公开(公告)号：US07303997B1

公开(公告)日：2007-12-04

申请号：US11544591

申请日：2006-10-10

Applicant: Philips Laou ,  Merel Philippe

Inventor： Philips Laou ,  Merel Philippe

IPC: H01L21/302

CPC classification number: B81C1/00142 ,  B81B2201/0207 ,  B81B2201/0278 ,  B81B2203/0109 ,  G01J5/02 ,  G01J5/024 ,  G01J5/04 ,  G01J5/046 ,  G01J5/20

Abstract: Microbolometers with regionally thinned microbridges are produced by depositing a thin film (0.6 μm) of silicon nitride on a silicon substrate, forming microbridges on the substrate, etching the thin film to define windows in a pixel area, thinning the windows, releasing the silicon nitride, depositing a conductive YBaCuO film on the bridges, depositing a conductive film (Au) on the YBaCuO film, and removing selected areas of the YBaCuO and conductive films.

Abstract translation: 通过在硅衬底上沉积氮化硅薄膜（0.6μm），在衬底上形成微桥，蚀刻薄膜以限定像素区中的窗口，使窗户变薄，释放氮化硅，从而产生具有区域薄化微桥的微伏热计 在桥上沉积导电YBaCuO膜，在YBaCuO膜上沉积导电膜（Au），并去除YBaCuO和导电膜的选定区域。

公开(公告)号：US06835932B2

公开(公告)日：2004-12-28

申请号：US10129338

申请日：2002-05-03

Applicant: Tohru Ishizuya ,  Junji Suzuki

Inventor： Tohru Ishizuya ,  Junji Suzuki

IPC: G01J500

CPC classification number: B81B3/0081 ,  B81B2201/0278 ,  B81B2201/042 ,  B81B2203/0109 ,  G01J5/40 ,  H01L27/14812 ,  H01L27/14818 ,  H01L27/14875

Abstract: A thermal displacement element comprises a substrate, and a supported member supported on the substrate. The supported member includes first and second displacement portions, a heat separating portion exhibiting a high thermal resistance and a radiation absorbing portion receiving the radiation and converting it into heat. Each of the first and second displacement portions has at least two layers of different materials having different expansion coefficients and stacked on each other. The first displacement portion is mechanically continuous to the substrate without through the heat separating portion. The radiation absorbing portion and the second displacement portion are mechanically continuous to the substrate through the heat separating portion and the first displacement portion. The second displacement portion is thermally connected to the radiation absorbing portion. A radiation detecting device comprises a thermal displacement element and a displacement reading member fixed to the second displacement portion of the thermal displacement element and used for obtaining a predetermined change corresponding to a displacement in the second displacement portion.

公开(公告)号：US20040195096A1

公开(公告)日：2004-10-07

申请号：US10485940

申请日：2004-01-30

Inventor： Christos Tsamis ,  Angeliki Tserepi ,  Androula G Nassiopoulou

IPC: G01N027/26

CPC classification number: H05B3/265 ,  B81B2201/0278 ,  B81B2203/0109 ,  B81B2203/0118 ,  B81C1/00682 ,  B81C1/0069 ,  B81C2201/0115 ,  G01F1/6845 ,  G01N27/12 ,  G01N27/16 ,  G01N27/18

Abstract: This invention provides a front side silicon micromachining process for the fabrication of suspended Porous Silicon membranes in the form of bridges or cantilevers and of thermal sensor devices employing these membranes. The fabrication of the suspended Porous Silicon membranes comprises the following steps: (a) formation of a Porous Silicon layer (2) in, at least one, predefined area of a Silicon substrate (1), (b) definition of etch windows (5) around or inside said Porous Silicon layer (2) using standard photolithography and (c) selective etching of the silicon substrate (1), underneath the Porous Silicon layer (2), by using dry etching techniques to provide release of the Porous Silicon membrane and to form a cavity (6) under the said Porous Silicon layer. Furthermore, the present invention provides a method for the fabrication of thermal sensors based on Porous Silicon membranes with minimal thermal losses, since the proposed methodology combines the advantages that result from the low thermal conductivity of Porous Silicon and the use of suspended membranes. Moreover, the front-side micromachining process proposed in the present invention simplifies the fabrication process. Various types of thermal sensor devices, such as calorimetric-type gas sensors, conductometric type gas sensors and thermal conductivity sensors are described utilizing the proposed methodology.

Abstract translation: 本发明提供了前桥硅微加工工艺，用于制造桥梁或悬臂形式的悬浮多孔硅膜以及采用这些膜的热传感器装置。 悬浮的多孔硅膜的制造包括以下步骤：（a）在硅衬底（1）的至少一个预定区域中形成多孔硅层（2），（b）蚀刻窗口（5） ）使用标准光刻法和（c）在多孔硅层（2）下方的硅衬底（1）的选择性蚀刻，通过使用干蚀刻技术提供多孔硅膜（2）的多孔硅膜 并在所述多孔硅层下方形成空腔（6）。 此外，本发明提供了一种用于制造基于具有最小热损失的多孔硅膜的热传感器的方法，因为所提出的方法结合了多孔硅的低热导率和悬浮膜的使用所产生的优点。 此外，本发明中提出的前侧微加工工艺简化了制造工艺。 使用所提出的方法来描述各种类型的热传感器装置，例如量热式气体传感器，电导型气体传感器和导热传感器。

公开(公告)号：US5682053A

公开(公告)日：1997-10-28

申请号：US588290

申请日：1996-01-18

Applicant: Witold Wiszniewski

Inventor： Witold Wiszniewski

IPC: B81B3/00 ,  B81C1/00 ,  G01K7/02 ,  H01L21/762 ,  H01L21/764 ,  H01L23/482 ,  H01L31/0352 ,  H01L31/103 ,  H01L35/34 ,  H01L29/82

CPC classification number: H01L35/34 ,  B81C1/0019 ,  G01K7/028 ,  H01L21/76264 ,  H01L21/764 ,  H01L23/4822 ,  H01L24/01 ,  H01L31/035281 ,  H01L31/103 ,  B81B2201/0278 ,  B81B2203/0109 ,  B81B2203/0118 ,  H01L21/76289 ,  H01L2924/12036 ,  H01L2924/1305 ,  H01L2924/13091 ,  Y02E10/50 ,  Y10S257/93 ,  Y10S73/01

Abstract: A simox wafer includes substrate (1), simox silicon dioxide layer (2) and monocrystalline simox silicon layer (3). An additional silicon nitride layer (5) is deposited on top of silicon layer (3) to allow the fabrication of a monocrystalline beam (4) by selectively etching the dioxide layer (2). The thermal insulating property of the resultant beam (4) offers an ideal site for construction of thermocouples (29), light modulators (60) and active components such as p-n diodes (34), MOS transistors (47) and bipolar transistors.

Abstract translation: simox晶片包括基底（1），simox二氧化硅层（2）和单晶硅氧化硅层（3）。 在硅层（3）的顶部上沉积另外的氮化硅层（5），以通过选择性地蚀刻二氧化物层（2）来制造单晶束（4）。 所得光束（4）的绝热性能提供了构造热电偶（29），光调制器（60）和诸如p-n二极管（34），MOS晶体管（47）和双极晶体管的有源部件的理想位置。

公开(公告)号：US20240301395A1

公开(公告)日：2024-09-12

申请号：US18653435

申请日：2024-05-02

Applicant: Purigen Biosystems, Inc.

Inventor： Lewis A. Marshall ,  Amy L. Hiddessen ,  Nathan P. Hoverter ,  Klint A. Rose ,  Juan G. Santiago

IPC: C12N15/10 ,  B01L3/00 ,  B81B1/00 ,  B81B7/00 ,  C12Q1/6806 ,  G01N27/447

CPC classification number: C12N15/101 ,  B01L3/502753 ,  C12N15/10 ,  C12Q1/6806 ,  G01N27/4473 ,  G01N27/44739 ,  G01N27/44791 ,  G01N27/44795 ,  B01L3/502738 ,  B01L2300/0627 ,  B01L2300/0867 ,  B81B1/004 ,  B81B7/0087 ,  B81B2201/0278 ,  B81B2201/05 ,  B81B2203/0338 ,  G01N27/44704

Abstract: The present disclosure relates to fluidic systems and devices for processing, extracting, or purifying one or more analytes. These systems and devices can be used for processing samples and extracting nucleic acids, for example by isotachophoresis. In particular, the systems and related methods can allow for extraction of nucleic acids, including non-crosslinked nucleic acids, from samples such as tissue or cells. The systems and devices can also be used for multiplex parallel sample processing.

公开(公告)号：US12054386B2

公开(公告)日：2024-08-06

申请号：US17175410

申请日：2021-02-12

Applicant: STMicroelectronics S.r.l.

Inventor： Enrico Rosario Alessi ,  Fabio Passaniti

IPC: B81B7/00 ,  B81B7/02 ,  G06N3/08

CPC classification number: B81B7/007 ,  B81B7/02 ,  G06N3/08 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/0278 ,  B81B2201/0292

Abstract: An analysis method of a device through a MEMS sensor is provided in which the MEMS sensor includes a control unit and a sensing assembly coupled to the device. The analysis method includes acquiring, through the sensing assembly, first data indicative of an operative state of the device. Testing is performed for the presence of a first abnormal operating condition of the device. If the first abnormal operating condition of the device is confirmed, a self-test of the sensing assembly is performed to generate a quantity indicative of an operative state of the sensing assembly. The self-test includes acquiring, through the sensing assembly, second data indicative of the operative state of the sensing assembly, generating a signature according to the second data, and processing the signature through deep learning techniques to generate said quantity.

公开(公告)号：US12006496B2

公开(公告)日：2024-06-11

申请号：US18141641

申请日：2023-05-01

Applicant: Purigen Biosystems, Inc.

Inventor： Lewis A. Marshall ,  Amy L. Hiddessen ,  Nathan P. Hoverter ,  Klint A. Rose ,  Juan G. Santiago

IPC: G01N27/453 ,  B01L3/00 ,  C12N15/10 ,  C12Q1/6806 ,  G01N27/447 ,  B81B1/00 ,  B81B7/00

CPC classification number: C12N15/101 ,  B01L3/502753 ,  C12N15/10 ,  C12Q1/6806 ,  G01N27/4473 ,  G01N27/44739 ,  G01N27/44791 ,  G01N27/44795 ,  B01L3/502738 ,  B01L2300/0627 ,  B01L2300/0867 ,  B81B1/004 ,  B81B7/0087 ,  B81B2201/0278 ,  B81B2201/05 ,  B81B2203/0338 ,  G01N27/44704 ,  C12N15/101 ,  C12Q2565/125

Abstract: The present disclosure relates to fluidic systems and devices for processing, extracting, or purifying one or more analytes. These systems and devices can be used for processing samples and extracting nucleic acids, for example by isotachophoresis. In particular, the systems and related methods can allow for extraction of nucleic acids, including non-crosslinked nucleic acids, from samples such as tissue or cells. The systems and devices can also be used for multiplex parallel sample processing.

公开(公告)号：US11999612B2

公开(公告)日：2024-06-04

申请号：US17525950

申请日：2021-11-14

Applicant: Naiqian Han

Inventor： Naiqian Han

IPC: B81B3/00 ,  G01J3/02 ,  G01J3/10 ,  G01J3/45 ,  G02B27/30

CPC classification number: B81B3/0021 ,  B81B3/0024 ,  G01J3/021 ,  G01J3/0218 ,  G01J3/10 ,  G01J3/45 ,  B81B2201/0264 ,  B81B2201/0271 ,  B81B2201/0278 ,  B81B2201/047 ,  G02B27/30

Abstract: Provided is an optical micro-electro-mechanical system (MEMS) based monitoring system, comprising: a broadband light source, a tunable optical filter (TOF), an optical etalon, a plurality of optical receivers, a plurality of optical couplers, and a plurality of optical MEM sensors; the TOF is configured to capture a transmission, reflection or interference spectrum of the optical MEMS sensors; wherein the peak or depression wavelength in the transmission, reflection or interference spectrum corresponds to a parameter of the pressure, temperature or stress, and the peak or depression wavelength can be obtained by comparing the spectrum with the periodic spectrum of the optical etalon, the optical etalon has an absolute wavelength mark; and the optical MEMS sensor comprises an optical MEMS resonator. The parameter of the pressure, temperature or stress can be obtained by the peak or depression wavelength in the transmission, the reflection or the interference spectrum of the optical MEMS sensor.

公开(公告)号：US11897763B2

公开(公告)日：2024-02-13

申请号：US17103796

申请日：2020-11-24

Applicant: STMICROELECTRONICS, INC.

Inventor： Jefferson Sismundo Talledo

IPC: B81C1/00 ,  B81B7/00

CPC classification number: B81C1/00309 ,  B81B7/0061 ,  B81B2201/0264 ,  B81B2201/0278 ,  B81B2207/012 ,  B81B2207/07 ,  B81C2201/0108 ,  B81C2201/0143 ,  B81C2201/0146

Abstract: A semiconductor package that contains an application-specific integrated circuit (ASIC) die and a micro-electromechanical system (MEMS) die. The MEMS die and the ASIC die are coupled to a substrate that includes an opening that extends through the substrate and is in fluid communication with an air cavity positioned between and separating the MEMS die from the substrate. The opening exposes the air cavity to an external environment and, following this, the air cavity exposes a MEMS element of the MEMS die to the external environment. The air cavity separating the MEMS die from the substrate is formed with a method of manufacturing that utilizes a thermally decomposable die attach material.

公开(公告)号：US20230251238A1

公开(公告)日：2023-08-10

申请号：US18170849

申请日：2023-02-17

Applicant: Brown University

Inventor： Jacob K. Rosenstein ,  Christopher Rose

IPC: G01N33/00 ,  B81B3/00

CPC classification number: G01N33/0075 ,  B81B3/0018 ,  B81B2201/0278 ,  B81B2201/0264

Abstract: A system includes an array of chemical, pressure, and temperature sensors, and a temporal airflow modulator configured to provide sniffed vapors in a temporally-modulated sequence through a plurality of different air paths across multiple sensor locations.