어레이형 광검출기를 제조하는 방법
    146.
    发明公开
    어레이형 광검출기를 제조하는 방법 审中-实审
    阵列型天线耦合检测器的制造方法

    公开(公告)号:KR1020150043064A

    公开(公告)日:2015-04-22

    申请号:KR1020130122052

    申请日:2013-10-14

    CPC classification number: H01L31/08 H01L31/02366 H01L31/18

    Abstract: 광크로스토크를줄일수 있는어레이형광검출기를제조하는방법을제시한다. 제시된방법은도핑된기판을준비하는단계, 도핑된기판의일면상에부도체층을성장시키는단계, 부도체층의상면에광검출기어레이제조층을성장시키는단계, 광검출기어레이제조층을식각하여광검출기어레이를제조하되부도체층의일부에까지식각하는단계, 도핑된기판의타면에식각마스크를형성하는단계, 및식각마스크를통해도핑된기판의타면을식각하여도핑된기판의타면에혼 안테나역할을하는어퍼쳐어레이를형성하는단계를포함한다.

    Abstract translation: 公开了一种能够减少光串扰的阵列型光检测器的制造方法。 制造阵列型光学检测器的方法包括以下步骤:制备掺杂的衬底; 在掺杂衬底的一个表面上生长非导电层; 在非导电层上生长光学检测器阵列制造层; 蚀刻光学检测器阵列制造层以制造光学检测器,蚀刻在非导电层的一部分上进行; 在掺杂衬底的另一表面上形成蚀刻掩模; 以及通过通过蚀刻掩模蚀刻掺杂衬底的另一表面,在掺杂衬底的另一表面上形成用作喇叭天线的孔径阵列。

    금속-절연체 전이(MIT) 소자의 자체발열 방지회로 및 그방지회로용 집적소자의 제조방법
    147.
    发明授权
    금속-절연체 전이(MIT) 소자의 자체발열 방지회로 및 그방지회로용 집적소자의 제조방법 有权
    用于防止金属绝缘体转变(MIT)器件的自身加热的电路以及制造用于同一电路的集成器件的方法

    公开(公告)号:KR101213471B1

    公开(公告)日:2012-12-18

    申请号:KR1020090002732

    申请日:2009-01-13

    CPC classification number: H01L27/067 H01L49/003

    Abstract: 본발명은 MIT 소자의자체발열문제를해결할수 있는금속-절연체전이(MIT) 소자의자체발열방지회로및 그방지회로용집적소자의제조방법을제공한다. 그자체발열방지회로는소정임계온도이상에서급격한금속-절연체전이(Metal-Insulator Transition: MIT)가발생하고, 전류구동소자에연결되어전류흐름을제어하는 MIT 소자; 상기 MIT 소자에연결되어상기 MIT 이후에상기 MIT 소자의자체발열을제어하는트랜지스터; 및상기 MIT 소자및 상기트랜지스터에연결된저항소자;를포함한다.

    연결정보 분석을 통한 3차원 메쉬 모델의 부호화 장치 및 방법
    148.
    发明公开
    연결정보 분석을 통한 3차원 메쉬 모델의 부호화 장치 및 방법 失效
    使用连接分析的快速3D网格编码设备及其方法

    公开(公告)号:KR1020100007685A

    公开(公告)日:2010-01-22

    申请号:KR1020080125428

    申请日:2008-12-10

    Abstract: PURPOSE: A device and a method for encoding a 3D mesh model by analyzing connection information are provided to apply differential pulse code modulation and arithmetic encoding or determining bit encoding through analysis of a shared vertex without performing phase incision, thereby improving compression complexity of 3D model data and improving a compression rate. CONSTITUTION: A data analyzer(100) separates a vertex, an attribute and vertex connection information configuring a 3D mesh model from data of a 3D mesh model. A mesh model quantization unit(102) uses the information to generate a quantized vertex, attribute and connection information. A differential pulse code modulation unit(106) analyzes a sharing vertex of consecutive connection information of the 3D mesh model according to the quantized connection information to perform differential pulse code modulation. An entropy encoder(108) arithmetically encodes the quantized vertex, attribute information and connection information which is different-pulse-code modulated to output binary arithmetic or determining bit encoded data.

    Abstract translation: 目的:提供一种通过分析连接信息对3D网格模型进行编码的装置和方法,以通过分析共享顶点来进行差分脉冲编码调制和算术编码或确定比特编码,而不进行相位切割,从而提高3D模型的压缩复杂度 数据和提高压缩率。 构成:数据分析器(100)从3D网格模型的数据中分离构成3D网格模型的顶点,属性和顶点连接信息。 网格模型量化单元(102)使用该信息来生成量化的顶点,属性和连接信息。 差分脉冲编码调制单元(106)根据量化的连接信息分析3D网格模型的连续连接信息的共享顶点,以执行差分脉冲编码调制。 熵编码器(108)对经量化的顶点,属性信息和不同脉冲编码调制的连接信息进行算术编码,以输出二进制算术或确定比特编码数据。

    금속-절연체 전이(MIT) 소자의 자체발열 방지회로 및 그방지회로용 집적소자의 제조방법
    149.
    发明公开
    금속-절연체 전이(MIT) 소자의 자체발열 방지회로 및 그방지회로용 집적소자의 제조방법 有权
    用于防止金属绝缘体转变(MIT)装置的自加热的电路和用于制造相同电路的集成装置的方法

    公开(公告)号:KR1020090091648A

    公开(公告)日:2009-08-28

    申请号:KR1020090002732

    申请日:2009-01-13

    CPC classification number: H01L27/067 H01L49/003

    Abstract: A circuit for preventing self-heating of MIT(Metal-Insulator-Transition) device and a method for fabricating an integrated device for the same circuit are provided to control the current drive of the current drive device by packaging the MIT device and the resistance device. An MIT device(100) generates the MIT(Metal-Insulator Transition) at the critical temperature or more, and is connected to the current-driven device and controls the current flow. A resistance unit(300) connects a MIT device and a transistor. A transistor is a bipolar transistor(200). The bipolar transistor is the NPN type or the PNP type. The MIT device, the transistor and the resistance unit are integrated to one chip and are packaged. The transistor is the bipolar transistor or the MOS transistor.

    Abstract translation: 提供用于防止MIT(金属绝缘体转换)装置的自身加热的电路和用于制造用于同一电路的集成装置的方法,以通过封装MIT装置和电阻装置来控制当前驱动装置的电流驱动 。 MIT设备(100)在临界温度或更高温度下生成MIT(金属绝缘体转换),并连接到电流驱动器件并控制电流。 电阻单元(300)连接MIT装置和晶体管。 晶体管是双极晶体管(200)。 双极晶体管是NPN型或PNP型。 MIT器件,晶体管和电阻单元集成到一个芯片中并进行封装。 晶体管是双极晶体管或MOS晶体管。

    금속-절연체 전이(MIT) 물질 기반의 메모리 셀 및 그메모리 셀의 제조방법
    150.
    发明公开
    금속-절연체 전이(MIT) 물질 기반의 메모리 셀 및 그메모리 셀의 제조방법 有权
    基于金属绝缘体过渡(MIT)材料的存储单元和制造相同存储单元的方法

    公开(公告)号:KR1020090059823A

    公开(公告)日:2009-06-11

    申请号:KR1020070126876

    申请日:2007-12-07

    Inventor: 김대용 김현탁

    CPC classification number: H01L27/0629 H01L45/1206

    Abstract: A memory cell based on metal-insulator transition material and a manufacturing method thereof are provided to prevent a property change of a VO2 thin film formed by a following process by using a switching device of a bottom gate mode. A silicon oxide film(115) is formed on a substrate(110). A gate electrode(120) is formed on the silicon oxide film. A gate insulation film(130) is formed on the silicon oxide film and the gate electrode. A source electrode(140) and a drain electrode(150) are formed on the gate insulation film. A MIT(Metal Insulator Transition) thin film(160) for switching is formed on the gate insulation film between the source electrode and the drain electrode. A MIT thin film(170) for resistance is formed on the drain electrode. A top electrode(180) is formed on the MIT thin film for resistance. A top insulation film(190) covers the source electrode, the drain electrode, and the MIT thin film for switching.

    Abstract translation: 提供了基于金属 - 绝缘体转变材料的存储单元及其制造方法,以通过使用底栅模式的开关装置来防止由后续处理形成的VO2薄膜的性质变化。 在基板(110)上形成氧化硅膜(115)。 在氧化硅膜上形成栅电极(120)。 在氧化硅膜和栅电极上形成栅绝缘膜(130)。 在栅极绝缘膜上形成源极(140)和漏极(150)。 用于切换的MIT(金属绝缘体转移)薄膜(160)形成在源电极和漏电极之间的栅极绝缘膜上。 在漏极上形成用于电阻的MIT薄膜(170)。 顶部电极(180)形成在MIT薄膜上用于电阻。 顶部绝缘膜(190)覆盖源极电极,漏极电极和用于切换的MIT薄膜。

Patent Agency Ranking