公开(公告)号：WO2008041484A1

公开(公告)日：2008-04-10

申请号：PCT/JP2007/068184

申请日：2007-09-19

Applicant: アルプス電気株式会社 ,  長野 真一 ,  吉田 信

Inventor： 長野 真一 ,  吉田 信

IPC: H01L23/12 ,  C25D7/00 ,  H01L21/60 ,  H01R13/03 ,  H01R33/76

CPC classification number: H01R43/0214 ,  H01L23/49811 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/81201 ,  H01L2224/81206 ,  H01L2224/81222 ,  H01L2224/81234 ,  H01L2224/81385 ,  H01L2224/81464 ,  H01L2224/81801 ,  H01L2924/00011 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/19042 ,  H01R13/2421 ,  H05K3/326 ,  H05K3/4015 ,  H05K3/42 ,  H05K2201/0311 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2201/10265 ,  H05K2201/10378 ,  H05K2201/10734 ,  Y10T156/10 ,  H01L2924/01083 ,  H01L2924/00014 ,  H01L2224/83851 ,  H01L2924/00

Abstract: 【課題】　ＩＣパッケージなどの電子部品の接続電極との間の接合強度を高める弾性接触子および金属端子間の接合方法を提供する。 【解決手段】　ハンダで形成された電子部品側の接続電極４２と弾性接触子２０の先端部２２ｂとが接触部Ｏで接触している。弾性接触子２０は先端部２２ｂに抵抗層が形成されており、先端部２２ｂが誘導コイル５０の隙間５１内に配置されている。前記誘導コイル５０に所定の高周波電流を流すと、前記抵抗部が電磁誘導によって発熱し、接続電極４２のハンダが溶けて前記弾性接触子２０の先端部２２ｂに流れ込むため、弾性接触子２０の先端部２２ｂと接続電極４２との間を、前記接触部Ｏの一点で強固に接合することができる。

Abstract translation: 为了提供一种用于提高与诸如IC封装的电子部件的连接电极的接合强度的弹性接触，并提供金属端子之间的接合方法。 解决问题的手段由电子部件侧的焊料形成的连接电极（42）与接触部（O）的弹性接触部（20）的前端部（22b）接触。 电阻层形成在弹性触头（20）的前端部（22b）上，前端部（22b）配置在感应线圈（50）的间隙（51）上。 当允许规定的高频电流在感应线圈（50）中流动时，电阻部分由于电磁感应而产生热量，并且连接电极（42）的焊料熔化并流入前端部（22b）的前端部 弹性接触件（20）。 因此，弹性接触件（20）的前端部分（22b）和连接电极（42）在接触部分（O）的一个点牢固地结合。

公开(公告)号：WO2006102876A3

公开(公告)日：2006-11-23

申请号：PCT/DE2006000550

申请日：2006-03-28

Applicant: CONTI TEMIC MICROELECTRONIC ,  SCHLENKER ROBERTO ,  NAGEL MICHAEL ,  MARTIN JUERGEN

Inventor： SCHLENKER ROBERTO ,  NAGEL MICHAEL ,  MARTIN JUERGEN

IPC: H05K1/02 ,  H01H37/76

CPC classification number: H01H37/761 ,  H01H2037/762 ,  H05K1/0201 ,  H05K3/222 ,  H05K3/3421 ,  H05K2201/09072 ,  H05K2201/10181 ,  H05K2201/10265 ,  H05K2203/176

Abstract: The invention relates to an electronic assembly (1) which comprises a printed circuit (2), provided with strip conductors (6) and equipped with a plurality of SMD components (4) and/or additional electronic and/or electromechanical components using a suitable solder, thereby forming an electronic circuit. The aim of the invention is to ensure by simple means that power dissipation of such an electronic assembly is reduced. For this purpose, a plurality of connections is established between strip conductors (6), components and/or component parts via respective spring-loaded contact bridges (12, 12', 12'', 12''').

Abstract translation: 一种电子组件（1）与印刷电路板（2）设置有导体轨道（6）和用于通过使用合适的焊料与多个SMD元件（4）和/或其他电子和/或机电形成电子电路 他的填充请参阅组件将简单的手段来高功耗对冲。 为了这个目的，根据本发明是通过相应的弹簧加载的接触桥（12，12“ 12``，12``”）的数导体轨道（6），装置和/或组件之间的连接的准备。

公开(公告)号：WO2004001904A8

公开(公告)日：2004-05-21

申请号：PCT/US0319295

申请日：2003-06-19

Applicant: RAZON ELI

Inventor： RAZON ELI

IPC: H01L21/00 ,  H01L21/607 ,  H01L23/485 ,  H01L23/498 ,  H01R13/24 ,  H05K3/32 ,  H01R

CPC classification number: H01L24/85 ,  H01L21/4825 ,  H01L23/49811 ,  H01L24/10 ,  H01L24/13 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/43 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45611 ,  H01L2224/45616 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45655 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48455 ,  H01L2224/48472 ,  H01L2224/73204 ,  H01L2224/78302 ,  H01L2224/78313 ,  H01L2224/78318 ,  H01L2224/85205 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/19042 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01R13/2407 ,  H05K3/325 ,  H05K2201/10265 ,  H05K2201/10719 ,  H01L2924/00014 ,  H01L2924/00011 ,  H01L2924/00 ,  H01L2924/00015

Abstract: A new and improved electrical connector is provided for Ball Grid Array (BGA) devices and Direct Chip Attach (DCA) devices that solves the prior art problems of mismatch in the coefficient of thermal between a semiconductor die and its substrate, PC board or carrier. The electrical connector consists of a resilient loop of wire that is permanently wire bonded at a first and a second bond position to an electrode or contact pad of a die or an interposer. The closed loop of wire is stable in the X and Y direction and resilient in the Z direction which enables the wire bonded die or interposer to be temporarily attached to a carrier or test board for all forms of tests as well as being removable and reworkable even after being permanently soldered in place on a substrate or PC board. Since the loop shaped connectors are resilient in X, Y and Z directions, the die or interposer may be clamped onto a PC board or substrate to provide a lead free electrical connection that does not require any underfill. The loop size may be made with highly conductive and/or plated (coated) wire in sizes from about 2.5 mils diameter up to about 30 mils using wire having a diameter of about 1.0 mils up to 5.0 mils to replace prior art balls used on pads of about 3 mils size or greater.

Abstract translation: 为球栅阵列（BGA）器件和直接芯片连接（DCA）器件提供了一种新的改进的电连接器，其解决了半导体管芯及其衬底，PC板或载体之间的热系数不匹配的现有技术问题。 电连接器由电线的弹性回路组成，其在第一和第二接合位置处永久地引线接合到模具或插入件的电极或接触焊盘。 线的闭环在X和Y方向上是稳定的，并且在Z方向上具有弹性，这使得线接合模具或插入件能够临时连接到载体或测试板以进行所有形式的测试，并且甚至可移除和再加工 在基板或PC板上永久焊接到位之后。 由于环形连接器在X，Y和Z方向上具有弹性，所以芯片或插入件可夹在PC板或基板上，以提供不需要任何底部填充的无铅电连接。 可以使用具有约1.0密耳至高达5.0密耳直径的线的直径大约2.5密耳直径至约30密耳的高导电性和/或电镀（涂覆）线制成环尺寸，以代替在垫上使用的现有技术球 约3密耳尺寸或更大。

公开(公告)号：WO2004001904A2

公开(公告)日：2003-12-31

申请号：PCT/US2003/019295

申请日：2003-06-19

Applicant: RAZON, Eli

Inventor： RAZON, Eli

IPC: H01R

CPC classification number: H01L24/85 ,  H01L21/4825 ,  H01L23/49811 ,  H01L24/10 ,  H01L24/13 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/43 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45611 ,  H01L2224/45616 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45655 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48455 ,  H01L2224/48472 ,  H01L2224/73204 ,  H01L2224/78302 ,  H01L2224/78313 ,  H01L2224/78318 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/19042 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01R13/2407 ,  H05K3/325 ,  H05K2201/10265 ,  H05K2201/10719 ,  H01L2924/00011 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A new and improved electrical connector is provided for Ball Grid Array (BGA) devices and Direct Chip Attach (DCA) devices that solves the prior art problems of mismatch in the coefficient of thermal between a semiconductor die and its substrate, PC board or carrier. The electrical connector consists of a resilient loop of wire that is permanently wire bonded at a first and a second bond position to an electrode or contact pad of a die or an interposer. The closed loop of wire is stable in the X and Y direction and resilient in the Z direction which enables the wire bonded die or interposer to be temporarily attached to a carrier or test board for all forms of tests as well as being removable and reworkable even after being permanently soldered in place on a substrate or PC board. Since the loop shaped connectors are resilient in X, Y and Z directions, the die or interposer may be clamped onto a PC board or substrate to provide a lead free electrical connection that does not require any underfill. The loop size may be made with highly conductive and/or plated (coated) wire in sizes from about 2.5 mils diameter up to about 30 mils using wire having a diameter of about 1.0 mils up to 5.0 mils to replace prior art balls used on pads of about 3 mils size or greater.

Abstract translation: 为球栅阵列（BGA）器件和直接芯片连接（DCA）器件提供了一种新的改进的电连接器，其解决了半导体管芯及其衬底，PC板或载体之间的热系数不匹配的现有技术问题。 电连接器由电线的弹性回路组成，其在第一和第二接合位置处永久地引线接合到模具或插入件的电极或接触焊盘。 线的闭环在X和Y方向上是稳定的，并且在Z方向上具有弹性，这使得线接合模具或插入件能够临时连接到载体或测试板以进行所有形式的测试，并且甚至可移除和再加工 在基板或PC板上永久焊接到位之后。 由于环形连接器在X，Y和Z方向上具有弹性，所以芯片或插入件可夹在PC板或基板上，以提供不需要任何底部填充的无铅电连接。 可以使用具有约1.0密耳至高达5.0密耳直径的线的直径大约2.5密耳直径至约30密耳的高导电性和/或电镀（涂覆）线制成环尺寸，以代替在垫上使用的现有技术球 约3密耳尺寸或更大。

公开(公告)号：EP3403164A1

公开(公告)日：2018-11-21

申请号：EP17702159.9

申请日：2017-01-12

Applicant: Electrolux Home Products, Inc.

Inventor： STOUFER, Paul

IPC: G06F3/01 ,  H05K1/18

CPC classification number: G06F3/016 ,  H05K1/181 ,  H05K2201/09072 ,  H05K2201/1003 ,  H05K2201/10083 ,  H05K2201/10265 ,  Y02P70/611

Abstract: An apparatus such as an appliance with a printed circuit board, PCB, (202) mounted haptic feedback device (200) is provided. The apparatus comprises a printed circuit board (PCB) having an opening (204) defined therein, and a spool (206) affixed to the PCB and having a shaft with a coil (208) wound thereabout. The shaft defines an opening aligned with the opening of the PCB. The apparatus also comprises a spring-loaded plunger positioned and movable within the opening of the shaft. The spring-loaded plunger includes a metallic disk operatively coupled to an end of the plunger and distally positioned to the spool. A control component of the apparatus is configured to energize the coil according to a haptic feedback pattern, and thereby cause the coil to attract the metallic disk and move the plunger within the opening of the shaft of the spool, and through the opening of the PCB.

公开(公告)号：EP3386280A1

公开(公告)日：2018-10-10

申请号：EP17382185.1

申请日：2017-04-06

Applicant: Valeo Iluminacion

Inventor： TEBA, Daniel ,  GUZMAN, Alfonso-Manuel

IPC: H05K3/30 ,  H05K3/32

CPC classification number: H05K3/301 ,  H05K3/325 ,  H05K2201/10106 ,  H05K2201/10113 ,  H05K2201/10265 ,  H05K2201/10272 ,  H05K2201/1031 ,  H05K2201/10386 ,  H05K2201/1059 ,  H05K2201/10833 ,  H05K2201/2018 ,  Y02P70/611

Abstract: This invention provides an electronic assembly (1) for receiving an electronic part (10) in an automotive lighting device. This electronic assembly (1) comprises a plastics substrate (2), an electrically insulating support element (4) and a conductive link (5). The plastics substrate (2) comprises at least one conductive track (3) directly deposited on a first face (21) of the plastics substrate (2). The electrically insulating support element (4) protrudes from the first face (21) of the plastics substrate (2). The conductive link (5) is in electrical contact with the at least one conductive track (3), is mechanically coupled with the electrically insulating support element (4) and comprises a connection portion (51) suitable for being electrically connected to the electronic part (10) of an automotive lighting device (1).

公开(公告)号：EP1864556B1

公开(公告)日：2018-05-16

申请号：EP06722702.5

申请日：2006-03-28

Applicant: Conti Temic Microelectronic GmbH

Inventor： SCHLENKER, Roberto ,  NAGEL, Michael ,  MARTIN, Jürgen

IPC: H05K1/02 ,  H01H37/76

CPC classification number: H01H37/761 ,  H01H2037/762 ,  H05K1/0201 ,  H05K3/222 ,  H05K3/3421 ,  H05K2201/09072 ,  H05K2201/10181 ,  H05K2201/10265 ,  H05K2203/176

公开(公告)号：EP3309829A1

公开(公告)日：2018-04-18

申请号：EP17194324.4

申请日：2017-10-02

Applicant: Iriso Electronics Co., Ltd.

Inventor： Sugaya, Yujiro ,  Asanuma, Yuki

IPC: H01L23/498

CPC classification number: H05K1/09 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49866 ,  H05K1/112 ,  H05K1/144 ,  H05K3/366 ,  H05K3/4038 ,  H05K2201/0338 ,  H05K2201/041 ,  H05K2201/09727 ,  H05K2201/098 ,  H05K2201/09827 ,  H05K2201/10265

Abstract: To provide a circuit board that is capable of establishing electrical connection, that is thinner, and that has a higher maintainability. A circuit board 100 includes a substrate 101 including a hole portion 110 that penetrates the substrate 101 in a plate thickness direction, and a connector region including a first conductor layer 202 that closes one side of the hole portion 110, liquid metal 210 disposed in a recess 201 formed by the hole portion 110 and the first conductor layer 202, and a sealing layer 212 that is the liquid metal 210 cured on a liquid surface side. The liquid metal 210 may be in contact with a second conductor layer 204 formed in the recess 201.

Abstract translation: 提供一种能够建立电连接的电路板，该电路板较薄且具有较高的可维护性。 电路基板100具备：基板101，其具有在板厚方向上贯通基板101的孔部110;以及连接器区域，该连接器区域包括将孔部110的一侧封闭的第一导体层202，配置在基板101上的液态金属210 由孔部110和第一导体层202形成的凹部201和在液面侧固化的作为液态金属210的密封层212。 液态金属210可以与形成在凹槽201中的第二导体层204接触。

公开(公告)号：EP3149809A1

公开(公告)日：2017-04-05

申请号：EP15799258.7

申请日：2015-05-29

Applicant: Ideal Industries, Inc.

Inventor： ZANTOUT, Alan E.

IPC: H01R12/52 ,  H01R12/88 ,  H01R13/62

CPC classification number: H01R12/732 ,  H01R4/4818 ,  H01R11/01 ,  H01R12/53 ,  H01R12/7023 ,  H01R12/7029 ,  H01R12/7052 ,  H01R12/714 ,  H05K1/142 ,  H05K3/368 ,  H05K2201/09163 ,  H05K2201/10189 ,  H05K2201/10265 ,  H05K2201/1031 ,  H05K2201/10424 ,  Y02P70/611

Abstract: An electrical connector has one or more body portions in which is disposed an electrical terminal having at least one contact pad interface for coupling to a contact pad of at least one printed circuit board (PCB). The body has an associated fastening device which is used to mechanically and electrically couple the electrical connector to the at least one PCB. The electrical connector may be provided with a full or partial hourglass-like shape, when viewed from the side and/or from above, to facilitate its use with a PCB that carries a source of light, such as an LED.

Abstract translation: 电连接器具有一个或多个主体部分，其中设置有具有至少一个接触焊盘接口的电端子，用于耦合到至少一个印刷电路板（PCB）的接触焊盘。 主体具有相关联的紧固装置，其用于将电连接器机械地和电耦合到至少一个PCB。 当从侧面和/或从上方观察时，电连接器可以设置有全部或部分沙漏形状，以便于其与携带诸如LED的光源的PCB一起使用。

公开(公告)号：EP2727142B1

公开(公告)日：2017-03-15

申请号：EP12719527.9

申请日：2012-04-11

Applicant: Apple Inc.

Inventor： DEGNER, Brett W. ,  TICE, Gregory

IPC: G06F1/20 ,  H01L23/40 ,  H05K7/12 ,  H05K3/30 ,  H05K7/20 ,  H01L23/427 ,  H01L23/473

CPC classification number: G06F1/20 ,  H01L23/4006 ,  H01L23/427 ,  H01L23/473 ,  H01L2924/0002 ,  H05K3/301 ,  H05K7/12 ,  H05K7/20 ,  H05K7/20254 ,  H05K2201/064 ,  H05K2201/10265 ,  H05K2201/10325 ,  H05K2201/10393 ,  H05K2201/10704 ,  H05K2203/0278 ,  Y10T29/49124 ,  Y10T29/49826 ,  Y10T29/53113 ,  H01L2924/00