公开(公告)号：DE102005063400A1

公开(公告)日：2007-10-11

申请号：DE102005063400

申请日：2005-10-17

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MEYER THORSTEN ,  STUEBNER RALPH

IPC: H01L27/088 ,  H01L21/8234

Abstract: A semiconductor component arrangement has a semiconductor layer (6) formed on the substrate (1) and above this layer (6) an insulation- and wiring-area (23), and within the semiconductor layer (6) are formed further doped semiconductor areas (8). A specifically doped semiconductor structure (9) has the spacing (d1,d2) from its lower face to a horizontal reference level within the insulation- and wiring-area in a first zone (4) of the semiconductor layer (6) made less than in the second zone (6) of the semiconductor layer. An independent claim is given for a method for fabricating a semiconductor component arrangement.

公开(公告)号：DE10143790B4

公开(公告)日：2007-08-02

申请号：DE10143790

申请日：2001-09-06

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HEDLER HARRY ,  MEYER THORSTEN

IPC: H01L23/50 ,  H01L21/58 ,  H01L21/60 ,  H01L23/12 ,  H01L23/31 ,  H01L23/48 ,  H01L23/485

Abstract: An electronic component having at least one semiconductor chip, a rewiring layer connected to the semiconductor chip, and a printed circuit board associated with the rewiring layer. The rewiring layer is provided with flexible contacts that correspond with contact faces of the printed circuit board, and the rewiring layer is solidly connected to the printed circuit board via a flat intermediate layer. A method for producing the electronic component is described.

公开(公告)号：DE102004030813B4

公开(公告)日：2007-03-29

申请号：DE102004030813

申请日：2004-06-25

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HEDLER HARRY ,  MEYER THORSTEN

IPC: H01L21/60 ,  H01L21/98 ,  H01L23/31 ,  H01L23/485 ,  H01L23/498 ,  H01L23/50 ,  H01L25/065 ,  H01L25/16 ,  H01L27/148

公开(公告)号：DE102006015448A1

公开(公告)日：2007-01-25

申请号：DE102006015448

申请日：2006-03-31

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MEYER THORSTEN ,  BRUNNBAUER MARKUS ,  ESCHER-POEPPEL IRMGARD ,  STEINER RAINER

IPC: H01L23/50 ,  H01L21/60

Abstract: Wiring structure (1) of semiconductor component (2) includes conductive tracks (3) between chip contact spots (4) and outer contacts (5) with solder balls (6). Identical metal layer and layer sequence are used for chip contacts, conductive tracks and outer contacts.Lower (7) and top layer (9) are soluble and/or mixable in and/or with alloy of outer contacts at soldering temperature. Metal of middle layer (B) is insoluble or non-mixable with solder material of outer contacts. Independent claims are included for method for forming wiring structure for semiconductor components.

公开(公告)号：DE102004030813A1

公开(公告)日：2006-01-19

申请号：DE102004030813

申请日：2004-06-25

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HEDLER HARRY ,  MEYER THORSTEN

IPC: H01L21/60 ,  H01L21/98 ,  H01L23/31 ,  H01L23/485 ,  H01L23/498 ,  H01L23/50 ,  H01L25/065 ,  H01L25/16 ,  H01L27/148

公开(公告)号：DE10164800B4

公开(公告)日：2005-03-31

申请号：DE10164800

申请日：2001-11-02

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HEDLER HARRY ,  MEYER THORSTEN ,  FRANKOWSKY GERD ,  IRSIGLER ROLAND ,  VASQUEZ BABARA

IPC: H01L21/98 ,  H01L25/065 ,  H01L21/58 ,  H01L23/50

公开(公告)号：DE10324450A1

公开(公告)日：2005-01-05

申请号：DE10324450

申请日：2003-05-28

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HEDLER HARRY ,  MEYER THORSTEN ,  WEITZ PETER ,  IRSIGLER ROLAND

IPC: G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R31/28 ,  H01L21/66

Abstract: A contact-connection device for electronic circuit units includes an adapter board, at least one elastic element arranged on the adapter board, conductor tracks arranged on the at least one elastic element and the adapter board, conductor track connecting elements deposited on the adapter board and electrically connected to the conductor tracks, and contact-connection elements deposited on the at least one elastic element and electrically connected to the conductor tracks, the contact-connection elements contact-connecting circuit unit connecting elements of the circuit units in an elastically pressing-on fashion.

公开(公告)号：DE10261410A1

公开(公告)日：2004-07-22

申请号：DE10261410

申请日：2002-12-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HEDLER HARRY ,  MEYER THORSTEN ,  IRSIGLER ROLAND

IPC: H01L21/60 ,  H01L23/485 ,  H01L23/498 ,  H05K3/32 ,  H05K3/34 ,  H01L23/50

Abstract: Method for assembly of an integrated circuit (5) with a substrate by provision of a packing and substrate with the same number of junction regions, and relieved contact regions on the junction regions. Method for assembly of an integrated circuit (5) ,e.g. a chip, water or hybrid with a substrate by provision of a packing and substrate with the same number of junction regions, and relieved contact regions on the junction regions, forming first and second groups of contact regions, and creation of a connection between the packing and substrate over the relieved regions, where the two groups form rigid and elastic bonds respectively between the packing and substrate. An Independent claim is also included for a switching arrangement providing a connection between the integrated circuit, especially of a chip, wafer or hybrid with a substrate.

公开(公告)号：DE10319541A1

公开(公告)日：2004-07-08

申请号：DE10319541

申请日：2003-04-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KEMPER FRANZ ,  HEDLER HARRY ,  MEYER THORSTEN

IPC: H01L23/13 ,  H01L23/31 ,  H01L23/36 ,  H01L23/04

Abstract: The device has a semiconducting chip with a contact device on a first surface, a bearer above the surface without the contact extending laterally above the chip and a structured re-wiring device for electrically connecting the chip's contact device to the connector. The re-wiring device is attached to the first surface of the chip and the corresponding surface of the bearer and the connector extends laterally over the width of the chip. The device has a semiconducting chip (10) with a contact device (11) on a first surface for providing an integrated electrical component, a bearer (12) above the surface without the contact extending laterally above the chip and a structured re-wiring device (13) for electrically connecting the contact device of the chip to the connector (14). The re-wiring device is attached to the first surface of the chip and the corresponding surface of the bearer and the connector extends laterally over the width of the chip. AN Independent claim is also included for the following: (a) a method of manufacturing an inventive device.

公开(公告)号：DE10153609C2

公开(公告)日：2003-10-16

申请号：DE10153609

申请日：2001-11-02

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HEDLER HARRY ,  MEYER THORSTEN ,  FRANKOWSKY GERD ,  IRSIGLER ROLAND ,  VASQUEZ BARBARA

IPC: H01L21/98 ,  H01L25/065 ,  H01L23/538