adheres to the substrate. Methods of forming a layered structure are also disclosed.

Abstract translation: 公开了将导电材料转移到基底的方法。 所述方法包括：a）使至少一部分基底与布置在载体膜上的导电材料接触; 和b）在200至450°F的温度和30至150psi的压力范围内，将热和压力施加到衬底和载体膜上1至40秒的时间段，例如 导电材料粘附到基底上。 还公开了形成层状结构的方法。

公开(公告)号：WO2012120274A1

公开(公告)日：2012-09-13

申请号：PCT/GB2012/050402

申请日：2012-02-22

Applicant: MBDA UK LIMITED ,  EVANS, Christopher, Owen ,  HEATON, Thomas, James ,  HART, Alan, David ,  ARMITAGE, Adam

Inventor： EVANS, Christopher, Owen ,  HEATON, Thomas, James ,  HART, Alan, David ,  ARMITAGE, Adam

IPC: H05K3/00

CPC classification number: H05K3/0014 ,  H05K1/182 ,  H05K2201/09018 ,  H05K2203/302

Abstract: A method of manufacturing a curved circuit assembly comprises providing a circuit board (80) having a surface and a plurality of recesses (10) opening onto the surface. The surface includes a plurality of conductive tracks (30). A circuit assembly is formed by placing an electronic component (20) within each of said recesses (10) and forming a conductive join (50) between the electronic component (20) and at least one of the conducting tracks (30). The circuit assembly is then bent.

Abstract translation: 制造弯曲电路组件的方法包括提供具有表面的电路板（80）和在表面上开口的多个凹部（10）。 表面包括多个导电轨道（30）。 通过将电子部件（20）放置在每个所述凹部（10）内并在电子部件（20）和至少一个导电轨道（30）之间形成导电接头（50）而形成电路组件。 然后电路组件弯曲。

公开(公告)号：WO2011014272A1

公开(公告)日：2011-02-03

申请号：PCT/US2010/028164

申请日：2010-03-22

Applicant: RAYTHEON COMPANY ,  OLDEN, Thomas, A. ,  WRIGGLESWORTH, Walter

Inventor： OLDEN, Thomas, A. ,  WRIGGLESWORTH, Walter

IPC: H05K1/03 ,  H05K1/18 ,  H05K3/46

CPC classification number: H05K1/0366 ,  H05K1/0284 ,  H05K1/05 ,  H05K3/0014 ,  H05K3/4632 ,  H05K3/465 ,  H05K2201/0323 ,  H05K2201/09018 ,  H05K2201/09063 ,  H05K2201/092 ,  H05K2203/302 ,  Y10T29/49124

Abstract: A composite interconnect assembly includes a body structure (102) formed from a composite material (e.g., a carbon graphite material) with one or more conductive traces embedded therein (e.g., a copper or copper alloy). One or more contact regions (106) are provided such that the conductive traces (104) are exposed and are configured to mechanically and electrically connect to one or more electronic components. The body structure may have a variety of shapes, including planar, cylindrical, conical, and the like.

Abstract translation: 复合互连组件包括由其中嵌有一个或多个导电迹线（例如铜或铜合金）的复合材料（例如，碳石墨材料）形成的主体结构（102）。 提供一个或多个接触区域（106），使得导电迹线（104）被暴露并被配置为机械地和电连接到一个或多个电子部件。 身体结构可以具有各种形状，包括平面，圆柱形，圆锥形等。