公开(公告)号：JP4613237B2

公开(公告)日：2011-01-12

申请号：JP2008313966

申请日：2008-12-10

Applicant: 新光電気工業株式会社

Inventor： 茂生 中島 ,  一宏 大島 ,  良和 平林 ,  徳孝 松下

IPC: H01L23/12

CPC classification number: H01L23/49811 ,  H01L2924/0002 ,  H01L2924/15312 ,  H05K3/3426 ,  H05K2201/10318 ,  H05K2201/10772 ,  H05K2201/10787 ,  H05K2201/10795 ,  Y02P70/613 ,  H01L2924/00

公开(公告)号：JPWO2006104003A1

公开(公告)日：2008-09-04

申请号：JP2007510427

申请日：2006-03-23

Applicant: 並木精密宝石株式会社

Inventor： 俊雄 植木 ,  俊雄 植木 ,  智英 青柳 ,  智英 青柳 ,  久郷　智之 ,  智之 久郷

IPC: H02K5/00

CPC classification number: H05K3/341 ,  H02K5/04 ,  H02K5/225 ,  H02K7/061 ,  H05K2201/10772 ,  H05K2201/10969 ,  H05K2201/2036 ,  Y02P70/613

Abstract: 【課題】半田リフロー処理時において、半田溶融時の金属ホルダー又は金属ハウジングケースの浮き現象を抑え、位置ズレが発生しにくい表面実装型振動モータ及び取付構造を提供する。【解決手段】回転軸に偏心分銅を取り付けた振動モータと、前記振動モータ本体の胴部を保持し、載置する回路基板側の固定領域に半田接合する金属ホルダーと、前記振動モータ本体内部の回転駆動機構に通電するための一対の給電端子と、を備える表面実装型振動モータにおいて、振動モータ本体の胴部を保持し、載置する回路基板側の固定領域に当接して半田接合する前記金属ホルダーの底面部に、回転軸の軸方向に延在する隆起した凸状レールを複数本、あるいは半球状の突起を複数個配置したことを特徴とする表面実装型振動モータとする。【選択図】図1

公开(公告)号：JP2007188697A

公开(公告)日：2007-07-26

申请号：JP2006004422

申请日：2006-01-12

Applicant: Tyco Electronics Amp Kk ,  タイコエレクトロニクスアンプ株式会社

Inventor： KAWAHARA YUZO

IPC: H01R4/02 ,  H01R24/00 ,  H05K1/18

CPC classification number: H05K3/3426 ,  H01R12/707 ,  H01R12/727 ,  H05K2201/09781 ,  H05K2201/10189 ,  H05K2201/10772 ,  Y02P70/613

Abstract: PROBLEM TO BE SOLVED: To provide a fastening fixture capable of preventing deterioration of substrate holding strength even if the mounting area is made smaller than conventional one, and a surface mounting component having this fastening fixture, and a mounting structure using this fastening fixture.
SOLUTION: The fastening fixture 20 is a fixing fixture for connecting a connecting object on a circuit board PCB by soldering. The fastening fixture 20 comprises a fixing part 21 to be fixed on the side of the connecting object 21 and a solder connecting part 22 which extends from the fixing part 21 and soldered and connected to the surface of the circuit board. The end part of the solder connecting part 22 is folded back in U-shape toward the outside and the ridge part 22a of straight line shape contacts the surface of the circuit board PCB. Solder fillet 30 is formed integrally mutually in close contact on both sides of the ridge part 22a of the solder connecting part 22 in contact with the circuit board PCB.
COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：提供一种能够防止基板保持强度的劣化的紧固固定装置，即使安装面积比常规尺寸小，并且具有该紧固固定装置的表面安装部件以及使用该紧固件的安装结构 夹具。

解决方案：紧固固定件20是用于通过焊接连接电路板PCB上的连接对象的固定夹具。 紧固固定件20包括固定在连接物体21一侧的固定部分21和从固定部分21延伸并焊接并连接到电路板表面的焊料连接部分22。 焊料连接部22的端部朝向外侧U形折回，直线状的脊部22a与电路基板PCB的表面接触。 在与电路板PCB接触的焊料连接部22的脊部22a的两侧，焊盘30形成为一体地相互紧密接触。 版权所有（C）2007，JPO＆INPIT

公开(公告)号：JP2005038927A

公开(公告)日：2005-02-10

申请号：JP2003197860

申请日：2003-07-16

Applicant: Kanto Sanyo Semiconductors Co Ltd ,  Sanyo Electric Co Ltd ,  三洋電機株式会社 ,  関東三洋セミコンダクターズ株式会社

Inventor： KAMEYAMA KOJIRO ,  MITA KIYOSHI

IPC: H01L23/12 ,  H01L21/68 ,  H01L23/31 ,  H01L23/48 ,  H01L23/495 ,  H05K3/34

CPC classification number: H01L21/6835 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2221/68331 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/181 ,  H05K3/3426 ,  H05K3/3442 ,  H05K2201/09154 ,  H05K2201/10772 ,  H05K2201/10931 ,  Y02P70/613 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

Abstract: PROBLEM TO BE SOLVED: To enhance the visibility of a bonding material fuse to an external terminal. SOLUTION: In the semiconductor device 100 where a semiconductor element 103 and an electrode 106 connected electrically with the semiconductor element 103 are sealed with an insulating sealing material 107 and the electrode 106 is exposed to the circumference of a mounting surface being bonded to an external mounting substrate 200 through a bonding material 300, the electrode 106 has such a shape as the bonding material 300 can be viewed from the side face surrounding the mounting surface under a state where the mounting surface is bonded to the mounting substrate 200 through the bonding material 300. COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：提高接合材料熔断器对外部端子的可见性。 解决方案：在半导体器件100中，半导体元件103和与半导体元件103电连接的电极106用绝缘密封材料107密封，并且电极106暴露于安装表面的周围， 通过接合材料300的外部安装基板200，电极106具有这样的形状，即，在安装面通过安装基板200与安装基板200接合的状态下，可以从围绕安装面的侧面观察接合材料300 粘合材料300.版权所有（C）2005，JPO＆NCIPI

公开(公告)号：EP1993172A4

公开(公告)日：2011-03-09

申请号：EP07706598

申请日：2007-01-11

Applicant: TYCO ELECTRONICS JAPAN G K

Inventor： KAWAHARA YUZO

IPC: H01R4/02 ,  H01R24/00 ,  H05K1/18

CPC classification number: H05K3/3426 ,  H01R12/707 ,  H01R12/727 ,  H05K2201/09781 ,  H05K2201/10189 ,  H05K2201/10772 ,  Y02P70/613

公开(公告)号：EP1754400A1

公开(公告)日：2007-02-21

申请号：EP05748489.1

申请日：2005-06-03

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： HIDAKA, Akio ,  IKEBE, Shouichi ,  MURANO, Yuuichi ,  KAZITANI, Hirozumi ,  IKEDA, Mika ,  MIZOGUCHI, Yoshitaka

IPC: H05K5/00

CPC classification number: H05K3/3426 ,  H01G2/065 ,  H05K5/0095 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09154 ,  H05K2201/10651 ,  H05K2201/10772 ,  H05K2201/10909 ,  H05K2201/2009 ,  Y02P70/613

Abstract: The present invention aims to supply an electronic component which is manufactured in a manufacturing process at low cost, and realize improvement of shock resistance, endurance, flexure resistance, mounting reliability etc. at the same time, without requiring fine adjustment etc. The invention is an electronic component 1 which has an element 2, a pair of terminal portions 4 which were disposed on the element 2, and an external covering material 5 which covers the a part of the terminal portions 4 and the element 2, and configured in such a manner that inclined portions 10 are disposed on corner portions of a bottom surface 9 and side surfaces of the external covering material 5, and the terminal portions 4 are protruded from corner portions where the inclined portions 10 and the bottom surface 9 of the external covering material intersect.

公开(公告)号：EP0817267B1

公开(公告)日：2004-09-08

申请号：EP97112006.8

申请日：1995-03-09

Applicant: Silicon Bandwidth, Inc.

Inventor： Crane, Stanford W., Jr. ,  Portuondo, Maria M.

IPC: H01L23/498

CPC classification number: H01L23/49861 ,  H01L23/49811 ,  H01L2924/0002 ,  H01L2924/181 ,  H05K1/112 ,  H05K3/308 ,  H05K3/321 ,  H05K3/3421 ,  H05K3/4623 ,  H05K2201/09472 ,  H05K2201/09536 ,  H05K2201/09645 ,  H05K2201/10189 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10704 ,  H05K2201/10772 ,  H05K2201/10893 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49149 ,  H01L2924/00 ,  H01L2924/00012

公开(公告)号：EP1427013A3

公开(公告)日：2004-07-07

申请号：EP04005427.2

申请日：2000-09-20

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： Haupt, Detlef ,  Maurer, Thomas

IPC: H01L23/367 ,  H05K1/02

CPC classification number: H01L23/367 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K3/0061 ,  H05K3/341 ,  H05K2201/0373 ,  H05K2201/0969 ,  H05K2201/10416 ,  H05K2201/10689 ,  H05K2201/10772 ,  H01L2924/00

Abstract: Das Steuergerät (20) ist mit einem elektrischen Bauelement (2) bestückt, in dem Wärme erzeugt wird. Diese wird über ein längliches Metallteil (21) abgeführt wird, dessen eine Stirnfläche (22) mit dem Bauelement (2) verlötet ist. Die dem Bauelement (2) zugewandte Stirnfläche (22) weist eine ihre Oberfläche vergrößernde Gestalt auf. Sie ist nach außen gewölbt ausgebildet und kann mit einer Riffelung versehen sein.

公开(公告)号：EP1214741A2

公开(公告)日：2002-06-19

申请号：EP00963990.7

申请日：2000-09-20

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： MAURER, Thomas ,  HAUPT, Detlef

IPC: H01L23/367

CPC classification number: H01L23/367 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K3/0061 ,  H05K3/341 ,  H05K2201/0373 ,  H05K2201/0969 ,  H05K2201/10416 ,  H05K2201/10689 ,  H05K2201/10772 ,  H01L2924/00

Abstract: The control device (1) is equipped with an electrical component (2) in which heat is generated. Said heat is dissipated over an elongated metal part (10) whose one face (12) is soldered to the component (2). The face (12) oriented toward the component (2) has a shape that increases the size of its surface. The shape is outwardly arched and can be provided with a ribbing.

公开(公告)号：EP1121005A1

公开(公告)日：2001-08-01

申请号：EP00610009.3

申请日：2000-01-25

Applicant: TELEFONAKTIEBOLAGET LM ERICSSON (publ)

Inventor： Axelsson, Christian ,  Renmark, Ulrika

IPC: H05K3/30 ,  H05K3/34

CPC classification number: H05K3/301 ,  H05K3/341 ,  H05K2201/10772 ,  Y02P70/613

Abstract: A component carrier for an electronic component, said component carrier being made in one piece of a metal sheet material and provided with means for surface mounting on a printed circuit board (PCB) and with holding flanges (2a, 2b) for holding an electronic component. The component carrier has a base (1) provided with a central soldering platform for surface mounting on the PCB. The holding flanges (2a, 2b) extend from the base (1) and are connected to the base (1) via tongues (4a-4d) of the metal sheet material, said tongues (4a-4d) extending in a plane parallel with the base (1).

Abstract translation: 一种用于电子部件的部件载体，所述部件载体制成一片金属片材料，并且具有用于表面安装在印刷电路板（PCB）上的装置和用于保持电子部件的保持凸缘（2a，2b） 。 部件载体具有设置有用于表面安装在PCB上的中心焊接平台的基座（1）。 保持凸缘（2a，2b）从基座（1）延伸，并通过金属片材的舌片（4a-4d）与基座（1）连接，所述舌片（4a-4d）在平行于 基座（1）。