公开(公告)号：EP2019009A3

公开(公告)日：2010-11-03

申请号：EP08013346.5

申请日：2008-07-24

Applicant: NISSIN KOGYO CO., LTD.

Inventor： Takayanagi, Akihide

IPC: B60T8/36 ,  G01L19/00

CPC classification number: B60T8/368 ,  F15B13/0835 ,  F15B13/0853 ,  F15B13/086 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/09754 ,  H05K2201/0999 ,  H05K2201/10287

Abstract: An electronic control unit includes a sensor circuit board (30) which is mounted with sensors (33,34) for detecting a predetermined physical quantity; a control circuit board (20) which controls an operation of an electric component on the basis of the physical quantity detected by the sensors (33,34); and a housing (40) which accommodates the sensor circuit board (30) and the control circuit board (20), wherein the sensor circuit board (30) is mounted to a stepped portion (47) formed in an inner surface of the housing (40) so that the sensor circuit board (30) and the control circuit board (20) are arranged in a layered state, and the sensor circuit board (30) is electrically connected to the control circuit board (20) by a conductive member (49) embedded in the housing (40).

公开(公告)号：EP1603158A4

公开(公告)日：2009-07-15

申请号：EP04717227

申请日：2004-03-04

Applicant: FURUKAWA ELECTRIC CO LTD

Inventor： SHIRAI TAKEHIRO ,  IWASE MASAYUKI

IPC: H01L23/50 ,  G02B6/38 ,  G02B6/42 ,  H01L23/24 ,  H01L23/498 ,  H01R12/00 ,  H05K1/05 ,  H05K3/44

CPC classification number: G02B6/4201 ,  G02B6/3885 ,  G02B6/4277 ,  G02B6/428 ,  G02B6/4292 ,  H01L23/24 ,  H01L23/49861 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0219 ,  H05K1/056 ,  H05K3/06 ,  H05K3/44 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2201/09754 ,  H05K2201/10121 ,  H05K2203/0323 ,  Y10T29/49121 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A printed wiring board (10) comprising a plurality of conductive plates (10a) spatially separated with each other and including at least one conductive plate which is used as a lead for electrical connection with an external circuit, insulating layers (10b) formed on the conductive plates and/or formed spanning across the conductive plates, and a plurality of wiring patterns (10d) formed on the insulating layers is disclosed. At least one of the conductive plates and at least one of the wiring patterns are electrically connected with each other through a via hole (11a). A method for manufacturing such a printed wiring board, a lead frame package and an optical module respectively using such a printed wiring board are also disclosed.

公开(公告)号：EP1447280A2

公开(公告)日：2004-08-18

申请号：EP04003522.2

申请日：2004-02-17

Applicant: Denso Corporation

Inventor： Kato, Keiichi ,  Morishima, Tamotsu

IPC: B60R16/00

CPC classification number: B60R16/0239 ,  H05K1/141 ,  H05K3/103 ,  H05K3/284 ,  H05K3/3447 ,  H05K2201/09754 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10287 ,  H05K2203/1316

Abstract: In a vehicle electronic control unit, a power device (21) and a circuit component (22-25), which structure a circuit in which current flows when the power device (21) is driven, and a printed board (31) are disposed within an aluminum case (30) as a housing. Both the power device (21) and the circuit component (22-25) are disposed within a resin mold unit (40) in a state where both the power device (21) and the circuit component (22-25) are wired so that a loop circuit is structured as a current path. Both the power device (21) and the circuit component (22-25) are mounted on the printed board (31) by using a connection terminal (41) which protrude from the resin mold unit (40). According to the vehicle electronic control unit, noise and efficiency of the circuit can be improved because a loop of large current can be reduced.

Abstract translation: 在车辆用电子控制单元中，构成驱动动力装置（21）时电流流过的电路的电力装置（21）和电路构件（22-25）以及印刷基板（31） 在作为外壳的铝外壳（30）内。 功率器件（21）和电路部件（22-25）在电力设备（21）和电路部件（22-25）都被布线的状态下设置在树脂模具单元（40）内，使得 环路电路被构造为电流路径。 通过使用从树脂模具单元（40）突出的连接端子（41）将功率器件（21）和电路部件（22-25）两者安装在印刷电路板（31）上。 根据车辆电子控制单元，可以提高电路的噪声和效率，因为可以减小大电流回路。

公开(公告)号：EP0924971A3

公开(公告)日：2000-12-13

申请号：EP98122968.5

申请日：1998-12-03

Applicant: TEMIC TELEFUNKEN microelectronic GmbH

Inventor： Baur, Richard ,  Bischoff, Michael ,  Fendt, Günter

IPC: H05K3/36 ,  H01R9/09 ,  H05K5/02

CPC classification number: H05K7/142 ,  H01R12/52 ,  H05K1/142 ,  H05K1/144 ,  H05K3/3447 ,  H05K3/368 ,  H05K2201/09754 ,  H05K2201/0999 ,  H05K2201/2036 ,  H05K2203/167

Abstract: Zur Kontaktierung von verschiedenen Leiterplatten innerhalb eines Gehäuses werden meistens Stecker, korrespondierende Aufnehmer und gegebenenfalls dazwischen liegende Verbindungsleitungen verwendet, die teuer sind und zusätzliche Arbeitsschritte bei der Montage erfordern. Als Lösung der technischen Aufgabe wird eine Anordnung beschrieben, bei der auf den Leiterplatten (4,5) erste Kontaktmittel (7) und im Gehäuse (1) eine Kontaktierungsbrücke (10) mit zweiten Kontaktmitteln (14) angeordnet sind, wobei beide Kontaktmittel miteinander korrespondieren. Bei der Montage werden die Leiterplatten (4,5) mit den ersten Kontaktmitteln (7) einfach auf die Kontaktierungsbrücke (10) gelegt, wodurch ein Kontakt zwischen den verschiedenen Leiterplatten (4,5) hergestellt ist.

公开(公告)号：EP0403335B1

公开(公告)日：1993-09-01

申请号：EP90401542.7

申请日：1990-06-06

Applicant: AUTOMOBILES PEUGEOT ,  AUTOMOBILES CITROEN

Inventor： Celnik Jean

IPC: H05K3/20

CPC classification number: B60R16/0239 ,  H05K1/0203 ,  H05K1/0393 ,  H05K1/056 ,  H05K3/005 ,  H05K3/041 ,  H05K3/20 ,  H05K3/202 ,  H05K3/281 ,  H05K3/386 ,  H05K5/0026 ,  H05K2201/09118 ,  H05K2201/09754 ,  H05K2203/0108 ,  H05K2203/1545 ,  H05K2203/175

公开(公告)号：EP0312631A1

公开(公告)日：1989-04-26

申请号：EP87115411.8

申请日：1987-10-21

Applicant: PRESSKONTAKT Ing. grad. Hartmuth Thaler KG

Inventor： Thaler, Hartmuth F., Ing. (grad) ,  Mueller, Ulrich H.A., Dipl.-Phys. Ing.

IPC: H05K3/36 ,  H05K7/06 ,  H05K1/18

CPC classification number: H05K1/148 ,  H05K3/061 ,  H05K3/328 ,  H05K3/386 ,  H05K3/4046 ,  H05K2201/043 ,  H05K2201/055 ,  H05K2201/0723 ,  H05K2201/09754 ,  H05K2201/10234 ,  H05K2201/10287 ,  H05K2201/10977 ,  H05K2203/1189 ,  H05K2203/1469

Abstract: Zum Herstellen elektrisch leitender Verbindungen zwischen flachen Leiterbahnen (3, 4), die durch einen Isolier­träger voneinander getrennt sind, werden zwei Metall­folien (1, 2), die mit Heißkleberschichten (5, 6) be­schichtet sind, nebeneinandergelegt. An den Stellen der später herzustellenden und miteinander zu verbindenden Leiterbahnen (3, 4) sind Kontaktpunkte (7, 10) vorgesehen, an welche Drähte (8, 9, 10) angeschweißt werden, die, soweit sie auf der Ebene der Metallfolien (1, 2) verlaufen, durch Wärmezufuhr in die Schichten (5, 6) eingebettet werden. Anschließend werden die Metallfolien (1, 2) mit ihren Heißkleberschichten (5, 6) unter Zwischenlage des Isolierträgers gegeneinandergeklappt und durch Wärme­zufuhr mit diesem verbunden. Nunmehr werden von den Metall­folien (1, 2) die Zwischenräume (13, 14) zur Bildung der Leiterbahnen (3, 4) abgeätzt.

Abstract translation: 为了制造扁平导体轨道之间的导电连接（3,4），它们彼此通过在绝缘性的载体，两个金属箔分离的（1，2），涂有热粘接层（5,6） 被放置并排侧。 在导电轨迹的点被提供接触点（7，10）（3,4），其随后被制造并彼此连接，向其中接触点（7，10）有焊接导线（8,9 10）被嵌入在所述层（5,6）通过施加热，以thatthey在金属箔的面（1运行的范围内，2）。 随后，将金属箔（1，2）在它们的热粘合剂层（5,6）被折叠抵靠彼此，在它们之间放置了绝缘性的载体，向其中通过施加热而被连接。 用于形成导体轨道的中间空间（13，14）（3,4）现在从金属箔蚀刻掉（1，2）。

公开(公告)号：US20240215170A1

公开(公告)日：2024-06-27

申请号：US18542843

申请日：2023-12-18

Applicant: Robert Bosch GmbH

Inventor： Irfan AYDOGMUS

IPC: H05K1/18 ,  H01R12/52 ,  H01R12/58

CPC classification number: H05K1/186 ,  H01R12/52 ,  H01R12/58 ,  H05K2201/09754 ,  H05K2201/10189

Abstract: An electronic module. The electronic module includes a circuit carrier having an electrical and/or electronic circuit. This circuit is completely embedded in an encapsulation molding compound. The electronic module includes an electrically contactable outer contact connection arranged on the enclosure, which has a press-fit zone. The contact connection is electrically connected to the electrical and/or electronic circuit on an upper side of the circuit carrier facing the press-fit zone. In the region of the press-in zone, the contact connection in the enclosure is free of the encapsulating compound. The contact connection is accommodated in a cavity of a holding frame made of a plastics material. The cavity is formed by a closed wall running around the contact connection, which rests on the upper side of the circuit carrier and projects in a direction of the press-fit zone. The wall separates the cavity from the encapsulating compound.

公开(公告)号：US20240032190A1

公开(公告)日：2024-01-25

申请号：US18481116

申请日：2023-10-04

Applicant: CANON KABUSHIKI KAISHA

Inventor： KOICHI ODAGAKI ,  YOSHIHIKO FUJISE

IPC: H05K1/02 ,  H04N23/68 ,  H04N23/50 ,  H01R12/70 ,  H05K1/18 ,  H01R12/71

CPC classification number: H05K1/0284 ,  H05K1/0296 ,  H04N23/6812 ,  H04N23/50 ,  H01R12/7082 ,  H05K2201/09754 ,  H05K2201/10151 ,  H05K2201/09236 ,  H05K2201/0999 ,  H05K2201/09163 ,  H05K2201/09118 ,  H05K1/181 ,  H01R12/714 ,  H05K2201/09045

Abstract: A base member that is a molded part on which pattern wiring is directly formed, includes a projection projecting from a base surface of the base member. The pattern wiring is laid over a top of the projection, and protrusions are molded on both sides of an area at the top of the projection where the pattern wiring passes.

公开(公告)号：US09997856B2

公开(公告)日：2018-06-12

申请号：US14953888

申请日：2015-11-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sung Yong Joo ,  Jin Hyung Lee ,  Seok Yeol Chun

IPC: H01R13/73 ,  H01R13/40 ,  H05K5/00 ,  H05K5/02 ,  G02F1/1333 ,  H01R12/71 ,  H01R13/52 ,  H01R9/24 ,  H01R12/70 ,  H01R24/76 ,  H04N5/63 ,  H04N5/64 ,  H05K1/18 ,  G06F1/16

CPC classification number: H01R13/40 ,  G02F1/133308 ,  G02F2001/133314 ,  G06F1/16 ,  H01R9/2491 ,  H01R12/7076 ,  H01R12/716 ,  H01R13/5213 ,  H01R24/76 ,  H04N5/63 ,  H04N5/64 ,  H05K1/185 ,  H05K5/0017 ,  H05K5/0026 ,  H05K5/0247 ,  H05K2201/09754 ,  H05K2201/10325

Abstract: A display apparatus in which a height of an AC socket protruding to a rear side of a printed circuit board is reduced and a power cord is provided to be in close contact with a product to provide a display apparatus in which a creeping distance is increased to prevent the printed circuit board from being damaged by a high voltage or a stroke of lightning.

公开(公告)号：US20180048045A1

公开(公告)日：2018-02-15

申请号：US15783192

申请日：2017-10-13

Applicant: Sony Semiconductor Solutions Corporation

Inventor： Hidekazu KIKUCHI ,  Takayuki MOGI ,  Yoshiyuki AKIYAMA ,  Hirofumi KAWAMURA

IPC: H01P5/02 ,  H01P3/12 ,  H01P5/107 ,  H01R13/66 ,  H05K1/02 ,  H04B3/56 ,  H04B7/24 ,  H01R24/76 ,  H01R13/6461 ,  H01R103/00 ,  H01R24/28

CPC classification number: H01P5/02 ,  H01P1/208 ,  H01P3/12 ,  H01P3/121 ,  H01P3/165 ,  H01P5/024 ,  H01P5/082 ,  H01P5/087 ,  H01P5/1022 ,  H01P5/107 ,  H01P5/18 ,  H01P5/182 ,  H01P5/188 ,  H01R13/6461 ,  H01R13/665 ,  H01R24/28 ,  H01R24/76 ,  H01R2103/00 ,  H04B3/56 ,  H04B7/24 ,  H05K1/0225 ,  H05K1/0239 ,  H05K2201/093 ,  H05K2201/09672 ,  H05K2201/0969 ,  H05K2201/09754

Abstract: A signal transmission system including: a first connector apparatus, and a second connector apparatus that is coupled with the first connector apparatus. The first connector apparatus and the second connector apparatus are coupled together to form an electromagnetic field coupling unit, and a transmission object signal is converted into a radio signal, which is then transmitted through the electromagnetic field coupling unit, between the first connector apparatus and the second connector apparatus.