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    Electronic component package and base of the same
    144.
    发明授权
    Electronic component package and base of the same 有权
    电子元件封装和基座相同

    公开(公告)号：US08836095B2

    公开(公告)日：2014-09-16

    申请号：US13392540

    申请日：2011-03-11

    Applicant: Yoshiki Maeda ,  Tsuyoshi Kusai

    Inventor： Yoshiki Maeda ,  Tsuyoshi Kusai

    IPC: H05K5/06 ,  H05K1/11 ,  H01L23/053 ,  H03H9/10

    CPC classification number: H03H9/1021 ,  H01L23/053 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/15313 ,  H01L2924/15787 ,  H01L2924/16195 ,  H05K1/111 ,  H05K3/3436 ,  H05K2201/10068 ,  Y02P70/613 ,  H01L2924/00

    Abstract: A base of an electronic component package holds an electronic component element. The base has a bottom face in a rectangular shape in plan view. The base includes a pair of terminal electrodes having a rectangular shape on the bottom face. The pair of terminal electrodes are to be bonded on an external circuit substrate with a conductive bonding material. The pair of terminal electrodes have mutually symmetrical shapes. Each of the terminal electrodes has a long side adjacent to or on an edge of a long side of the bottom face. The long side of each of the terminal electrodes is disposed parallel to the long side of the bottom face. The long side of each of the terminal electrodes has a length that is more than half a length of the long side of the bottom face.

    Abstract translation: 电子部件组件的基座保持电子部件元件。 底座在平面图中具有矩形形状的底面。 底座包括在底面上具有矩形形状的一对端子电极。 该一对端子电极用导电接合材料接合在外部电路基板上。 该对端子电极具有相互对称的形状。 每个端子电极具有与底面的长边相邻或在其长边的边缘上的长边。 每个端子电极的长边平行于底面的长边设置。 每个端子电极的长边长度大于底面长边长度的一半。

    Resonator, printed board, and method for measuring complex dielectric constant
    145.
    发明授权
    Resonator, printed board, and method for measuring complex dielectric constant 有权
    谐振器，印刷电路板和测量复介电常数的方法

    公开(公告)号：US07952365B2

    公开(公告)日：2011-05-31

    申请号：US11817280

    申请日：2006-03-22

    Applicant: Kaoru Narita ,  Taras Kushta

    Inventor： Kaoru Narita ,  Taras Kushta

    IPC: G01R27/04 ,  G01R27/28 ,  G01J3/00

    CPC classification number: H05K1/0268 ,  G01R27/2617 ,  G01R31/2805 ,  H05K1/16 ,  H05K3/429 ,  H05K2201/09618 ,  H05K2201/10068

    Abstract: A plurality of through-hole vias connected to conductor layers is disposed with gaps left between these vias around opening parts disposed in the conductor layers in a printed board in which these conductor layers are disposed parallel to each other so as to sandwich a dielectric layer in between. Furthermore, through-hole vias used for excitation are disposed in the opening parts of the conductor layers and regions of the dielectric layer matching these opening parts in a non-contact manner with the conductor layers. When the complex dielectric constant is measured, a high-frequency power is applied to the through-hole vias, and the power loss between the through-hole vias and the conductor layers is measured by the S parameter method. As a result, the complex dielectric constant and the frequency dependency of this complex dielectric constant can be measured with a high precision in a frequency range extending from several gigahertzes to 20 GHz, and there is no electrical interference with other parts even when this resonator is mounted on a board.

    Abstract translation: 连接到导体层的多个通孔过孔被布置成在印刷电路板的布置在导体层中的开口部分周围的这些通孔之间留有间隙，其中这些导体层彼此平行设置，以将电介质层夹在 之间。 此外，用于激励的通孔过孔以与导体层非接触的方式设置在导体层的开口部分和与这些开口部分匹配的电介质层的区域。 当测量复介电常数时，对通孔通孔施加高频功率，通过S参数法测量通孔和导体层之间的功率损耗。 结果，可以在从几千兆赫到20GHz的频率范围内以高精度测量该复合介电常数的复介电常数和频率依赖性，即使该谐振器是 安装在板上。

    Monoblock RF resonator/filter having a conductive transmission line connecting regions of conductive material
    146.
    发明授权
    Monoblock RF resonator/filter having a conductive transmission line connecting regions of conductive material 有权
    具有连接导电材料区域的导电传输线的单块RF谐振器/滤波器

    公开(公告)号：US07619496B2

    公开(公告)日：2009-11-17

    申请号：US11977276

    申请日：2007-10-24

    Applicant: Alexandre Rogozine

    Inventor： Alexandre Rogozine

    IPC: H01P1/205 ,  H01P1/213

    CPC classification number: H01P1/2056 ,  H01P1/2136 ,  H05K1/0243 ,  H05K3/3442 ,  H05K2201/10068 ,  H05K2201/10666

    Abstract: A resonator/filter adapted for direct surface mounting to the surface of a printed circuit board. The resonator/filter comprises a block of dielectric material including at least one resonator through-hole extending therethrough and respective top, bottom and side surfaces defining respective regions of dielectric material covered with conductive material. The top block surface defines at least a first conductive region. A second conductive region on the bottom surface of the block defines an input/output contact which allows the filter to be mounted on the board with the bottom filter surface seated thereon, thus providing a direct ground contact between the board and the resonator through-hole for improved attenuation performance particularly at higher frequencies. A plurality of transmission line embodiments electrically interconnect the first and second conductive regions.

    Abstract translation: 适用于直接表面安装到印刷电路板表面的谐振器/滤波器。 谐振器/滤波器包括介电材料块，其包括延伸穿过其中的至少一个谐振器通孔以及限定用导电材料覆盖的介电材料的相应区域的相应顶部，底部和侧面。 顶部块表面限定至少第一导电区域。 块的底表面上的第二导电区域限定了输入/输出触点，其允许滤波器安装在板上，底部滤波器表面位于其上，从而在板和谐振器通孔之间提供直接接地 用于改善衰减性能，特别是在较高频率下。 多个传输线实施例将第一和第二导电区域电互连。

    Ovenized oscillator
    147.
    发明申请
    Ovenized oscillator 有权
    烤箱振荡器

    公开(公告)号：US20090051446A1

    公开(公告)日：2009-02-26

    申请号：US12229114

    申请日：2008-08-20

    Applicant: Jeffrey A. McCracken

    Inventor： Jeffrey A. McCracken

    IPC: H03B1/00

    CPC classification number: H03L1/04 ,  H03L1/028 ,  H05K1/0206 ,  H05K1/0212 ,  H05K1/141 ,  H05K3/305 ,  H05K2201/09036 ,  H05K2201/10068 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10462 ,  H05K2201/10545 ,  H05K2201/10946

    Abstract: An ovenized oscillator package including at least a heater and a crystal package mounted on opposite sides of a circuit board. Vias extend through the body of the circuit board to transfer heat from the heater to the crystal package. Layers of thermally conductive material extend through the body of the circuit board and are in thermally coupled relationship with the vias for spreading heat throughout the circuit board and other elements mounted thereon.

    Abstract translation: 一种加热振荡器封装，其至少包括加热器和安装在电路板的相对侧上的晶体封装。 通孔延伸穿过电路板的主体，以将热量从加热器传递到晶体封装。 导热材料层延伸穿过电路板的主体并与通孔热耦合，用于在整个电路板和安装在其上的其它元件上散热。

    Mother substrate, substrate element, and method for manufacturing the same
    150.
    发明授权
    Mother substrate, substrate element, and method for manufacturing the same 失效
    母体衬底，衬底元件及其制造方法

    公开(公告)号：US06835601B2

    公开(公告)日：2004-12-28

    申请号：US10409972

    申请日：2003-04-09

    Applicant: Masaya Wajima

    Inventor： Masaya Wajima

    IPC: H01L2144

    CPC classification number: H05K3/403 ,  H01L21/4846 ,  H01L2924/0002 ,  H05K1/0243 ,  H05K1/092 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/4061 ,  H05K2201/09181 ,  H05K2201/09854 ,  H05K2201/10068 ,  H01L2924/00

    Abstract: An apparatus and method for manufacturing substrate elements includes providing a mother substrate, and forming a plurality of through-holes on first lines and second lines opposing each other across sections on the mother substrate. The sections define each of the substrate elements to be formed. The through-holes on the first lines are disposed alternately with respect to the through-holes on the second lines. Electrodes are also provided on the principal plane of the mother substrate and on the inner surfaces of the through-holes. Then, the mother substrate is cut along cut lines in the vertical and horizontal directions.

    Abstract translation: 用于制造衬底元件的装置和方法包括提供母体衬底，以及在母体衬底上的部分上彼此相对的第一线和第二线上形成多个通孔。 这些部分限定要形成的每个基板元件。 第一线上的通孔相对于第二线上的通孔交替设置。 电极也设置在母基板的主平面上和通孔的内表面上。 然后，沿着垂直和水平方向的切割线切割母基板。

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