公开(公告)号：JP3586793B2

公开(公告)日：2004-11-10

申请号：JP14829292

申请日：1992-05-14

Applicant: ワールド プロパティーズ インク.

Inventor： アレン・エフ・ホーン・ザ・サード ,  ゴー・エス・スウエイ ,  デイビツド・ジエイ・アーサー

IPC: B32B15/08 ,  C08K9/06 ,  C09C3/12 ,  C09D127/12 ,  H01B3/00 ,  H01B3/44 ,  H01L23/14 ,  H05K1/03 ,  H05K1/05 ,  H05K3/38 ,  H05K3/46 ,  C04B41/83 ,  C08K9/04 ,  C09C3/00

CPC classification number: H05K3/4626 ,  C08K9/06 ,  H01B3/445 ,  H01L23/145 ,  H01L2924/0002 ,  H05K1/034 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/05 ,  H05K1/056 ,  H05K3/389 ,  H05K3/4611 ,  H05K2201/015 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0251 ,  H05K2201/068 ,  Y10T428/24372 ,  Y10T428/24917 ,  Y10T428/252 ,  Y10T428/254 ,  Y10T428/3154 ,  Y10T428/31544 ,  C08L27/12 ,  H01L2924/00

公开(公告)号：EP1500743A4

公开(公告)日：2007-08-22

申请号：EP03719225

申请日：2003-04-25

Applicant: TEIJIN TECHNO PRODUCTS LTD

Inventor： FUJIMORI TATSUSHI ,  MURAYAMA SADAMITSU

IPC: B29C70/10 ,  B29C70/12 ,  B29C70/20 ,  B32B15/14 ,  D21H13/24 ,  D21H13/26 ,  D21H21/18 ,  H05K1/03 ,  B29C70/88 ,  H05K3/46

CPC classification number: B32B15/14 ,  B29C70/10 ,  B29C70/12 ,  B29C70/202 ,  B32B15/20 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2305/076 ,  B32B2307/306 ,  B32B2457/08 ,  D21H13/24 ,  D21H13/26 ,  D21H21/18 ,  H05K1/0366 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2203/0594 ,  Y10T428/24116 ,  Y10T428/24124 ,  Y10T428/2419 ,  Y10T428/24264 ,  Y10T428/24994 ,  Y10T428/25 ,  Y10T428/254 ,  Y10T428/26 ,  Y10T442/2008 ,  Y10T442/696

Abstract: A heat-resistant synthetic fiber sheet which comprises 40 to 97 mass % of heat-resistant organic synthetic polymer short fibers and 3 to 60 mass % of a heat-resistant organic synthetic polymer fibrid and/or an organic resin binder for binding them, wherein at least a part of the short fibers has both end surfaces having an angle of inclination of 10 degree or more to the plane intersecting orthogonally to the fiber axis thereof. The heat-resistant synthetic fiber sheet is useful as a substrate for a laminate for an electric circuit board.

公开(公告)号：EP1658327A1

公开(公告)日：2006-05-24

申请号：EP04763812.7

申请日：2004-08-05

Applicant: LANXESS Deutschland GmbH

Inventor： VAN MULLEKOM, Robert, Hubertus ,  JOACHIMI, Detlev ,  KARBACH, Alexander ,  PERSIGEHL, Peter ,  DE BOCK, Maarten

IPC: C08K9/08 ,  C03C25/36

CPC classification number: C08K7/14 ,  C03C25/36 ,  C08K9/08 ,  H05K1/0373 ,  H05K2201/0239 ,  H05K2201/0251 ,  H05K2201/09118

Abstract: The invention relates to moulding materials consisting of thermoplastic polymers, sized glass fibres and additional conventional additives and auxiliary agents, in addition to the use of said materials.

公开(公告)号：EP1650253A1

公开(公告)日：2006-04-26

申请号：EP04770966.2

申请日：2004-07-28

Applicant: Kyoto University ,  ROHM CO., LTD. ,  MITSUBISHI CHEMICAL CORPORATION ,  Hitachi, Ltd. ,  Pioneer Corporation ,  NIPPON TELEGRAPH AND TELEPHONE CORPORATION

Inventor： YANO, Hiroyuki Res. Inst. Sustainable Humanosphere ,  SUGIYAMA, Junji. Res.Inst.Sustainable Humanosphere ,  NOGI, Masaya Int. Innovation Center Kyoto Univ. ,  IWAMOTO, S. Res. Inst. Sustainable Humanosphere ,  HANDA, Keishin., Mitsubishi Chem. Group STRC, Inc. ,  NAGAI, Akira, Hitachi Ltd. ,  MIWA, Takao;, Hitachi Ltd. ,  TAKEZAWA, Yoshitaka, Hitachi Ltd. ,  MIYADERA, Toshiyuki, Pioneer Corporation ,  KURIHARA, Takashi., NTT Intellectual Prop. Center ,  MATSUURA, Tohru., NTT Intellectual Property Center ,  KOSHOUBU, Nobutatsu., NTT Intell. Prop. Center ,  MARUNO, Tohru, NTT Intellectual Property Center

IPC: C08J5/24 ,  H05K1/03 ,  G02B6/10 ,  B32B5/28 ,  B32B27/12 ,  C08L1/00 ,  C08L101/00

CPC classification number: G02B6/122 ,  B82Y30/00 ,  C08J5/005 ,  C08J5/04 ,  C08L101/00 ,  G02B6/10 ,  G02B6/4214 ,  G02B2006/12104 ,  G02B2006/12107 ,  H05K1/0366 ,  H05K2201/0108 ,  H05K2201/0251 ,  Y10T428/249924 ,  Y10T428/249928 ,  Y10T428/24994 ,  Y10T428/2965 ,  Y10T428/31518 ,  Y10T428/31525 ,  C08L2666/26

Abstract: There is provided a fiber-reinforced composite material containing fibers having an average fiber diameter of 4 to 200 nm and a matrix material, the composite material having a visible light transmittance of 60% or more at a wavelength of 400 to 700 nm, which is a conversion value based on a thickness of 50 µm. A fiber-reinforced composite material composed of a matrix material and a fiber aggregate impregnated therewith is provided, in which when a segment length of a bright region corresponding to a pore region of the fiber aggregate is represented by L, which is obtained by statistical analysis of a unidirectional run-length image formed from a binary image obtained by binarization of a scanning electron microscopic image of the fiber aggregate, the total length of segments that satisfy L ≥ 4.5 µm is 30% or less of the total analyzed length. A transparent multilayered sheet, a circuit board, and an optical waveguide are provided which use a transparent substrate formed from this fiber-reinforced composite material.

Abstract translation: 本发明提供一种含有平均纤维直径为4〜200nm的纤维和基体材料的纤维增强复合材料，该复合材料在400〜700nm的波长下具有60％以上的可见光透射率， 基于50μm厚度的转换值。 提供一种纤维增强复合材料，该纤维增强复合材料由基体材料和浸渍有纤维集合体的纤维集合体构成，其中，将与纤维集合体的细孔区域对应的亮部区域的区间长度设为L，通过统计分析 由纤维集合体的扫描型电子显微镜图像的二值化而得到的二值图像形成的单方向游程图像中，满足L≥4.5μm的片段的总长度为总分析长度的30％以下。 提供使用由该纤维增强复合材料形成的透明基板的透明多层片，电路基板以及光波导。

公开(公告)号：EP1500743A1

公开(公告)日：2005-01-26

申请号：EP03719225.9

申请日：2003-04-25

Applicant: Teijin Techno Products Limited

Inventor： FUJIMORI, Tatsushi C/O Teijin Techno Products ,  MURAYAMA, Sadamitsu C/O Teijin Techno Products

IPC: D21H13/26 ,  D21H13/24 ,  B29C70/88 ,  H05K3/46

CPC classification number: B32B15/14 ,  B29C70/10 ,  B29C70/12 ,  B29C70/202 ,  B32B15/20 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2305/076 ,  B32B2307/306 ,  B32B2457/08 ,  D21H13/24 ,  D21H13/26 ,  D21H21/18 ,  H05K1/0366 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2203/0594 ,  Y10T428/24116 ,  Y10T428/24124 ,  Y10T428/2419 ,  Y10T428/24264 ,  Y10T428/24994 ,  Y10T428/25 ,  Y10T428/254 ,  Y10T428/26 ,  Y10T442/2008 ,  Y10T442/696

Abstract: A heat-resistant fiber paper-like sheet comprises 40 to 97% by mass of heat-resistant organic synthetic polymers staple fibers, 3 to 60% by mass of heat resistant organic synthetic polymer fibrid and or an organic resin binder, in a portion of the staple fibers, each staple fiber having two flat end faces having an inclining angle of 10 degrees or more from a plane crossing the fiber axis at a right angles, and is useful as a base material for laminate materials for electrical circuit boards.

Abstract translation: 一种耐热纤维纸状片材包含40至97质量％的耐热有机合成聚合物短纤维，3至60质量％的耐热有机合成聚合物纤维原纤维或有机树脂粘合剂，部分 短纤维，每个短纤维具有从垂直于纤维轴的平面倾斜角度为10度以上的两个平坦端面，并且可用作电路板层压材料的基材。

公开(公告)号：EP1310593A1

公开(公告)日：2003-05-14

申请号：EP00950005.9

申请日：2000-08-04

Applicant: TEIJIN LIMITED

Inventor： MURAYAMA, Sadamitsu, Teijin Ltd, Osaka Res. Ctr. ,  MATSUI, Michikage, Teijin Ltd, Osaka Research Ctr. ,  WADA, Masanori, Teijin Ltd, Osaka Research Center ,  ISHIHARA, Shigeru, Teijin Ltd, Matsuyama Factory

IPC: D21H13/26 ,  D04H1/42 ,  H05K1/03

CPC classification number: D04H1/4334 ,  D04H1/4342 ,  D04H1/549 ,  D04H1/64 ,  D21H13/24 ,  D21H13/26 ,  H05K1/0366 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10T428/249921 ,  Y10T428/249924 ,  Y10T428/2904 ,  Y10T428/2969 ,  Y10T442/609 ,  Y10T442/61 ,  Y10T442/611 ,  Y10T442/69

Abstract: A heat-resistant fiber paper sheet which is formed from staple fibers made from a heat-resistant organic polymer, undrawn or low ratio drawn para-aromatic polyamide staple fibers, and an organic resin binder and/or fibrids comprising a heat-resistant organic polymer as main components, wherein the amount of said staple fibers is 45 to 97 percent by weight based on the total amount of said heat-resistant fiber paper sheet; the total amount of said organic resin binder and/or said fibrids is 3 to 55 percent by weight based on the total amount of said heat-resistant fiber paper sheet; and said organic resin binder is cured, and/or said undrawn or low ratio drawn para-aromatic polyamide staple fibers and said fibrids are partially sòftened, deformed and/or melted to exhibit the actions of binders. The obtained heat-resistant fiber paper sheet has excellent heat resistance, excellent heat dimensional stability, excellent plybond strength, an excellent electric insulating property in a high humidity, and the like, has good resin impregnability in spite of having a high bulk density, and is especially suitable for use as a substrate for electric insulating materials or as a substrate for laminates used for electric circuits.

Abstract translation: 由耐热有机聚合物，未拉伸或低比例拉伸的对位芳族聚酰胺短纤维制成的短纤维形成的耐热纤维纸片和包含耐热有机聚合物的有机树脂粘合剂和/或纤条体 作为主要成分，其中所述短纤维的量相对于所述耐热性纤维纸的总量为45〜97重量％ 所述有机树脂粘合剂和/或所述纤条体的总量相对于所述耐热纤维纸的总量为3〜55重量％ 并且所述有机树脂粘合剂固化，和/或所述未拉伸或低比例拉伸的对位芳族聚酰胺短纤维和所述纤条体部分地发生变形和/或熔融以显示粘合剂的作用。 得到的耐热纤维纸片具有优异的耐热性，优异的热尺寸稳定性，优异的聚苯乙烯强度，高湿度下的优异的电绝缘性等，尽管具有高的堆积密度，但具有良好的树脂浸渍性，以及 特别适合用作电绝缘材料的基材或用作电路用层压体的基材。

公开(公告)号：EP0763562B1

公开(公告)日：2000-11-22

申请号：EP96306669.1

申请日：1996-09-13

Applicant: Hitachi Chemical Co., Ltd.

Inventor： Okano, Norio ,  Kobayashi, Kazuhito ,  Nakaso, Akishi

IPC: C08K7/02 ,  C08J5/04 ,  C08J5/24 ,  H05K1/03

CPC classification number: C08K7/02 ,  C08J5/24 ,  H05K1/0373 ,  H05K2201/0145 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0248 ,  H05K2201/0251 ,  H05K2201/0278 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24994 ,  Y10T428/249995 ,  Y10T428/26 ,  Y10T428/268 ,  Y10T428/269 ,  Y10T428/2949 ,  Y10T428/31529

公开(公告)号：EP0604838A1

公开(公告)日：1994-07-06

申请号：EP93120249.3

申请日：1993-12-16

Applicant: HOECHST CELANESE CORPORATION

Inventor： Jester, Randy D.

IPC: C08L67/00 ,  C08L67/04 ,  B32B15/08 ,  C09K19/38

CPC classification number: B32B15/08 ,  B29C55/00 ,  B29D7/01 ,  B29K2105/0079 ,  B29K2105/0088 ,  B29K2105/26 ,  B32B15/09 ,  B32B15/20 ,  B32B2307/52 ,  C08J5/18 ,  C08J11/06 ,  C08J2367/00 ,  C08L67/00 ,  C08L67/04 ,  C09K19/3809 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0212 ,  H05K2201/0245 ,  H05K2201/0251 ,  H05K2201/0278 ,  Y02W30/701 ,  Y10S428/91 ,  Y10T428/1095 ,  Y10T428/24942 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31786 ,  C08L2666/18

Abstract: A melt consolidated, multiaxially oriented liquid crystal polymer ("LCP") sheet or other article formed from LCP particles. One embodiment includes a multi-component LCP sheet in which particles of a higher melting LCP are imbedded in a matrix of a lower melting LCP. These LCP components are formed into sheet at a temperature between the melting point of the lower melting matrix LCP and the higher melting reinforcing LCP, so that the imbedded LCP particles may maintain their shape, orientation, and mechanical characteristics while the matrix LCP component flows around the particles and forms a solid sheet. In another embodiment, LCP particles are melt consolidated to form a single article in which a significant amount of LCP orientation is retained. A sheet of this invention may be formed by a variety of processes, and may be made from recycled scrap LCP.

Abstract translation: 熔融固化的多轴取向液晶聚合物（“LCP”）片或由LCP颗粒形成的其它制品。 一个实施方案包括多组分LCP片，其中较高熔点LCP的粒子嵌入较低熔点LCP的基质中。 这些LCP组分在低熔点基质LCP的熔点和较高熔点的增强LCP之间的温度下形成片材，使得嵌入的LCP颗粒可以在基质LCP组分流动时保持其形状，取向和机械特性 颗粒并形成固体片。 在另一个实施方案中，LCP颗粒被熔融固化以形成其中保留显着量的LCP取向的单一制品。 本发明的片材可以通过各种方法形成，并且可以由再循环废料LCP制成。

公开(公告)号：EP0416461A3

公开(公告)日：1993-01-27

申请号：EP90116625.6

申请日：1990-08-30

Applicant: IDEMITSU KOSAN CO., LTD.

Inventor： Nakano, Akikazu

IPC: H05K1/03

CPC classification number: H05K1/0373 ,  H05K1/032 ,  H05K2201/012 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0251 ,  H05K2201/09118 ,  H05K2203/122

Abstract: A material for molding printed circuit board, which is prepared by compounding 100 parts by weight of polymer composition consisting of 100 to 20 wt% of styrene polymers having a high degree of syndiotactic configuration (a) and 0 to 80 wt% of fibrous fillers (b) with 0 to 40 parts by weight of flame retardant (c) and 0 to 15 parts by weight of auxiliary flame retardant (d) with, and a printed circuit board which is prepared by forming metallic foil on the molded product consisting of said materials are disclosed.

公开(公告)号：EP0395250A3

公开(公告)日：1991-11-21

申请号：EP90303792.7

申请日：1990-04-09

Applicant: SOMAR CORPORATION

Inventor： Ogitani, Osamu, 807, Mitsui-Sengendai Height ,  Shirose, Toru ,  Fujii, Ryuichi

IPC: C08K3/34 ,  C08L63/02 ,  C08G59/50 ,  C08G59/06

CPC classification number: H05K1/0373 ,  C08G59/245 ,  C08G59/5033 ,  C08K3/346 ,  C08K3/36 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0245 ,  H05K2201/0251

Abstract: A thermosetting resin composition suitable for forming an insulating layer to be interposed between two adjacent wiring patterns of a multilayer printed wiring board is disclosed which includes a bisphenol AD epoxy resin, an aromatic polyamine, mica having an average particle size of 50 µm or less, and silica having an average particle size of 20 µm or less, the average particle size of the silica being smaller than that of the mica, and the amount of the silica being 20-80 % based on the total weight of the silica and the mica.