公开(公告)号：TW274620B

公开(公告)日：1996-04-21

申请号：TW082101467

申请日：1993-03-01

Applicant: 日東電工股份有限公司

Inventor： 東一美 ,  前田雅子 ,  望月周

IPC: H01B

CPC classification number: H05K3/321 ,  H01L23/49827 ,  H01L2224/83101 ,  H01L2924/01019 ,  H01L2924/01079 ,  H05K2201/0154 ,  H05K2201/09945 ,  H05K2201/10378

Abstract: 揭示一種異方導電性粘著膜，且有沿厚度方向各別可導電穿通絕緣膜之細貫穿孔，該膜前、後表面上各貫穿孔之二端部之至少一端部用一具有較貫穿孔開口部面積更大底面積之隆起式金屬突出物所封阻，其中絕緣膜包含一具有400℃之之熔融粘度1×103～1×107泊皮玻璃轉移度至少475k之熱塑性聚醯亞胺樹脂層形成在絕緣膜之至少一表面上，又其中隆起形式金屬突出物之底面積為比貫穿孔之平面面積大1.1倍，且貫穿孔之平面面積為大於(絕緣膜之厚度)2者。此膜被插在欲連之材料之間以提供一連接結構。

Abstract in simplified Chinese: 揭示一种异方导电性粘着膜，且有沿厚度方向各别可导电穿通绝缘膜之细贯穿孔，该膜前、后表面上各贯穿孔之二端部之至少一端部用一具有较贯穿孔开口部面积更大底面积之隆起式金属突出物所封阻，其中绝缘膜包含一具有400℃之之熔融粘度1×103～1×107泊皮玻璃转移度至少475k之热塑性聚酰亚胺树脂层形成在绝缘膜之至少一表面上，又其中隆起形式金属突出物之底面积为比贯穿孔之平面面积大1.1倍，且贯穿孔之平面面积为大于(绝缘膜之厚度)2者。此膜被插在欲连之材料之间以提供一连接结构。

公开(公告)号：US20180310403A1

公开(公告)日：2018-10-25

申请号：US15493680

申请日：2017-04-21

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Chad M. Albertson ,  Eric J. Campbell ,  Nicholas J. Ollerich ,  Christopher W. Steffen

IPC: H05K1/09 ,  H05K1/18 ,  H05K3/10 ,  H05K3/14 ,  H05K3/12 ,  H05K3/18 ,  H05K3/34

CPC classification number: H05K1/112 ,  H05K1/115 ,  H05K3/0014 ,  H05K3/146 ,  H05K3/3405 ,  H05K3/3436 ,  H05K2201/09636 ,  H05K2201/09836 ,  H05K2201/09945 ,  Y10T29/49155

Abstract: A method of forming an multi-chip carrier that includes providing a trace structure using an additive forming method. The method includes forming a metal layer on a trace structure to provide electrically conductive lines. A dielectric material may then be formed on the electrically conductive lines to encapsulate a majority of the electrically conductive lines. The ends of the electrically conductive lines that are exposed through the upper surface of the dielectric material provide a top processor mount location and the ends of the electrically conductive lines that are exposed through the sidewalls of the dielectric material provide a sidewall processor mount location.

公开(公告)号：US09873394B2

公开(公告)日：2018-01-23

申请号：US15034446

申请日：2014-10-15

Applicant: Sumitomo Wiring Systems, Ltd ,  AutoNetworks Technologies, Ltd. ,  Sumitomo Electric Industries, Ltd.

Inventor： Yoshikazu Hachiya

IPC: H01R13/46 ,  B60R16/03 ,  H05K1/02 ,  H02G3/08 ,  B60R16/023 ,  H05K3/10 ,  H05K3/24 ,  H05K3/46

CPC classification number: B60R16/03 ,  B60R16/0239 ,  H02G3/081 ,  H02G3/088 ,  H05K1/0256 ,  H05K1/0265 ,  H05K3/103 ,  H05K3/24 ,  H05K3/4617 ,  H05K3/4626 ,  H05K2201/09063 ,  H05K2201/09945 ,  H05K2201/10272

Abstract: Provided is an electrical junction box having a novel structure capable of preventing vehicle fire after the infiltration of water without depending on a waterproofing structure of the electrical junction box. An electrical junction box includes a bus bar circuit unit obtained by arranging a plurality of bus bars including a power source-side bus bar to be connected to a power source line and a ground-side bus bar to be connected to a ground line on insulated boards. In the electrical junction box, the power source-side bus bar and the ground-side bus bar are arranged adjacent to each other, and an oxide deposition inhibiting structure is provided in exposed portions of the insulated board exposed through a gap between the power source-side bus bar and the ground-side bus bar.

公开(公告)号：US20170181276A1

公开(公告)日：2017-06-22

申请号：US15370072

申请日：2016-12-06

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： SUSUMU SAWADA ,  YOSHIHIRO TOMITA ,  KOICHI HIRANO ,  HIDEKI OHMAE

IPC: H05K1/02 ,  H05K1/18 ,  B32B5/04 ,  B32B7/08 ,  B32B3/26 ,  B32B5/02

CPC classification number: H05K1/0283 ,  B32B3/16 ,  B32B3/266 ,  B32B5/022 ,  B32B5/024 ,  B32B5/026 ,  B32B5/028 ,  B32B5/04 ,  B32B5/06 ,  B32B7/08 ,  B32B15/082 ,  B32B15/092 ,  B32B15/095 ,  B32B15/14 ,  B32B15/18 ,  B32B15/20 ,  B32B27/06 ,  B32B27/281 ,  B32B27/308 ,  B32B27/38 ,  B32B27/40 ,  B32B2250/02 ,  B32B2250/04 ,  B32B2262/0207 ,  B32B2262/0223 ,  B32B2262/0238 ,  B32B2262/0246 ,  B32B2262/0253 ,  B32B2262/0261 ,  B32B2262/0269 ,  B32B2262/0276 ,  B32B2262/0284 ,  B32B2262/0292 ,  B32B2262/04 ,  B32B2262/062 ,  B32B2262/08 ,  B32B2262/101 ,  B32B2262/103 ,  B32B2262/105 ,  B32B2262/106 ,  B32B2262/14 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2307/306 ,  B32B2307/51 ,  B32B2307/546 ,  B32B2307/724 ,  B32B2307/732 ,  B32B2457/00 ,  H01L23/5387 ,  H05K1/0366 ,  H05K1/038 ,  H05K1/18 ,  H05K1/189 ,  H05K3/202 ,  H05K2201/0133 ,  H05K2201/029 ,  H05K2201/09227 ,  H05K2201/09263 ,  H05K2201/09945

Abstract: A substrate is provided with: a stretchable sheet; a plurality of members located on the sheet; a plurality of strips that are stretchable, and that connect the plurality of members; and a plurality of fiber threads that sew the plurality of members and the sheet together.

公开(公告)号：US20160143174A1

公开(公告)日：2016-05-19

申请号：US14942658

申请日：2015-11-16

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Youngmin CHO

IPC: H05K7/06 ,  H05K1/18 ,  H05K1/14 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/181 ,  H05K3/323 ,  H05K2201/09945 ,  H05K2201/10128 ,  H05K2203/0522

Abstract: A display device includes: a substrate having a pad area; a conductive pad on the pad area; a circuit member on the conductive pad, the circuit member including a bump overlapping the conductive pad; and an anisotropic conductive film between the conductive pad and the bump, the anisotropic conductive film electrically connecting the conductive pad and the bump. The anisotropic conductive film includes: an adhesive layer; at least one conductive particle positioned within the adhesive layer; and a first guide pattern positioned at a surface of the adhesive layer adjacent to the conductive pad.

Abstract translation: 显示装置包括：具有焊盘区域的基板; 焊盘区域上的导电焊盘; 所述电路构件在所述导电焊盘上，所述电路构件包括与所述导电焊盘重叠的凸块; 以及在导电焊盘和凸块之间的各向异性导电膜，各向异性导电膜电连接导电焊盘和凸块。 各向异性导电膜包括：粘合剂层; 位于所述粘合剂层内的至少一个导电颗粒; 以及位于所述粘合剂层的与所述导电垫相邻的表面的第一引导图案。

公开(公告)号：US20140340857A1

公开(公告)日：2014-11-20

申请号：US14276413

申请日：2014-05-13

Applicant: MC10, INC.

Inventor： YUNG-YU HSU ,  JOHN WORK ,  KEVIN J. DOWLING

IPC: H05K1/02

CPC classification number: H05K1/0283 ,  A61B5/0059 ,  A61B5/6846 ,  A61B2562/164 ,  H01L23/145 ,  H01L23/5386 ,  H01L23/5387 ,  H01L2924/15791 ,  H05K1/189 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/09263 ,  H05K2201/09945

Abstract: An example stretchable device is described that includes electrical contacts and an interconnect coupling the electrical contacts. The interconnect has a meander-shaped configuration that includes at least one nested serpentine-shaped feature. The interconnect can be conductive or non-conductive. The meander-shaped configuration can be a serpentine structure, providing a serpentine-in-serpentine configuration.

Abstract translation: 描述了一个示例性可拉伸装置，其包括电触点和耦合电触点的互连。 互连具有曲折形状，其包括至少一个嵌套蛇形特征。 互连可以是导电的或不导电的。 弯曲形状的构造可以是蛇形结构，提供蛇形蛇形结构。

公开(公告)号：US20140027169A1

公开(公告)日：2014-01-30

申请号：US13723156

申请日：2012-12-20

Applicant: BENQ MATERIALS CORPORATION

Inventor： Chien-Huang HUANG ,  Chen-Kuan KUO ,  Lung-Hai WU

IPC: H05K1/09

CPC classification number: H05K1/09 ,  H05K3/323 ,  H05K2201/09909 ,  H05K2201/09945 ,  H05K2203/0156 ,  H05K2203/0415

Abstract: An anisotropic conductive film is disclosed. The anisotropic conductive film includes a substrate, a plurality of insulating resin walls on the substrate and conductive materials. Each insulating resin wall is disposed on the substrate in parallel to each other. The conductive materials are arranged between the insulating resin walls and have conductivity along a direction parallel to the insulating resin walls.

Abstract translation: 公开了各向异性导电膜。 各向异性导电膜包括基板，基板上的多个绝缘树脂壁和导电材料。 每个绝缘树脂壁彼此平行地设置在基板上。 导电材料布置在绝缘树脂壁之间，并且沿着与绝缘树脂壁平行的方向具有导电性。

公开(公告)号：US08362369B2

公开(公告)日：2013-01-29

申请号：US12792334

申请日：2010-06-02

Applicant: Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda ,  Masao Nakazawa

Inventor： Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda ,  Masao Nakazawa

IPC: H05K1/11

CPC classification number: H01L23/49827 ,  H01L23/49822 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15311 ,  H05K1/0287 ,  H05K1/0306 ,  H05K3/4605 ,  H05K3/4644 ,  H05K2201/09609 ,  H05K2201/09945 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A wiring board includes a core substrate having a structure including an insulating base material and a large number of filamentous conductors densely provided in the insulating base material and piercing the insulating base material in a thickness direction thereof. Pads made of portions of wiring layers are oppositely disposed on both surfaces of the core substrate and electrically connected to opposite ends of a plurality of filamentous conductors in such a manner that the pads share the filamentous conductors. A wiring connection between one surface side and the other surface side of the core substrate is made through the pads. The insulating base material is made of an inorganic dielectric. Pads made of portions of the wiring layers are disposed on both surfaces of the core substrate and electrically connected only to corresponding one end sides of different groups each formed of a plurality of filamentous conductors.

Abstract translation: 布线基板包括芯基板，该芯基板具有密封地设置在绝缘基材中的绝缘基材和大量丝状导体，并且在其厚度方向上刺穿绝缘基材。 由布线层部分构成的垫相对地设置在芯基板的两个表面上，并且以多个丝状导体的相对端电连接，使得焊盘共享丝状导体。 通过焊盘制造芯基板的一个表面侧和另一个表面侧之间的布线连接。 绝缘基材由无机电介质制成。 由布线层的一部分制成的垫片设置在芯基板的两个表面上，并且仅电连接到由多个丝状导体形成的不同组的相应一端侧。

公开(公告)号：US08168894B2

公开(公告)日：2012-05-01

申请号：US12504627

申请日：2009-07-16

Applicant: Hsiao-Wan Kuo

Inventor： Hsiao-Wan Kuo

IPC: H05K1/00

CPC classification number: H05K1/142 ,  H05K1/0266 ,  H05K1/0287 ,  H05K3/0052 ,  H05K2201/09936 ,  H05K2201/09945 ,  H05K2201/10106 ,  H05K2201/10287

Abstract: The present invention provides a light emitting diode (LED) circuit board with a multi-directional electrical connection. The board includes a board body with a surface and an assembly plane as well as four sides and corresponding corners, and a plurality of positive and negative electric contacts, separately arranged onto the surface of the board body nearby four sides, and also arranged at intervals. The circuit of the LED circuit board is simplified, helping to facilitate multi-directional electrical connection and expansion, and to improve significantly the paving efficiency of the LED circuit board with better practicability and industrial benefits.

Abstract translation: 本发明提供一种具有多方向电连接的发光二极管（LED）电路板。 板包括具有表面和组装平面以及四个侧面和相应角部的板体，以及分别布置在四个侧面附近的板体表面上的多个正负电触点，并且还间隔地布置 。 LED电路板的电路简化，有助于促进多方向电连接和扩展，并显着提高LED电路板的铺路效率，具有更好的实用性和工业效益。

公开(公告)号：US20110013340A1

公开(公告)日：2011-01-20

申请号：US12833185

申请日：2010-07-09

Applicant: Michio HORIUCHI ,  Yasue Tokutake ,  Yuichi Matsuda ,  Yukio Shimizu ,  Tomoo Yamasaki ,  Yuta Sakaguchi

Inventor： Michio HORIUCHI ,  Yasue Tokutake ,  Yuichi Matsuda ,  Yukio Shimizu ,  Tomoo Yamasaki ,  Yuta Sakaguchi

IPC: H01G4/06 ,  H05K3/30

CPC classification number: H05K1/162 ,  H01G4/012 ,  H01G4/232 ,  H01G4/302 ,  H05K1/0287 ,  H05K1/0306 ,  H05K2201/09263 ,  H05K2201/09563 ,  H05K2201/09609 ,  H05K2201/097 ,  H05K2201/09945

Abstract: A capacitor includes a dielectric substrate and a large number of filamentous conductors formed to penetrate through the dielectric substrate in a thickness direction thereof. An electrode is connected to only respective one ends of a plurality of filamentous conductors constituting one of groups each composed of a plurality of filamentous conductors. The electrode is disposed in at least one position on each of both surfaces of the dielectric substrate, or in at least two positions on one of the surfaces. Further, an insulating layer is formed on each of both surfaces of the dielectric substrate so as to cover regions between the electrodes, and a conductor layer is formed on the corresponding insulating layer integrally with a desired number of electrodes.

Abstract translation: 电容器包括电介质基板和形成为在其厚度方向上穿过电介质基板的大量丝状导体。 电极仅与构成一组各自由多根丝状导体构成的多个丝状导体的相应一端连接。 电极设置在电介质基板的两个表面的每一个上的至少一个位置，或者在其中一个表面上的至少两个位置。 此外，在电介质基板的两个表面的每个表面上形成绝缘层，以覆盖电极之间的区域，并且在相应的绝缘层上形成与期望数量的电极一体的导体层。