公开(公告)号：EP0612577B1

公开(公告)日：1997-05-02

申请号：EP94300936.5

申请日：1994-02-09

Applicant: AT&T Corp.

Inventor： Jin, Sungho ,  McCormack, Mark Thomas

IPC: B23K35/14 ,  B23K35/26 ,  B23K1/00

CPC classification number: B23K35/26 ,  B23K1/00 ,  B23K35/0222 ,  B23K35/0244 ,  B23K35/262 ,  B23K35/264 ,  B23K35/268 ,  H01L24/12 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H05K3/3484 ,  H05K2201/0215 ,  H05K2201/083 ,  H05K2201/10719 ,  H05K2203/104 ,  Y10T428/12007 ,  Y10T428/12486

公开(公告)号：EP0685879A1

公开(公告)日：1995-12-06

申请号：EP95303495.6

申请日：1995-05-24

Applicant: AT&T Corp.

Inventor： Jin, Sungho ,  McCormack, Mark Thomas

IPC: H01L21/48 ,  H01L21/60

CPC classification number: H01L24/81 ,  H01L21/4853 ,  H01L21/6835 ,  H01L24/11 ,  H01L2224/05147 ,  H01L2224/05611 ,  H01L2224/05644 ,  H01L2224/11003 ,  H01L2224/1111 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/0106 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01105 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15787 ,  H05K3/3478 ,  H05K3/3484 ,  H05K2201/0133 ,  H05K2201/0218 ,  H05K2201/083 ,  H05K2203/0156 ,  H05K2203/0338 ,  H05K2203/0425 ,  H05K2203/0528 ,  H05K2203/104 ,  Y10T156/1089 ,  Y10T156/1093 ,  H01L2924/00 ,  H01L2924/00014

Abstract: In accordance with the invention, an electronic device (9) having one or more contact pads (12) is placed in contact with a carrier sheet (21) bearing an array of transferable solder particles. Heat is applied to adhere the solder to the contact pads, and solder is selectively transferred onto the contact pads. In a preferred embodiment the solder-carrying medium comprises elastomeric material and the solder particles comprise solder-coated magnetic particles. Application of a magnetic field while the elastomer is curing produces a regular array of solder coated particles. Using this method, devices having smaller than conventional contact structures can be readily interconnected.

Abstract translation: 在雅舞蹈通过本发明，给电子设备（9），其具有一个或多个接触垫（12）在与支承在转让焊料颗粒的阵列的载体片（21）接触放置。 热量被施加到焊料粘附到接触焊盘和焊料选择性地转移到接触焊盘。 在优选实施例的焊料承载介质包括弹性体材料和所述焊料粒子包括焊料涂覆的磁性粒子。 的磁场，而弹性体固化的应用程序生成的焊料涂覆的颗粒的规则阵列。 使用这种方法，具有比常规的接触结构更小的设备可以很容易地相互连接。

公开(公告)号：EP0371645A1

公开(公告)日：1990-06-06

申请号：EP89311662.4

申请日：1989-11-10

Applicant: THE WHITAKER CORPORATION

Inventor： Henschen, Homer Ernst ,  Pawlikowski, Joseph Michael ,  McKee, Michael John

IPC: B23K3/04 ,  H05B3/12 ,  H01R43/02

CPC classification number: H01R43/0242 ,  B23K3/0475 ,  H01L2224/81234 ,  H01L2224/83234 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01R4/02 ,  H05B3/12 ,  H05K1/0212 ,  H05K1/0242 ,  H05K1/167 ,  H05K3/3421 ,  H05K3/3494 ,  H05K3/363 ,  H05K3/4015 ,  H05K3/4611 ,  H05K2201/083 ,  H05K2201/1034 ,  H05K2201/10924 ,  H05K2203/1115

Abstract: A heater (20) is secured to or embedded in a circuit board (10) and is selectively energizable by current to melt solder in a connection or disconnection operation. The heater (20) is spaced from circuit board contact pads (13) by circuit board structure material that transmits the generated thermal energy to the contact pads (13) to melt solder or other fusible material. The heater is preferably a self-regulating heater in the form of a copper substrate (12) having a thin surface layer (20) of magnetically permeable, high resistance material. An alternating current of constant amplitude and high frequency is passed through the heater and concentrated in the surface layer (20) at temperatures below the surface layer Curie temperature. At higher temperatures the current is distributed through the lower resistance substrate (12) to limit further heating. A current return path or bus (21) is disposed in closely-spaced parallel relation to the surface layer (20) and establishes an electric field between the substrate (12) and the return bus (21) to bias current in the substrate toward the surface layer (20). The return bus (21) may be embedded in the circuit board (10) or provided as part of external tooling employed to deliver energizing current.

Abstract translation: 加热器（20）固定到电路板（10）中或嵌入电路板（10）中，并且可以通过电流选择性地激励以在连接或断开操作中熔化焊料。 加热器（20）通过电路板结构材料与电路板接触焊盘（13）间隔开，所述电路板结构材料将产生的热能传递到接触焊盘（13）以熔化焊料或其它易熔材料。 加热器优选为具有透磁性高电阻材料的薄表面层（20）的铜基底（12）形式的自调节加热器。 恒定幅度和高频率的交流电流通过加热器并在低于表层居里温度的温度下集中在表面层（20）中。 在较高的温度下，电流分布通过下电阻衬底（12）以限制进一步的加热。 电流返回路径或总线（21）以与表面层（20）成间隔的平行关系设置，并且在衬底（12）和返回总线（21）之间建立电场，以将基板中的电流偏置到 表面层（20）。 返回总线（21）可以嵌入在电路板（10）中，或者作为用于传递激励电流的外部工具的一部分提供。

公开(公告)号：EP0174777B1

公开(公告)日：1990-03-14

申请号：EP85306123.2

申请日：1985-08-29

Applicant: MINNESOTA MINING AND MANUFACTURING COMPANY

Inventor： Hartman, Richard B. c/o Minnesota Mining and

IPC: H01B1/22 ,  H01R4/04

CPC classification number: H01R4/04 ,  H01B1/22 ,  H05K3/323 ,  H05K2201/083 ,  H05K2203/104 ,  Y10S428/90 ,  Y10S428/906 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/257 ,  Y10T428/2857

公开(公告)号：EP0206620A2

公开(公告)日：1986-12-30

申请号：EP86304394

申请日：1986-06-09

Applicant: METCAL INC

Inventor： KRUMME JOHN F ,  COWELL MARK J

IPC: H01B5/00 ,  H01B5/02 ,  H01L23/32 ,  H01R4/02 ,  H01R33/76 ,  H01R43/02 ,  H02G5/02 ,  H05K1/02 ,  H05K1/11 ,  H05K3/34

CPC classification number: H02G5/02 ,  H01R43/02 ,  H01R43/0242 ,  H05K1/0212 ,  H05K1/0242 ,  H05K3/3421 ,  H05K3/3494 ,  H05K2201/083 ,  H05K2201/10272 ,  H05K2201/10325 ,  H05K2201/10689 ,  H05K2203/104 ,  H05K2203/1115

Abstract: A self-heating and self-soldering bus bar for use in many applications. The pins of the bus bar are quickly and directly heated to a predetermined autoregulated temperature without significantly raising the temperature of the body of the bus. Thusly a bus bar may be mounted while maintaining thermal balance and mechanical integrity of all work pieces. The present invention avoids the problems normally associated with excess thermal expansion experienced when a bus bar is heated incidental to the heating of its contact points. A majority of this incidental heating is eliminated by direct quick heating of the mounting pins.

公开(公告)号：WO2017112066A1

公开(公告)日：2017-06-29

申请号：PCT/US2016/057909

申请日：2016-10-20

Applicant: INTEL CORPORATION

Inventor： TOMITA, Yoshihiro ,  HEPPNER, Joshua D. ,  LIFF, Shawna M. ,  MALATKAR, Pramod

IPC: H01L21/677

CPC classification number: H05K1/0393 ,  A41D1/002 ,  A41D13/0015 ,  A43B3/0005 ,  H05K1/03 ,  H05K1/118 ,  H05K1/189 ,  H05K3/0011 ,  H05K3/007 ,  H05K3/32 ,  H05K2201/0129 ,  H05K2201/0203 ,  H05K2201/0215 ,  H05K2201/08 ,  H05K2201/083 ,  H05K2203/0152 ,  H05K2203/104

Abstract: In accordance with disclosed embodiments, there are provided methods, systems, and apparatuses for implementing a magnetic particle embedded flexible substrate, a printed flexible substrate for a magnetic tray, or an electro-magnetic carrier for magnetized or ferromagnetic flexible substrates. For instance, in accordance with one embodiment, there are means disclosed for fabricating a flexible substrate having one or more electrical interconnects to couple with leads of an electrical device; integrating magnetic particles or ferromagnetic particles into the flexible substrate; supporting the flexible substrate with a carrier plate during one or more manufacturing processes for the flexible substrate, in which the flexible substrate is held flat against the carrier plate by an attractive magnetic force between the magnetic particles or ferromagnetic particles integrated with the flexible substrate and a complementary magnetic attraction of the carrier plate; and removing the flexible substrate from the carrier plate subsequent to completion of the one or more manufacturing processes for the flexible substrate. Other related embodiments are disclosed.

Abstract translation: 根据所公开的实施例，提供了用于实现磁性颗粒嵌入式柔性衬底，用于磁盘的印刷柔性衬底或用于磁化或磁化的磁性载体的电磁载体的方法，系统和设备， 铁磁柔性衬底。 例如，根据一个实施例，公开了用于制造具有一个或多个电互连以与电气设备的引线耦合的柔性基板的装置; 将磁性颗粒或铁磁性颗粒整合到柔性基板中; 在柔性衬底的一个或多个制造过程期间用载体板支撑柔性衬底，其中柔性衬底通过与柔性衬底集成的磁性颗粒或铁磁颗粒之间的吸引磁力与载体板保持平坦， 载板的互补磁吸引力; 以及在完成用于柔性衬底的一个或多个制造工艺之后从柔性衬底移除柔性衬底。 披露了其他相关的实施例。

公开(公告)号：WO2015196673A1

公开(公告)日：2015-12-30

申请号：PCT/CN2014/089432

申请日：2014-10-24

Applicant: 京东方科技集团股份有限公司

Inventor： 吴月 ,  任妍 ,  王子锋

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/14

CPC classification number: H05K1/0233 ,  H05K1/0225 ,  H05K1/0228 ,  H05K1/0231 ,  H05K1/115 ,  H05K1/162 ,  H05K2201/083 ,  H05K2201/093

Abstract: 一种PCB板及电子装置，PCB板包括：一基板和设置在基板上的布线层（1），布线层包括数字区（11）和模拟区（12），数字区和模拟区间隙设置，基板在间隙位置设置有洞孔（13），布线层的数字区和模拟区通过磁珠（14）进行连接。

公开(公告)号：WO2015049991A1

公开(公告)日：2015-04-09

申请号：PCT/JP2014/074633

申请日：2014-09-18

Applicant: 日東電工株式会社

Inventor： 増田　将太郎 ,  江部　宏史 ,  土生　剛志 ,  松富　亮人

IPC: H01F1/26 ,  B22F1/00 ,  B22F3/02 ,  H01F1/147 ,  H05K3/28 ,  H05K9/00

CPC classification number: C22C33/0257 ,  B22F1/0011 ,  B22F1/0055 ,  B22F2007/042 ,  C22C2202/02 ,  H01F1/28 ,  H05K1/16 ,  H05K3/281 ,  H05K2201/083 ,  H05K2201/10151

Abstract: 　軟磁性粒子粉末は、扁平状の軟磁性粒子からなる軟磁性粒子粉末であって、軟磁性粒子粉末の尖度が、－０．３５を超過する。

Abstract translation: 该软磁性粒子粉末是包含平坦软磁性粒子的软磁性粒子粉末，软磁性粒子的峰度超过-0.35。

公开(公告)号：WO2014145860A1

公开(公告)日：2014-09-18

申请号：PCT/US2014/030696

申请日：2014-03-17

Applicant: FLEXTRONICS AP, LLC

Inventor： SUORSA, Peter

IPC: H01Q17/00

CPC classification number: H05K9/0088 ,  G02B2207/121 ,  H01Q17/00 ,  H01Q17/002 ,  H05K1/0233 ,  H05K1/0236 ,  H05K1/024 ,  H05K2201/083 ,  Y10T29/49018 ,  Y10T156/1002

Abstract: A method for producing a magnetic resonant frequency (MRF) absorber and apparatus for an MRF absorber are described herein. The method comprises processing a high permeability material such as permalloy comprising 80% nickel, 18% iron, 2% molybdenum to create a specific geometric form factor such as a flake, sphere, or rod. The geometric form factor may then be encapsulated in an insulating matrix. The insulating matrix may be a Potassium Silicate (SiO 3 K 2 ). The insulated flake, sphere, or rod form factor may be introduced to a powder coating process. The insulated flake, sphere, or rod form factor may then be mixed with a polymetric coating powder at a weight ratio based on a desired performance for absorbing electromagnetic interference (EMI).

Abstract translation: 本文描述了用于制造用于MRF吸收器的磁共振频率（MRF）吸收器和装置的方法。 该方法包括加工包括80％镍，18％铁，2％钼的坡莫合金的高磁导率材料，以产生特定的几何形状因子，例如片状，球形或棒状。 然后可以将几何形状因子封装在绝缘矩阵中。 绝缘基质可以是硅酸钾（SiO 3 K 2）。 绝缘薄片，球形或棒状形状因子可以被引入到粉末涂覆过程中。 绝缘薄片，球形或棒状形状因子可以与聚甲基涂层粉末以基于所需性能的重量比与吸收电磁干扰（EMI）混合。

公开(公告)号：WO2013066663A3

公开(公告)日：2013-12-12

申请号：PCT/US2012061424

申请日：2012-10-23

Applicant: TICONA LLC

Inventor： YUNG PAUL C ,  LUO RONG

IPC: C08K3/36

CPC classification number: C08K3/36 ,  C08K3/22 ,  C09K19/38 ,  H05K1/0373 ,  H05K3/105 ,  H05K2201/0129 ,  H05K2201/083 ,  H05K2201/09118 ,  H05K2201/0999 ,  H05K2203/107

Abstract: A thermoplastic composition that contains a unique combination of a thermotropic liquid crystalline polymer, dielectric material, laser activatable additive, and a fibrous filler is provided. The nature of the components and/or their concentration are selectively controlled in the present invention to maintain a high dielectric constant, good mechanical properties (e.g., deflection under load), and good processibility (e.g., low viscosity), yet still be laser activatable. Thus, the thermoplastic composition can be readily shaped into a thin substrate and subsequently applied with one or more conductive elements using a laser direct structuring process ("LDS").

Abstract translation: 提供了包含热致液晶聚合物，介电材料，激光可激活添加剂和纤维填料的独特组合的热塑性组合物。 在本发明中选择性地控制组分的性质和/或它们的浓度以保持高的介电常数，良好的机械性能（例如，负载下的挠曲）和良好的加工性（例如低粘度），但仍然是激光可激活的 。 因此，热塑性组合物可以容易地成形为薄的衬底，并随后使用激光直接结构化工艺（“LDS”）施加一个或多个导电元件。