公开(公告)号：US07442878B2

公开(公告)日：2008-10-28

申请号：US11538823

申请日：2006-10-05

Applicant: William E. Bernier ,  Marie S. Cole ,  Mukta G. Farooq ,  John U. Knickerbocker ,  Tasha E. Lopez ,  Roger A. Quon ,  David J. Welsh

Inventor： William E. Bernier ,  Marie S. Cole ,  Mukta G. Farooq ,  John U. Knickerbocker ,  Tasha E. Lopez ,  Roger A. Quon ,  David J. Welsh

IPC: H05K1/16

CPC classification number: H05K3/321 ,  H01L24/05 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/05557 ,  H01L2224/13076 ,  H01L2224/13078 ,  H01L2224/1308 ,  H01L2224/131 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/13339 ,  H01L2224/13464 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H05K2201/0212 ,  H05K2201/0248 ,  H05K2201/0373 ,  H05K2201/1025 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/00015 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: Disclosed is a laminated (or non-laminated) conductive interconnection for joining an integrated circuit device to a device carrier, where the conductive interconnection comprises alternating metal layers and polymer layers. In addition, the polymer can include dendrites, metal projections from the carrier or device, and/or micelle brushes on the outer portion of the polymer. The polymer layers include metal particles and the alternating metal layers and polymer layers form either a cube-shaped structure or a cylinder-shaped structure.

Abstract translation: 公开了用于将集成电路器件连接到器件载体的层压（或非层叠）导电互连，其中导电互连包括交替的金属层和聚合物层。 此外，聚合物可以包括枝晶，来自载体或器件的金属突起，和/或聚合物外部的胶束刷。 聚合物层包括金属颗粒，并且交替的金属层和聚合物层形成立方体结构或圆柱形结构。

公开(公告)号：US20070072425A1

公开(公告)日：2007-03-29

申请号：US10574603

申请日：2004-10-06

Applicant: Fumiaki Kikui ,  Akio Morishita ,  Masato Yasuoka

Inventor： Fumiaki Kikui ,  Akio Morishita ,  Masato Yasuoka

IPC: H01L21/461 ,  H01L21/302 ,  H01L21/4763 ,  H01L29/94 ,  H01L27/108 ,  H01L29/76 ,  H01L31/119

CPC classification number: H05K1/056 ,  H05K1/053 ,  H05K2201/0209 ,  H05K2201/0248

Abstract: A substrate according to the present invention includes a metal plate, and an insulating film, which is provided on the surface of the metal plate and which includes needle alumina particles and granular particles. The substrate of the present invention has excellent insulating property and can be manufactured on an industrial basis with acceptable efficiency.

Abstract translation: 根据本发明的基板包括金属板和绝缘膜，其设置在金属板的表面上并且包括针状氧化铝颗粒和颗粒状颗粒。 本发明的基板具有优异的绝缘性能，可以在工业上以可接受的效率制造。

公开(公告)号：US07062848B2

公开(公告)日：2006-06-20

申请号：US10665335

申请日：2003-09-18

Applicant: Alfred I-Tsung Pan ,  Yoocham Jeon ,  Scott Haubrich

Inventor： Alfred I-Tsung Pan ,  Yoocham Jeon ,  Scott Haubrich

IPC: H05K3/10 ,  H01B1/00

CPC classification number: H05K1/097 ,  B41M1/06 ,  B41M1/10 ,  B41M1/12 ,  B41M3/006 ,  B82Y30/00 ,  C09D11/30 ,  H01L29/7869 ,  H05K2201/0248 ,  Y10S977/786 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T428/24893

Abstract: Compositions and methods for production of conductive paths can include a printable composition including a liquid carrier and a plurality of nanostructures. The plurality of nanostructures can have an aspect ratio of at least about 5:1 within the liquid carrier. Examples of nanostructures include nanobelts, nanoplates, nanodiscs, nanowires, nanorods, and mixtures of these materials. These printable compositions can be used to form a conductive path on a substrate. The printable composition can be applied to a substrate using any number of conventional printing techniques. Following application of the printable composition, at least a portion of the liquid carrier can be removed such that the nanostructures can be in sufficient contact to provide a conductive path. The nanostructures arranged in a conductive path can be sintered or used as a conductive material without sintering.

Abstract translation: 用于制备导电路径的组合物和方法可以包括可印刷组合物，其包括液体载体和多个纳米结构。 多个纳米结构可以在液体载体内具有至少约5:1的纵横比。 纳米结构的实例包括纳米带，纳米板，纳米棒，纳米线，纳米棒以及这些材料的混合物。 这些可印刷组合物可用于在基材上形成导电路径。 可印刷组合物可以使用任何数量的常规印刷技术施加到基材上。 在施加可印刷组合物之后，可以除去液体载体的至少一部分，使得纳米结构可以充分接触以提供导电路径。 布置在导电路径中的纳米结构可以烧结或用作导电材料而不进行烧结。

公开(公告)号：US20060113680A1

公开(公告)日：2006-06-01

申请号：US11327260

申请日：2006-01-06

Applicant: Thomas DiStefano

Inventor： Thomas DiStefano

IPC: H01L23/48 ,  H01L23/28

CPC classification number: H01L24/81 ,  H01L21/561 ,  H01L21/563 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3114 ,  H01L23/49805 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/742 ,  H01L24/94 ,  H01L2224/02319 ,  H01L2224/02333 ,  H01L2224/0401 ,  H01L2224/11003 ,  H01L2224/1184 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/274 ,  H01L2224/29101 ,  H01L2224/29298 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/18301 ,  H05K3/3436 ,  H05K3/363 ,  H05K2201/0215 ,  H05K2201/0248 ,  H05K2201/09427 ,  H05K2201/10977 ,  H05K2203/0465 ,  H05K2203/074 ,  H05K2203/306 ,  Y02P70/613 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

Abstract: A soldered assembly for a microelectronic element includes a microelectronic element, solder columns extending from a surface of the microelectronic element and terminals connected to distal ends of the columns. The assembly can be handled and mounted using conventional surface-mount techniques, but provides thermal fatigue resistance. The solder columns may be inclined relative to the chip surface, and may contain long, columnar inclusions preferentially oriented along the lengthwise axes of the columns.

Abstract translation: 用于微电子元件的焊接组件包括微电子元件，从微电子元件的表面延伸的焊料柱和连接到柱的远端的端子。 组件可以使用传统的表面贴装技术进行处理和安装，但提供耐热疲劳性能。 焊料柱可以相对于芯片表面倾斜，并且可以包含沿着柱的纵向轴线优先取向的长的柱状夹杂物。

公开(公告)号：US20040201112A1

公开(公告)日：2004-10-14

申请号：US10411163

申请日：2003-04-10

Inventor： Ranjith Divigalpitiya ,  David A. Kanno ,  Patrice Jannic ,  Christophe Arnold ,  Richard Sabatier ,  Glen Connell

IPC: H01L023/48 ,  H01L029/40 ,  H01L021/44

CPC classification number: H01L24/29 ,  C08L67/00 ,  C08L77/00 ,  C09J9/02 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/29499 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/14 ,  H01R4/04 ,  H05K3/323 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/0281 ,  H01L2924/00

Abstract: An electronic assembly comprising a first electronic element, a second electronic element, and a durably flexible bond therebetween. The bond comprises an anisotropic conductive adhesive that includes elongated electrically conductive particles. The bond provides at least one electrical pathway between the first electronic element and the second electronic element through an elongated contact region. This bond is functionally maintained for at least about 200 flexes.

Abstract translation: 一种电子组件，包括第一电子元件，第二电子元件和它们之间的耐久性柔性接合。 该键包括包括细长导电颗粒的各向异性导电粘合剂。 该键通过细长的接触区域在第一电子元件和第二电子元件之间提供至少一个电路径。 该键在功能上维持至少约200个弯曲。

公开(公告)号：US06611065B2

公开(公告)日：2003-08-26

申请号：US09987396

申请日：2001-11-14

Applicant: Motohide Takeichi ,  Junji Shinozaki

Inventor： Motohide Takeichi ,  Junji Shinozaki

IPC: H01L2329

CPC classification number: H05K3/323 ,  H01L21/563 ,  H01L23/295 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/3511 ,  H05K1/189 ,  H05K2201/0209 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/0251 ,  H05K2201/10674 ,  Y10T428/24008 ,  H01L2924/00 ,  H01L2224/0401

Abstract: The present invention is a connection material which enables a flexible circuit board to be connected to a bare IC chip without causing a shoulder touch effect. The connection material contains an insulating adhesive and a flaky or fibrous insulating filler dispersed therein is used for connecting a film-like flexible circuit board and a bare IC chip. The aspect ratio of the flaky or fibrous insulating filler is no less than 20.

公开(公告)号：US06534124B2

公开(公告)日：2003-03-18

申请号：US10157883

申请日：2002-05-31

Applicant: Eiji Tamura ,  Wataru Kosaka ,  Toshimi Arashi

Inventor： Eiji Tamura ,  Wataru Kosaka ,  Toshimi Arashi

IPC: B05D312

CPC classification number: H05K3/381 ,  C23C18/1653 ,  C23C18/2013 ,  C23C18/285 ,  C23C18/30 ,  C23C18/34 ,  C23C18/40 ,  H05K1/0373 ,  H05K3/181 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0248 ,  H05K2201/09118 ,  H05K2203/025

Abstract: A process for producing an electrolessly plated molded article, which includes molding a resin composition made of a thermoplastic resin having a specific Izod impact strength and a Rockwell surface hardness and an inorganic filler, then treating the surface of the molded article with air blast using an abrasive having a sharp granular shape, and then conducting catalyst coating, activation treatment and electroless plating. It has been possible to apply the electroless plating with a high adhesion strength to the molded article of the thermoplastic resin composition without conducting the chemical etching treatment.

公开(公告)号：US20020187267A1

公开(公告)日：2002-12-12

申请号：US10157883

申请日：2002-05-31

Applicant: IDEMITSU PETROCHEMICAL CO., LTD.

Inventor： Eiji Tamura ,  Wataru Kosaka ,  Toshimi Arashi

IPC: B05D003/12 ,  C08L067/00

CPC classification number: H05K3/381 ,  C23C18/1653 ,  C23C18/2013 ,  C23C18/285 ,  C23C18/30 ,  C23C18/34 ,  C23C18/40 ,  H05K1/0373 ,  H05K3/181 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0248 ,  H05K2201/09118 ,  H05K2203/025

Abstract: A process for producing an electrolessly plated molded article, which includes molding a resin composition made of a thermoplastic resin having a specific Izod impact strength and a Rockwell surface hardness and an inorganic filler, then treating the surface of the molded article with air blast using an abrasive having a sharp granular shape, and then conducting catalyst coating, activation treatment and electroless plating. It has been possible to apply the electroless plating with a high adhesion strength to the molded article of the thermoplastic resin composition without conducting the chemical etching treatment.

Abstract translation: 一种无电镀模塑制品的制造方法，其包括将具有特定艾佐德冲击强度的热塑性树脂和洛氏硬度的无机填料制成的树脂组合物成型，然后使用空气吹扫处理模制品的表面 研磨剂具有尖锐的颗粒形状，然后进行催化剂涂覆，活化处理和化学镀。 可以对热塑性树脂组合物的成型体施加高粘合强度的无电镀，而不进行化学蚀刻处理。

公开(公告)号：US06419981B1

公开(公告)日：2002-07-16

申请号：US09620524

申请日：2000-07-20

Applicant: Bruce E. Novich ,  Kami Lammon-Hilinski ,  Walter J. Robertson ,  Xiang Wu ,  Vedagiri Velpari ,  Ernest L. Lawton ,  William B. Rice

Inventor： Bruce E. Novich ,  Kami Lammon-Hilinski ,  Walter J. Robertson ,  Xiang Wu ,  Vedagiri Velpari ,  Ernest L. Lawton ,  William B. Rice

IPC: B05D302

CPC classification number: B05D3/02 ,  C03C25/00 ,  C03C25/10 ,  C03C25/26 ,  C03C25/28 ,  C03C25/32 ,  C03C25/42 ,  C03C25/47 ,  C03C25/48 ,  C08J5/08 ,  H05K1/0366 ,  H05K3/0047 ,  H05K2201/0166 ,  H05K2201/0175 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0215 ,  H05K2201/0239 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/0254 ,  H05K2201/029 ,  H05K2203/127

Abstract: Methods for inhibiting abrasive wear of a fiber strand comprising at least one glass fiber by sliding contact with surface asperities of a solid object, comprising (a) applying a composition to at least a portion of a surface of at least one glass fiber of a glass fiber strand; (b) at least partially drying the composition to form a sized glass fiber strand having a residue of the composition upon at least a portion of the surface of the at least one class fiber; and (c) sliding at least a portion of the glass fiber strand to contact surface asperities of a solid object, the surface asperities having a hardness value which is greater than a hardness value of the at least one glass fiber, such that abrasive wear of the at least one glass fiber of the glass fiber strand by contact with the surface asperities of the solid object is inhibited by the inorganic solid lubricant particles.

Abstract translation: 通过与固体物体的表面粗糙度滑动接触来抑制包含至少一种玻璃纤维的纤维束的磨损磨损的方法，包括（a）将组合物施加到玻璃的至少一个玻璃纤维的至少一部分表面上 纤维束; （b）至少部分地干燥所述组合物以在所述至少一种类纤维的表面的至少一部分上形成具有所述组合物残基的尺寸的玻璃纤维线; 和（c）将所述玻璃纤维线的至少一部分滑动以接触固体物体的粗糙度，所述表面粗糙度的硬度值大于所述至少一种玻璃纤维的硬度值，使得所述玻璃纤维线的磨损 通过与固体物体的表面粗糙度接触的玻璃纤维线束的至少一个玻璃纤维被无机固体润滑剂颗粒抑制。

公开(公告)号：US06348737B1

公开(公告)日：2002-02-19

申请号：US09517847

申请日：2000-03-02

Applicant: Gerald G. Advocate, Jr. ,  Francis J. Downes, Jr. ,  Luis J. Matienzo ,  Ronald A. Kaschak ,  John S. Kresge ,  Daniel C. Van Hart

Inventor： Gerald G. Advocate, Jr. ,  Francis J. Downes, Jr. ,  Luis J. Matienzo ,  Ronald A. Kaschak ,  John S. Kresge ,  Daniel C. Van Hart

IPC: H01L2348

CPC classification number: H01L23/5226 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K3/0035 ,  H05K3/027 ,  H05K3/06 ,  H05K3/383 ,  H05K3/421 ,  H05K3/4644 ,  H05K2201/0248 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2203/0307 ,  H05K2203/0353 ,  H01L2924/00

Abstract: An electronic structure including a metallic interlocking structure for bonding a conductive plated layer to metal surface, and a method of forming the electronic structure. The method provides a substrate having a metallic sheet within a dielectric layer. The metallic sheet includes a metal such as copper. An opening in the substrate, such as a blind via, is formed by laser drilling through the dielectric layer and partially through the metallic sheet. If the opening is a blind via, then the laser drilling is within an outer ring of the blind via cross section using a laser beam having a target diameter between about 20% and about 150% of a radius of the blind via cross section. A surface at the bottom of the opening, called a “blind surface,” includes a metallic protrusion formed by the laser drilling, such that the metallic protrusion is integral with a portion of the blind surface. The metallic protrusion includes the metal of the metallic sheet and at least one constituent element from the dielectric layer. The metallic protrusion is then etched to form a metallic interlocking structure that is integral with the portion of the blind surface. The metallic interlocking structure includes discrete metallic fibers, with each metallic fiber having a curved (or curled) geometry. Each metallic fiber has its own unique composition that includes the metal, at least one constituent element of the dielectric layer, or both.

Abstract translation: 一种电子结构，包括用于将导电镀层接合到金属表面的金属互锁结构，以及形成电子结构的方法。 该方法提供了在电介质层内具有金属片的衬底。 金属片包括铜等金属。 通过激光钻孔穿过电介质层并且部分地穿过金属片，形成诸如盲孔之类的衬底中的开口。 如果开口是盲孔，则激光钻孔是通过横截面的盲孔通过横截面的半径的约20％至约150％之间的目标直径的激光束在盲孔的外环内。 在开口底部的称为“盲面”的表面包括通过激光钻孔形成的金属突起，使得金属突起与盲表面的一部分成一体。 金属突起包括金属片的金属和来自电介质层的至少一个构成元件。 然后蚀刻金属突起以形成与盲表面的一部分成一体的金属互锁结构。 金属互锁结构包括分立的金属纤维，每个金属纤维具有弯曲（或卷曲）的几何形状。 每种金属纤维具有其独特的组成，其包括金属，介电层的至少一个构成元件，或两者。