公开(公告)号：KR1020120029208A

公开(公告)日：2012-03-26

申请号：KR1020100091166

申请日：2010-09-16

Applicant: 삼성전기주식회사

Inventor： 강환준 ,  한철민 ,  석진수

IPC: H04N5/225

CPC classification number: H04N5/2254 ,  G02B5/208 ,  H04N5/2251 ,  H05K9/0024 ,  H05K2201/09372

Abstract: PURPOSE: A camera module filter package and camera module thereof are provided to enable a user to effectively assembe a camera module by increasing the thickness of a filter package in a PCB(Printed Circuit Board). CONSTITUTION: A filter package includes a frame and a bonding unit. The bonding unit is constituted by a metal plate. A housing unit(520) is combined with the filter package by soldering the metal plate with a metal pad(530). Hardening time is reduced by soldering the metal plate with the metal pad. The dislocation of the metal plate is reduced by the hardening time.

Abstract translation: 目的：提供一种摄像机模块滤波器组件及其相机模块，以使用户能够通过增加PCB（印刷电路板）中的过滤器封装的厚度来有效地组装相机模块。 构成：过滤器包括一个框架和一个粘合单元。 接合单元由金属板构成。 壳体单元（520）通过用金属垫（530）焊接金属板与过滤器组合件组合。 通过金属板焊接金属板来减少加固时间。 金属板的位错减少了硬化时间。

公开(公告)号：KR1020090128657A

公开(公告)日：2009-12-16

申请号：KR1020080054511

申请日：2008-06-11

Applicant: 삼성전기주식회사

Inventor： 권세문 ,  강환준 ,  박명재 ,  석진수

IPC: H04N5/225

CPC classification number: H04N5/2251 ,  G12B17/04 ,  H05K1/0306 ,  H05K2201/09372

Abstract: PURPOSE: A camera module is provided to electrically connect the pad of a ceramic board with the pad of an image sensor by a conductive buffer agent, thereby miniaturizing the camera module. CONSTITUTION: One or more lenses are combined in the inside of a lens barrel(110). A housing(120) comprises an opening unit into which the lens barrel is inserted. A cavity is formed in the center of a substrate(130). A conductive buffer agent(140) is inserted into the inner side of the cavity. An image sensor(150) is mounted inside the conductive buffer agent.

Abstract translation: 目的：提供相机模块，通过导电缓冲剂将陶瓷板的焊盘与图像传感器的焊盘电连接，从而使相机模块小型化。 构成：一个或多个透镜组合在镜筒（110）的内部。 壳体（120）包括开口单元，镜筒插入其中。 在基板（130）的中心形成空腔。 导电缓冲剂（140）插入空腔的内侧。 图像传感器（150）安装在导电缓冲剂内部。

公开(公告)号：KR1020090093395A

公开(公告)日：2009-09-02

申请号：KR1020080018898

申请日：2008-02-29

Applicant: 에스케이하이닉스 주식회사

Inventor： 박명근

IPC: H05K1/09

CPC classification number: H05K1/09 ,  H01L2224/73204 ,  H05K3/28 ,  H05K3/3463 ,  H05K2201/09372

Abstract: A printed circuit board and a flip chip package are provided to prevent a fault due to the flux remaining on the pad by forming a non-wetting film in a space between pads. A flip chip package includes a printed circuit board(220), a semiconductor chip(212), and a sealant(214). A printed circuit board includes an insulating layer(202), a plurality of pads(204), a non-wetting film(206), and a solder resist(208). The plurality of pads are formed on the insulating layer. The non-wetting film is formed on the insulating layer and the space between pads. The solder resist is coated on the non-wetting film in order to expose a part of the non-wetting film and the pads. The semiconductor chip is flip-chip bonded on the printed circuit board. The sealant seals one side of the printed circuit board including the semiconductor chip.

Abstract translation: 提供印刷电路板和倒装芯片封装以通过在焊盘之间的空间中形成非润湿膜来防止由焊盘残留的焊剂导致的故障。 倒装芯片封装包括印刷电路板（220），半导体芯片（212）和密封剂（214）。 印刷电路板包括绝缘层（202），多个焊盘（204），非润湿膜（206）和阻焊剂（208）。 多个焊盘形成在绝缘层上。 该非润湿膜形成在绝缘层和垫之间的空间上。 将阻焊剂涂覆在非润湿膜上以暴露一部分非润湿膜和垫。 将半导体芯片倒装在印刷电路板上。 密封剂密封包括半导体芯片的印刷电路板的一侧。

公开(公告)号：KR1020090086832A

公开(公告)日：2009-08-14

申请号：KR1020080012319

申请日：2008-02-11

Applicant: 삼성전기주식회사

Inventor： 맹일상 ,  조영웅

IPC: H05K3/40

CPC classification number: H05K3/4038 ,  H05K1/116 ,  H05K3/0055 ,  H05K3/244 ,  H05K3/421 ,  H05K2201/09372

Abstract: A method for manufacturing a printed circuit board is provided to improve alignment and reliability of a via by performing an electro-plating process instead of a drilling process. An inner layer substrate is prepared(S100). A metal layer is laminated on one surface of the inner layer substrate. The via land is formed on the metal layer. A plating resist is formed on one side of the inner layer substrate to open the via land(S200). The via is formed on the via land by the electro-plating process(S300). The plating resist is removed from the inner layer substrate(S400). The metal layer is removed from the inner layer substrate(S500). The insulating material is laminated on one side of the inner layer substrate(S600). One side of the insulating material and the surface of the via are desmeared(S700). At least one of a circuit pattern and the via land is formed in one side of the insulating material(S800).

Abstract translation: 提供一种制造印刷电路板的方法，通过执行电镀处理而不是钻孔工艺来改善通孔的对准和可靠性。 制备内层基材（S100）。 金属层层压在内层基板的一个表面上。 通孔焊盘形成在金属层上。 在内层基板的一侧上形成电镀抗蚀剂以打开通孔接地（S200）。 通过电镀工艺在通孔接地上形成通孔（S300）。 从内层基板除去电镀抗蚀剂（S400）。 从内层基板去除金属层（S500）。 绝缘材料层叠在内层基板的一侧（S600）。 除去绝缘材料的一侧和通路的表面（S700）。 在绝缘材料的一侧形成电路图案和通路焊盘中的至少一个（S800）。

公开(公告)号：KR1020090083614A

公开(公告)日：2009-08-04

申请号：KR1020080009521

申请日：2008-01-30

Applicant: 한국단자공업 주식회사

Inventor： 이운호

IPC: H05K1/02

CPC classification number: H05K1/111 ,  H05K1/182 ,  H05K3/4046 ,  H05K2201/09372

Abstract: A printed circuit board is provided to stably perform signal transmission between a wiring and a pad through a sub contact part by forming the sub contact part together with a contact part. A multilayer printed circuit board(100) includes four conductor layers(30), three insulation layers(40), and a via hole(10). The via hole connects a wiring(21) connected to a part(50) to an external device. The wiring and a pad(61) are electrically and physically connected each other. The printed circuit board additionally includes a sub via hole(11) between the part and the via hole. A diameter of the sub via hole is smaller than a diameter of the via hole. The conductor layers are displayed as four resistors, and are connected to the multilayer printed circuit board through the pad.

Abstract translation: 提供一种印刷电路板，通过与接触部分一起形成子接触部分，通过副接触部分稳定地执行布线和焊盘之间的信号传输。 多层印刷电路板（100）包括四个导体层（30），三个绝缘层（40）和通孔（10）。 通孔将连接到部件（50）的布线（21）连接到外部设备。 布线和衬垫（61）彼此电气和物理上相互连接。 印刷电路板还包括在部分和通孔之间的子通孔（11）。 子通孔的直径小于通孔的直径。 导体层显示为四个电阻，并通过焊盘连接到多层印刷电路板。

公开(公告)号：KR1020090061431A

公开(公告)日：2009-06-16

申请号：KR1020070128443

申请日：2007-12-11

Applicant: 삼성전자주식회사

Inventor： 키노시타마코토 ,  장시호 ,  김철수

IPC: H05K1/18

CPC classification number: H05K1/181 ,  H05K1/111 ,  H05K3/303 ,  H05K3/34 ,  H05K2201/09372

Abstract: A surface-mounted device, a printed circuit board, and a printed circuit board assembly are provided to prevent thermal damage to an electronic part by improving a heating effect of a solder part without increase of a total temperature of a reflow soldering process. A surface-mounted device includes a device body(100) and a plurality of leads(110). The lead is protruded to an outer side of the device body. The lead is mat-finished by trivalent chrome or carbon black in order to absorb an infrared radiant heat during a reflow soldering. A solder contact surface of the lead is not mat-finished. A first mat-finished part(300) is formed around a land(210) of a printed circuit board(200). A second mat-finished part(310) is formed in a rear surface of the printed circuit board. The lead is mounted on the printed circuit board by a reflow soldering process.

Abstract translation: 提供表面安装装置，印刷电路板和印刷电路板组件，以通过改善焊接部件的加热效果而不增加回流焊接工艺的总温度来防止对电子部件的热损伤。 表面安装装置包括装置主体（100）和多个引线（110）。 引线突出到装置主体的外侧。 为了在回流焊接期间吸收红外辐射热，铅被三价铬或炭黑整理。 引线的焊接接触面不能完成。 在印刷电路板（200）的平台（210）周围形成有第一垫层部（300）。 在印刷电路板的后表面上形成第二加工部件（310）。 引线通过回流焊接工艺安装在印刷电路板上。

公开(公告)号：KR1020090054816A

公开(公告)日：2009-06-01

申请号：KR1020070121699

申请日：2007-11-27

Applicant: 삼성전기주식회사

Inventor： 장정훈 ,  김굉식 ,  김하일 ,  이채문 ,  이양제

IPC: H04N5/225

CPC classification number: H04N5/2257 ,  H05K1/02 ,  H05K3/0047 ,  H05K3/40 ,  H05K2201/09372

Abstract: A PCB, a manufacturing method thereof, and a camera module including the same are provided to maximize an external connection area within a range capable of preventing short generation, thereby improving reliability and external connectivity. A PCB(Printed Circuit Board)(10) comprises a connection groove formed in a side. In the connection groove, a side pad(15) is formed. A main connection unit(13) of an arched shape is located in the center of the connection groove. First and second extension connection units(11,12) of the arched shape are formed in both sides of the main connection unit as being spaced from each other. The radius of curvature of the first and second extension connection units is identically formed. The radius of curvature of the main connection unit is bigger than the radius of curvature of the first and second extension connection units.

Abstract translation: 提供一种PCB，其制造方法以及包括该PCB的相机模块，以在能够防止短暂发生的范围内使外部连接区域最大化，从而提高可靠性和外部连接性。 PCB（印刷电路板）（10）包括形成在一侧的连接槽。 在连接槽中，形成侧垫（15）。 拱形的主连接单元（13）位于连接槽的中心。 拱形形状的第一和第二延伸连接单元（11,12）形成在主连接单元的两侧彼此间隔开。 第一和第二延伸连接单元的曲率半径相同地形成。 主连接单元的曲率半径大于第一和第二延伸连接单元的曲率半径。

公开(公告)号：KR1020080071447A

公开(公告)日：2008-08-04

申请号：KR1020070009679

申请日：2007-01-30

Applicant: 삼성전자주식회사

Inventor： 전성남

IPC: H05K1/09

CPC classification number: H05K1/111 ,  H05K1/0393 ,  H05K2201/09372

Abstract: A flexible printed circuit board is provided to offer a stable power to an integrated circuit by receiving the power through a capacitor although inner devices perform a switching operation at the same time by a high speed operation of the integrated circuit. A flexible printed circuit board includes input pad units to which a power voltage and a ground voltage are inputted. A first signal line unit(142) outputs the power voltage supplied to the input pad units through an output lead. A second signal line unit(144) outputs the ground voltage supplied to the input pad units through the output lead. A high dielectric material(162) is arranged at a separation region between the first and second signal line units.

Abstract translation: 提供了柔性印刷电路板，以通过电容器接收电力来向集成电路提供稳定的电力，尽管内部装置通过集成电路的高速操作同时执行开关操作。 柔性印刷电路板包括输入电源电压和接地电压的输入焊盘单元。 第一信号线单元（142）通过输出引线输出提供给输入焊盘单元的电源电压。 第二信号线单元（144）通过输出引线输出提供给输入焊盘单元的接地电压。 在第一和第二信号线单元之间的分离区域处布置有高介电材料（162）。

公开(公告)号：KR1020080019883A

公开(公告)日：2008-03-05

申请号：KR1020060082365

申请日：2006-08-29

Applicant: 삼성전기주식회사

Inventor： 지재환 ,  이재선

IPC: H04N5/225

CPC classification number: H04N5/2251 ,  H05K3/30 ,  H05K2201/09372 ,  H05K2203/049

Abstract: A camera module using a circuit board having a built-in chip is provided to enable chip-shaped electronic parts and passive devices to be mounted in a groove which is formed on the lower circuit board of an image sensor, thereby reducing the entire size of the camera module. A camera module comprises an image sensor module(250), a housing(260), and a lens barrel(270). The image sensor module includes a circuit board(210), electronic parts(230), and an image sensor(240). The board has a groove(214) formed on the upper center portion. The electronic parts are built in the inside of the groove on the circuit board. The image sensor covers the groove on the circuit board and is joined to the circuit board by wire bonding. The housing is joined to the upper portion of the image sensor module. The lens barrel has plural lenses(L) laminated in the inside and is joined to the upper end portion of the housing.

Abstract translation: 提供了使用具有内置芯片的电路板的相机模块，以使得芯片形电子部件和无源器件能够安装在形成在图像传感器的下部电路板上的凹槽中，从而减小了整个尺寸 相机模块。 相机模块包括图像传感器模块（250），壳体（260）和透镜镜筒（270）。 图像传感器模块包括电路板（210），电子部件（230）和图像传感器（240）。 板具有形成在上中心部分上的凹槽（214）。 电子部件内置在电路板上凹槽的内部。 图像传感器覆盖电路板上的凹槽，并通过引线接合连接到电路板。 外壳连接到图像传感器模块的上部。 镜筒具有层叠在内部的多个透镜（L），并且被连接到壳体的上端部。

公开(公告)号：KR1020070041153A

公开(公告)日：2007-04-18

申请号：KR1020050096998

申请日：2005-10-14

Applicant: 삼성전기주식회사

Inventor： 권두수

IPC: H04N5/225

CPC classification number: H04N5/369 ,  G02B5/208 ,  H04N5/2251 ,  H05K2201/05 ,  H05K2201/09372 ,  H05K2203/049

Abstract: 본 발명은 이미지 센서 모듈에 부착되는 연성인쇄회로기판 및 이를 이용한 이미지 센서 모듈에 관한 것이다.
소정의 길이를 가지며, 내부에 도전성 패턴이 인쇄된 연성의 기판부와, 상기 기판부의 하부로 연장되며 외부 기기가 연결되는 커넥터가 실장된 소켓부와, 상기 기판부의 상부로 연장되며 양측부의 패드 형성면 상, 하부에 각각 수직 만곡부가 구비된 패드부를 포함하는 이미지 센서 모듈용 기판; 상기 패드부의 상면에 접착 고정되며, 이미지센서가 와이어 본딩 방식에 의해서 실장된 인쇄회로기판과 IR 필터가 장착된 하우징과 다수의 렌즈가 내부에 적층된 배럴이 일체로 결합된 모듈 조립체;를 포함하며, 인쇄회로기판과 연성인쇄회로기판의 전기적 접촉 불량이 방지될 수 있는 장점이 있음과 아울러 상기 인쇄회로기판과 연성인쇄회로기판의 완전한 밀착 결합에 의해 하우징을 비롯한 모듈 조립체의 고정 수명을 연장시킴으로써, 제품의 사용 수명이 연장되는 작용효과를 기대할 수 있다.
기판부, 패드부, 소켓부, 수직 만곡부, 모듈 조립체, 인쇄회로기판

Abstract translation: 本发明涉及附着到图像传感器模块的柔性印刷电路板和使用其的图像传感器模块。