Abstract:
본발명은 MIT 소자의자체발열문제를해결할수 있는금속-절연체전이(MIT) 소자의자체발열방지회로및 그방지회로용집적소자의제조방법을제공한다. 그자체발열방지회로는소정임계온도이상에서급격한금속-절연체전이(Metal-Insulator Transition: MIT)가발생하고, 전류구동소자에연결되어전류흐름을제어하는 MIT 소자; 상기 MIT 소자에연결되어상기 MIT 이후에상기 MIT 소자의자체발열을제어하는트랜지스터; 및상기 MIT 소자및 상기트랜지스터에연결된저항소자;를포함한다.
Abstract:
PURPOSE: A device and a method for encoding a 3D mesh model by analyzing connection information are provided to apply differential pulse code modulation and arithmetic encoding or determining bit encoding through analysis of a shared vertex without performing phase incision, thereby improving compression complexity of 3D model data and improving a compression rate. CONSTITUTION: A data analyzer(100) separates a vertex, an attribute and vertex connection information configuring a 3D mesh model from data of a 3D mesh model. A mesh model quantization unit(102) uses the information to generate a quantized vertex, attribute and connection information. A differential pulse code modulation unit(106) analyzes a sharing vertex of consecutive connection information of the 3D mesh model according to the quantized connection information to perform differential pulse code modulation. An entropy encoder(108) arithmetically encodes the quantized vertex, attribute information and connection information which is different-pulse-code modulated to output binary arithmetic or determining bit encoded data.
Abstract:
A circuit for preventing self-heating of MIT(Metal-Insulator-Transition) device and a method for fabricating an integrated device for the same circuit are provided to control the current drive of the current drive device by packaging the MIT device and the resistance device. An MIT device(100) generates the MIT(Metal-Insulator Transition) at the critical temperature or more, and is connected to the current-driven device and controls the current flow. A resistance unit(300) connects a MIT device and a transistor. A transistor is a bipolar transistor(200). The bipolar transistor is the NPN type or the PNP type. The MIT device, the transistor and the resistance unit are integrated to one chip and are packaged. The transistor is the bipolar transistor or the MOS transistor.
Abstract:
A memory cell based on metal-insulator transition material and a manufacturing method thereof are provided to prevent a property change of a VO2 thin film formed by a following process by using a switching device of a bottom gate mode. A silicon oxide film(115) is formed on a substrate(110). A gate electrode(120) is formed on the silicon oxide film. A gate insulation film(130) is formed on the silicon oxide film and the gate electrode. A source electrode(140) and a drain electrode(150) are formed on the gate insulation film. A MIT(Metal Insulator Transition) thin film(160) for switching is formed on the gate insulation film between the source electrode and the drain electrode. A MIT thin film(170) for resistance is formed on the drain electrode. A top electrode(180) is formed on the MIT thin film for resistance. A top insulation film(190) covers the source electrode, the drain electrode, and the MIT thin film for switching.