公开(公告)号：JP4909905B2

公开(公告)日：2012-04-04

申请号：JP2007551635

申请日：2006-01-24

Applicant: ユマテック ゲーエムベーハー

Inventor： マルクス ヴェルフェル

IPC: H05K1/02 ,  H05K3/10 ,  H05K3/22 ,  H05K7/20

CPC classification number: H05K3/103 ,  H05K1/0272 ,  H05K3/222 ,  H05K2201/064 ,  H05K2201/098 ,  H05K2201/10257 ,  H05K2201/1028 ,  H05K2201/10287

公开(公告)号：JP2011049247A

公开(公告)日：2011-03-10

申请号：JP2009194602

申请日：2009-08-25

Applicant: Nec Lcd Technologies Ltd ,  Nec液晶テクノロジー株式会社

Inventor： KAMON YOICHIRO ,  HAGA HIROSHI ,  ASAKURA TETSURO

IPC: H05K1/14 ,  G02F1/1333 ,  G02F1/1345 ,  G09F9/00

CPC classification number: G02F1/13458 ,  G02F1/1345 ,  G02F1/13452 ,  H05K1/111 ,  H05K1/117 ,  H05K1/118 ,  H05K3/361 ,  H05K3/368 ,  H05K3/4046 ,  H05K2201/0382 ,  H05K2201/09845 ,  H05K2201/10136 ,  H05K2201/1028

Abstract: PROBLEM TO BE SOLVED: To solve the problem in which when mounting is performed beyond an uneven part by use of a flexible sheet including a conductive layer, the minimum curvature radius of the sheet prevents miniaturization of a mounting structure.
SOLUTION: The connecting structure for electronic device includes a first surface including a first conductor, a second surface including a second conductor, an end of the first surface substantially parallel to Y axis, and a flexible sheet-like connecting body including a conductive layer. The end is taken as the origin of X coordinate, and the direction from the second surface to the first surface is taken as positive direction of Z coordinate. The first conductor and the sheet-like connecting body are electrically connected by a first connecting terminal, and the second conductor and the sheet-like connecting body are electrically connected by a second connecting terminal. The sheet-like connecting body has a form such that it extends from the first connecting terminal to the second connecting terminal across the end, wherein the Y component of the distance between a point where the Z coordinate of the sheet-like connecting body becomes smaller than the first surface first when advancing from the first connecting terminal to the second connecting terminal along the surface and the second connecting terminal is larger than the X-component of the distance between the end and the second connecting terminal.
COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题为了解决通过使用包括导电层的柔性片超出不平坦部进行安装的问题，片的最小曲率半径防止了安装结构的小型化。 解决方案：电子设备的连接结构包括：第一表面，包括第一导体，包括第二导体的第二表面，基本上平行于Y轴的第一表面的端部;以及柔性片状连接体， 导电层。 将其作为X坐标的原点，将从第二面到第一面的方向作为Z坐标的正方向。 第一导体和片状连接体通过第一连接端子电连接，第二导体和片状连接体通过第二连接端子电连接。 片状连接体具有从第一连接端子延伸到第二连接端子的形式，其中，片状连接体的Z坐标点之间的距离的Y分量变小 比第一表面首先从第一连接端子沿着表面前进到第二连接端子，而第二连接端子大于端部和第二连接端子之间的距离的X分量。 版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP2007325344A

公开(公告)日：2007-12-13

申请号：JP2006149982

申请日：2006-05-30

Applicant: Yazaki Corp ,  矢崎総業株式会社

Inventor： ISHIDA YUICHI ,  ISHIGURO MASAAKI ,  NAKAMURA KAZUAKI

IPC: H02G3/16

CPC classification number: H05K5/0247 ,  H05K1/0204 ,  H05K1/056 ,  H05K3/3447 ,  H05K7/20436 ,  H05K2201/066 ,  H05K2201/10242 ,  H05K2201/1028

Abstract: PROBLEM TO BE SOLVED: To provide a small and lightweight electrical connection box which is excellent in recyclability and soaking/heat dissipation properties and is not restricted by the fixing position with low cost. SOLUTION: The electrical connection box 11 is constituted of a circuit board 14 mounting an electric component 23, and an upper case 12 and a lower case 13 covering the circuit board 14. A metal core substrate where the surface of a planar core 24 is covered with an insulation 25 is employed as the circuit board 14, and a heat sink 31 excellent in thermal conductivity is fixed to the vicinity of the electric component 23 while being connected with the metal core 24. COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：提供一种具有优异的可回收性和浸泡/散热性能的小型轻质电连接盒，并且不受固定位置的限制，成本低廉。 电连接盒11由安装电气部件23的电路板14和覆盖电路板14的上壳体12和下壳体13构成。金属芯基板，其中平面芯的表面 24被覆盖有绝缘体25作为电路板14，并且导热性优良的散热片31在与金属芯24连接的同时固定在电气部件23的附近。版权所有（C） ）2008，JPO＆INPIT

公开(公告)号：ZA8100172B

公开(公告)日：1982-01-27

申请号：ZA8100172

申请日：1981-01-12

Applicant: INT COMPUTERS LTD

Inventor： ROBINSON J

IPC: H05K3/22 ,  H05K3/28 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K

CPC classification number: H05K3/225 ,  H05K3/28 ,  H05K3/328 ,  H05K3/341 ,  H05K3/4015 ,  H05K2201/1028 ,  H05K2203/1115 ,  H05K2203/173 ,  Y10T29/49126

公开(公告)号：CZ20060166A3

公开(公告)日：2007-09-26

申请号：CZ20060166

申请日：2006-03-14

Applicant: KIWA SPOL S R O

Inventor： AIERNIAIKA JOZEF

IPC: H02H3/20

CPC classification number: H02H9/042 ,  H01C7/126 ,  H05K1/0201 ,  H05K1/0254 ,  H05K2201/09063 ,  H05K2201/10022 ,  H05K2201/10181 ,  H05K2201/1028 ,  H05K2203/0271 ,  H05K2203/176

Abstract: Zarízení pro prepetovou ochranu obsahuje mezi dvojicí pripojovacích bodu (L/N) a (N/L) zapojený alespon jeden varistor (V1), který je tepelnou aktivací odpojitelný od chráneného elektrického obvodu, pricemž mezi dvojicí pripojovacích bodu (L/N, N/L)a pripojovacím bodem (PE) zemnení je zapojena bleskojistka (2) a zarízení dále obsahuje základní desku (4) vytvorenou jako plošný spoj a obsahující elektricky vodivou vrstvu tvorící alespon cást vodivých spojení mezi jednotlivými prvky zarízení. Varistor (V1) je jedním svým kontaktem (K1) pripevnenk elektricky vodivé vrstve základní desky (4) a umísta pripojení vývodu (K1) varistoru (V1) k elektricky vodivé vrstve základní desky (4) je k elektricky vodivé vrstve základní desky (4) nízkotavitelným spojem (5) pripevneno elektricky vodivé odpojovací teleso (6), které je elektricky vodivým tepelne odolným spojem (8) napojeno na jeden vývod bleskojistky (2) a je spraženo s oddalovacím prostredkem (9).

公开(公告)号：EP3337301A1

公开(公告)日：2018-06-20

申请号：EP17207467.6

申请日：2017-12-14

Applicant: Siteco Beleuchtungstechnik GmbH

Inventor： Wimmer, Kilian ,  Wuppinger, Bernhard

IPC: H05K1/02 ,  H05K3/20 ,  F21K9/00 ,  F21V23/00 ,  H05K1/05 ,  H05K3/10 ,  H05K3/30 ,  H05K3/38

CPC classification number: H05K1/0265 ,  H05K1/056 ,  H05K3/103 ,  H05K3/202 ,  H05K3/305 ,  H05K3/386 ,  H05K2201/10106 ,  H05K2201/10272 ,  H05K2201/1028

Abstract: Verfahren zur Herstellung eines LED-Moduls (400), wobei das Verfahren umfasst:
- Befestigen von Leiterflächen (440) mit einer selbstklebenden Schicht (430) auf einem Trägerelement (410), und
- Befestigen einer LED (460) auf den Leiterflächen,
wobei das Befestigen der Leiterflächen durch einen SMD-Bestückungsautomaten erfolgt

公开(公告)号：EP3295774A1

公开(公告)日：2018-03-21

申请号：EP16717620

申请日：2016-04-19

Applicant: OSRAM GMBH ,  HERAEUS DEUTSCHLAND GMBH & CO KG ,  ALANOD GMBH & CO KG

Inventor： SORG JOERG ERICH ,  ZIEGLER STEFAN ,  AUSTGEN MICHAEL ,  PEETSCH ALEXANDER ,  DITZEL ECKHARD ,  BENEDIKT MICHAEL

IPC: H05K1/05 ,  B32B15/08 ,  H05K3/00 ,  H05K3/10 ,  H05K3/38

CPC classification number: H05K1/056 ,  B32B15/00 ,  B32B15/04 ,  B32B15/08 ,  B32B2307/20 ,  B32B2307/202 ,  B32B2307/40 ,  B32B2457/00 ,  B32B2457/14 ,  H01L2224/48091 ,  H01L2224/97 ,  H05K3/0097 ,  H05K3/103 ,  H05K3/386 ,  H05K2201/0358 ,  H05K2201/0394 ,  H05K2201/055 ,  H05K2201/09063 ,  H05K2201/10106 ,  H05K2201/1028 ,  H05K2203/1545 ,  H01L2924/00014

Abstract: The invention relates to a method for producing at least one connection support, said method having the following steps: A) provision of a sheet metal support (1) comprising a level cover surface (1a), B) application of at least one electrically insulating insulation strip (2) to the cover surface (1a) and bonding of the sheet metal support (1) to the insulation strip (2), C) application of at least one electrically conductive conductor strip (3) to an adhesion surface (2a) of the insulation strip (2) and bonding of the insulation strip (2) to the conductor strip (3), the conductor strip (3) and the sheet metal support (1) being electrically insulated from one another by means of the insulation strip (2).

公开(公告)号：EP2916353A1

公开(公告)日：2015-09-09

申请号：EP13850020.2

申请日：2013-10-25

Applicant: NSK Ltd.

Inventor： SUNAGA, Takashi ,  KANEKO, Noboru ,  MIYOSHI, Osamu

IPC: H01L23/48 ,  H01L21/60 ,  H01L25/07 ,  H01L25/18

CPC classification number: H05K1/09 ,  H01L23/142 ,  H01L23/3735 ,  H01L23/49582 ,  H01L23/49811 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/35 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/73 ,  H01L24/83 ,  H01L24/84 ,  H01L24/92 ,  H01L25/07 ,  H01L25/072 ,  H01L25/18 ,  H01L2224/05553 ,  H01L2224/0603 ,  H01L2224/291 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/32227 ,  H01L2224/32238 ,  H01L2224/33181 ,  H01L2224/352 ,  H01L2224/35847 ,  H01L2224/3701 ,  H01L2224/37013 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/40227 ,  H01L2224/40475 ,  H01L2224/40499 ,  H01L2224/4103 ,  H01L2224/4112 ,  H01L2224/48 ,  H01L2224/73263 ,  H01L2224/77272 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83424 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/84424 ,  H01L2224/84447 ,  H01L2224/84801 ,  H01L2224/84815 ,  H01L2224/85 ,  H01L2224/9221 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/351 ,  H05K1/0271 ,  H05K1/05 ,  H05K1/181 ,  H05K3/3431 ,  H05K2201/10166 ,  H05K2201/1028 ,  H05K2201/1031 ,  H05K2201/10409 ,  H05K2201/10946 ,  H05K2201/10962 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00015 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2224/84 ,  H01L2224/33 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A semiconductor module (30) includes a copper connector (36a, 36b) jointing an electrode (S, G) formed on a top surface of a bear-chip transistor (35) and a wiring pattern (33b, 33c) out of plural wiring patterns (33a to 33d) via a solder (34b, 34c). The copper connector (36bb) includes an electrode-jointing portion (36bb) jointed to the electrode (G) of the bare-chip transistor (35) and a substrate-jointing portion (36bc) arranged to face the electrode-jointing portion (36bb) and jointed to the wiring pattern (33c). The width W1 of the electrode-jointing portion (36bb) in a direction perpendicular to one direction is smaller than the width W2 of the substrate-jointing potion (36bb) in the direction perpendicular to the one direction.

Abstract translation: 半导体模块（30）包括铜连接器（36a，36b），其连接形成在承载芯片晶体管（35）的顶表面上的电极（S，G）和多个布线中的布线图案（33b，33c） 图案（33a至33d）经由焊料（34b，34c）。 铜连接器（36bb）包括与裸芯片晶体管（35）的电极（G）连接的电极接合部（36bb）和与电极接合部（36bb）相对配置的基板接合部（36bc） ）并连接到布线图案（33c）。 电极接合部（36bb）在与一个方向垂直的方向上的宽度W1小于在与该一个方向垂直的方向上的基板接合部（36bb）的宽度W2。

公开(公告)号：EP2779806A2

公开(公告)日：2014-09-17

申请号：EP14159197.4

申请日：2014-03-12

Applicant: Grote Industries, LLC

Inventor： Brooks, Timothy Webster ,  Jones, Scott J. ,  Marx, Martin J. ,  Perez-Bolivar, Cesar ,  Roberts, James E. ,  Richardson II, George M.

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/28 ,  F21V29/00

CPC classification number: H01L33/644 ,  F21S4/22 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L2924/0002 ,  H05K1/0207 ,  H05K1/0209 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/284 ,  H05K2201/066 ,  H05K2201/10106 ,  H05K2201/1028 ,  H05K2201/10977 ,  H01L2924/00

Abstract: A flexible lighting element, comprising:
a first flexible substrate (510, 1110); first conductive element (130) and second conductive element (140) located on the first flexible substrate (510, 1110); a light-emitting element (210) having first and second contacts (230, 240) that are both on a first surface of the light-emitting element (210), the first contact (230) being electrically connected to the first conductive element (130), the second contact (240) being electrically connected to the second conductive element (140), and the light-emitting element (210) emitting light from a second surface opposite the first surface; a flexible top layer located adjacent to the second surface; an affixing layer (540) located between the first flexible substrate (510, 1110) and the flexible top layer, the affixing layer (540) affixing the flexible top layer to the first flexible substrate (510, 1110); and a heat spreading layer (1370, 1470) having a third surface and a fourth surface opposite the third surface, the heat spreading layer (1370, 1470) being affixed beneath the first flexible substrate (510, 1110) at the third surface, wherein the flexible top layer is substantially transparent to the selected wavelength of light.

公开(公告)号：EP2568784A2

公开(公告)日：2013-03-13

申请号：EP11194944.2

申请日：2011-12-21

Applicant: Primax Electronics Ltd

Inventor： Su, Chun-nan ,  Peng, Chun-Ching

IPC: H05K5/02

CPC classification number: H05K5/0278 ,  H01R13/6658 ,  H01R24/62 ,  H01R43/20 ,  H05K3/4015 ,  H05K2201/09754 ,  H05K2201/1028 ,  H05K2201/1056 ,  Y10T29/49139

Abstract: The present invention discloses a USB application device including a body, a circuit board, a plurality of first electrical pins and a plurality of electrical elements. The circuit board is disposed in the body. The plurality of first electrical pins are disposed on the circuit board and expended to the body such that the plurality of first electrical pins are partly exposed to the body. A space is formed between the plurality of first electrical pins and circuit board such that the plurality of electrical elements can be disposed on the space. The length of the circuit board therefore becomes shorter, and the volume of the USB application device is reduced.

Abstract translation: 本发明揭露一种USB应用装置，其包括主体，电路板，多个第一电性接脚以及多个电性元件。 电路板设置在主体中。 多个第一电引脚设置在电路板上并且扩展到主体，使得多个第一电引脚部分地暴露于主体。 在多个第一电引脚与电路板之间形成空间，使得多个电元件可以设置在该空间上。 因此电路板的长度变短，并且USB应用装置的体积减小。