公开(公告)号：EP1909545A3

公开(公告)日：2009-05-06

申请号：EP07117064.1

申请日：2007-09-24

Applicant: Deere & Company

Inventor： Livdahl, Richard J ,  Hawk, Nathan M ,  Johnston, Travis L ,  Segal, Vincent G ,  Wyland, Amanda R ,  Janssen, Dale A ,  Duppong, Jeffrey S

IPC: H05K3/30 ,  H05K7/14

CPC classification number: H05K3/366 ,  H05K3/301 ,  H05K2201/048 ,  H05K2201/09172 ,  H05K2201/10598 ,  H05K2201/10606

Abstract: A circuit board carrier (20) for mounting a first printed circuit board (12) in relation to a second printed circuit board (16) comprises:
a flat base (36) for abutting said second circuit board (16);
a pair of wings (38) on laterally opposite sides of said base (36), each said wing (38) including a snap-in feature (44) for snap engagement with a corresponding hole (46) in said second circuit board (16); and
at least one slot guide (40) for retaining a lateral edge of said first printed circuit board (12).

公开(公告)号：EP1883282A3

公开(公告)日：2008-12-03

申请号：EP07014532.1

申请日：2007-07-24

Applicant: Denso Corporation

Inventor： Kawabata, Akira ,  Fukaya, Yuichiro

IPC: H05K3/30 ,  H05K5/02 ,  H05K1/18 ,  H01M2/10

CPC classification number: H05K3/301 ,  H01M2/1055 ,  H05K1/0263 ,  H05K1/18 ,  H05K1/182 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10272 ,  H05K2201/10515 ,  H05K2201/10583 ,  H05K2201/10606 ,  H05K2201/2036

Abstract: An electronic apparatus (100) includes a housing (10) a circuit board (20) held in the housing (10), and large electronic components (30,31) held in the housing (10) and electrically coupled to the circuit board (20). The housing (10) has a mounting surface (10a) and the electronic apparatus is mounted to an object at the mounting surface (10a). The large electronic components (30,31) are arranged in a three-dimensional manner with respect to the mounting surface (10a) in such a manner that at least one of the large electronic components (30) overlaps at least one of the large electronic components (30) in a direction toward the mounting surface.

Abstract translation: 一种电子设备（100），包括：壳体（10）;保持在壳体（10）中的电路板（20）;以及保持在壳体（10）中并与电路板电连接的大型电子部件（30,31） 20）。 壳体（10）具有安装表面（10a），并且电子设备在安装表面（10a）处安装到物体上。 大型电子元件（30,31）相对于安装表面（10a）以三维方式布置，使得至少一个大型电子元件（30）与至少一个大型电子元件 部件（30）朝向安装表面的方向。

公开(公告)号：EP1915043A1

公开(公告)日：2008-04-23

申请号：EP06122447.3

申请日：2006-10-17

Applicant: Delphi Technologies, Inc.

Inventor： Kerr, Geoffrey

IPC: H05K7/12 ,  H05K3/30

CPC classification number: H05K7/12 ,  H05K3/301 ,  H05K2201/10015 ,  H05K2201/10606 ,  H05K2201/2018 ,  Y10T29/49002 ,  Y10T29/53174

Abstract: The invention relates to circuit component locating apparatus used to locate a circuit component, such as a resistor, capacitor etc. on a circuit board. The apparatus has a fastening frame and an attachment member projecting there from. The attachment member extends around the circuit component to provide a gap which can receive adhesive means in order to secure the circuit component to the attachment member. The apparatus may be used on any circuit board, although it is particularly useful for minimising the effect of vibrations on circuit boards of an automobile's Engine Control Unit (ECU).

Abstract translation: 本发明涉及用于在电路板上定位诸如电阻器，电容器等的电路部件的电路部件定位装置。 该装置具有从其突出的紧固框架和附接构件。 附接构件围绕电路部件延伸以提供可以接收粘合装置的间隙，以将电路部件固定到附接构件。 该装置可以用于任何电路板上，尽管对于使汽车的发动机控制单元（ECU）的电路板振动的影响最小化是特别有用的。

公开(公告)号：EP1755366A2

公开(公告)日：2007-02-21

申请号：EP06016674.1

申请日：2006-08-10

Applicant: POLYMATECH CO., LTD.

Inventor： Konno, Hideaki c/o R&D Center of Polymatech Co.Lt

IPC: H05K3/30

CPC classification number: H05K3/301 ,  H05K3/325 ,  H05K2201/0314 ,  H05K2201/10083 ,  H05K2201/10325 ,  H05K2201/10583 ,  H05K2201/10606

Abstract: According to the present invention, there is provided a holder having a pressure flange not to be easily disengaged from a small-sized electronic part in pressing and accommodating the holder having the small-sized electronic part in a mounting recess. A holder (10) includes a projecting portion (16) protruding from a pressing flange (13) toward a cylinder axis of a holding portion (11), formed in a portion having a predetermined length of an inner edge (13a) of the pressing flange (13). With this construction, when the holder (10) accommodating a small-sized electronic part (6) is mounted to a casing of an apparatus, even if the pressing flange (13) is rolled up and about to be disengaged from the small-sized electronic part (6), the projecting portion (16) engages with the small-sized electronic part (6), thereby preventing the pressing flange (13) from being rolled up.

Abstract translation: 根据本发明，提供了一种保持器，其具有在将具有小型电子部件的保持器按压并容纳在安装凹部中的情况下，不会容易地从小型电子部件脱离的压力凸缘。 保持器（10）包括从按压凸缘（13）朝向保持部（11）的气缸轴线突出的突出部分（16），形成在具有预定长度的内压边 法兰（13）。 利用这种结构，当将容纳小型电子部件（6）的保持器（10）安装到装置的壳体上时，即使按压凸缘（13）被卷起并且要从小尺寸 电子部件（6），突出部分（16）与小型电子部件（6）接合，从而防止按压凸缘（13）卷起。

公开(公告)号：EP1593187A1

公开(公告)日：2005-11-09

申请号：EP04706429.0

申请日：2004-01-29

Applicant: Unitrend Inc.

Inventor： JELINGER, Conrad, A., H.

IPC: H02G3/32 ,  H01B13/012

CPC classification number: H05K3/301 ,  H02G3/32 ,  H05K3/222 ,  H05K7/12 ,  H05K2201/10287 ,  H05K2201/10356 ,  H05K2201/10606

Abstract: A wire management system (10) includes a first portion (12) and a second portion (14). The first portion (12) comprises a base pivot (16), a base socket (18), a mounting stud (20) and a mounting bolt (22) for fastening the wire management system (10) to an electrical component, such as a printed circuit board (11). The second portion (14) comprises a cable guide assembly defined by at least two non-conductive guide members (24) with locking notches (26) and a base member (28). The guide members (24) permit orientation of the wires (13) and/or cabling (15) in a generally vertical direction to minimize the heat build-up from a heat-emitting device (17). In another embodiment, the wire management system (100) includes a mounting stud (112) and an integral cable guide assembly that includes a base portion (102) and an upper portion (104) with at least two guide members (114) that may be removably mounted to the mounting stud (112). The at least two guide members (114) orientate the wiring and/or cabling in a generally vertical direction to minimize the heat build-up from the heat emitting device (17). In another embodiment, the wire management system (200) includes a relief cut (208) with breakaway portions (208a-208c) including at least a throat portion (216), a neck portion (218) and a beveled portion (206). In yet another embodiment, the wire management system (300) includes a base portion (302) supported by a rigid plate or washer (350).

公开(公告)号：EP1589547A1

公开(公告)日：2005-10-26

申请号：EP04773173.2

申请日：2004-09-16

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： INOUE, Tatehiko ,  TAKEMOTO, Junji ,  KAWASAKI, Shusaku

IPC: H01G9/00 ,  H01G2/06 ,  H01G9/26

CPC classification number: H01G2/04 ,  H01G2/06 ,  H01G9/0003 ,  H01G9/26 ,  H05K3/301 ,  H05K2201/10015 ,  H05K2201/10409 ,  H05K2201/10606 ,  H05K2201/2036 ,  H05K2203/167

Abstract: A capacitor unit is provided, which has a long lifetime and is free from maintenance when it is used as an emergency power supply of electronic control braking system, etc. and in which weight load is not applied to a circuit board, high reliability in use under harsh vibration conditions is achieved, and short-circuit defect does not occur even when an explosion-proof valve operates. The capacitor unit of the present invention includes a plurality of capacitors, a circuit board on which a circuit pattern for connecting the capacitors is formed, and a holder sandwiching and retaining the body parts of the capacitors.

Abstract translation: 提供电容器单元，其寿命长，并且在用作电子控制制动系统的应急电源等时不受维护，并且其中不对电路板施加重量负载，在使用中具有高可靠性 在恶劣的振动条件下，即使在防爆阀操作时也不会发生短路故障。 本发明的电容器单元包括多个电容器，其上形成有用于连接电容器的电路图案的电路板和夹持并保持电容器的主体部分的保持架。

公开(公告)号：EP1567300A1

公开(公告)日：2005-08-31

申请号：EP03780095.0

申请日：2003-12-01

Applicant: Leica Geosystems AG

Inventor： ROSSOPOULOS, Stephane ,  VERETTAS, Irène ,  CLAVEL, Reymond

IPC: B23K1/005 ,  H05K3/34 ,  B23K35/00 ,  G02B6/42 ,  C04B37/00 ,  C03C17/00 ,  C03C17/06

CPC classification number: B23K33/00 ,  B23K1/0056 ,  G02B7/00 ,  H05K3/341 ,  H05K3/3494 ,  H05K2201/0108 ,  H05K2201/10606 ,  H05K2203/0475 ,  H05K2203/107 ,  Y02P70/613

Abstract: The invention relates to a method for fixing a miniaturised component (2), especially comprising a micro-optical element (3), to a pre-determined fixing section (7) of a base plate (1) by means of a soldered joint (6a). Said base plate (1) comprises an upper side (8) and a lower side (9), and the component (2) comprises a base surface (4). At least the fixing section (7) of the base plate (1) is coated on the upper side (8) by a metallic layer (5) which is applied at least in the fixing section (7) in a continuously plane manner and thus without interruptions. Solder material (6a) is applied at least to the fixing section (7) coated with the metallic layer (5). In one step of the method, the component (2) is arranged above the fixing section (7), the base surface (4) of the component (2) being positioned above the solder material (6a) in such a way that they do not touch, are vertically interspaced and form an intermediate region between each other. In another step, thermal energy is supplied, especially by means of a laser beam (11), in a region which is locally limited essentially to the fixing section (7), in order to melt the solder (6a) from the lower side (9) of the base plate (1), such that the intermediate region is filled by drop formation of the melted solder (6a'), fixing both sides.

公开(公告)号：EP0803920B1

公开(公告)日：2003-12-10

申请号：EP97109643.3

申请日：1989-12-13

Applicant: KYUSHU HITACHI MAXELL, LTD.

Inventor： Chiyajo, Masanobu ,  Kuroki, Toshio ,  Sakati, Eiji

IPC: H01M2/10 ,  H01M10/46 ,  B26B19/28 ,  H05K1/18

CPC classification number: H05K1/18 ,  B26B19/286 ,  B26B19/3853 ,  B26B19/3873 ,  H01M2/1055 ,  H01M2/20 ,  H01M2/34 ,  H01M10/46 ,  H05K1/0292 ,  H05K1/0293 ,  H05K1/117 ,  H05K3/3447 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/094 ,  H05K2201/10037 ,  H05K2201/10295 ,  H05K2201/10606 ,  H05K2201/10689 ,  H05K2201/2036 ,  H05K2203/175 ,  H05K2203/176

公开(公告)号：EP0438238B1

公开(公告)日：1995-04-26

申请号：EP91300211.9

申请日：1991-01-11

Applicant: Hewlett-Packard Company

Inventor： Mason, Scott C. ,  Slutz, Robert A.

IPC: H05K7/10 ,  H05K3/30 ,  H01R23/72

CPC classification number: H05K7/1046 ,  H01R12/716 ,  H05K3/301 ,  H05K2201/10325 ,  H05K2201/10606

公开(公告)号：EP0438238A3

公开(公告)日：1992-04-29

申请号：EP91300211.9

申请日：1991-01-11

Applicant: Hewlett-Packard Company

Inventor： Mason, Scott C. ,  Slutz, Robert A.

IPC: H05K7/10 ,  H05K3/30 ,  H01R23/72

CPC classification number: H05K7/1046 ,  H01R12/716 ,  H05K3/301 ,  H05K2201/10325 ,  H05K2201/10606

Abstract: Method and device are provided for use in the initial manufacture of surface mount printed circuit board (14) assemblies or for use in the replacement and repair of J-leads surface mount electrical components (12) on printed circuit boards (14). The device comprises
socket means (30) for receiving a surface mount electrical component (12),
and a plurality of contact elements (32) mounted on said socket means (30), each of said contact elements (32) having a first portion (50) for soldering the contact element (32) to a conductive pad (22) on a printed circuit board (14) and a second portion (52) for soldering said contact element (32) to a J-shaped lead (18) of said electrical component.