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    Machine insertable circuit board electronic component
    141.
    发明授权
    Machine insertable circuit board electronic component 失效
    机械电路板电子元件

    公开(公告)号：US4109296A

    公开(公告)日：1978-08-22

    申请号：US820655

    申请日：1977-08-01

    Applicant: Paul M. Rostek ,  John F. Baeyertz

    Inventor： Paul M. Rostek ,  John F. Baeyertz

    IPC: H01G2/06 ,  H05K1/18 ,  H05K3/30 ,  H05K3/40 ,  H05K1/04

    CPC classification number: H01G2/06 ,  H05K1/184 ,  H05K2201/0919 ,  H05K2201/10583 ,  H05K2201/10606 ,  H05K2201/10636 ,  H05K3/301 ,  H05K3/4046 ,  Y02P70/611

    Abstract: A circuit board component, specifically a capacitor, which is configured to be machine insertable into apertures of a circuit board. The component is a cylindrical element having at least two recessed sectors in the outer surface of the cylindrical element which recessed surfaces are provided with an electrically conductive material. The conductive material either forms a part of the component such as capacitor plates and/or provides a contact surface for the connecting of an internally-mounted electrical component. An indexing means positioned on the one end of the cylindrical element provides a means whereby an automatic insertion machine can by indexing insure the correct orientation of the component with regard to corresponding electrical contacts on the circuit board. A flange extending from one end of the cylindrical element provides a stop in order to limit the travel of the component within the circuit board aperture when inserted by automatic means.

    Mounting substrate and microphone mounted on the same
    147.
    发明专利
    Mounting substrate and microphone mounted on the same 有权
    安装基板和安装在其上的麦克风

    公开(公告)号：JP2007019912A

    公开(公告)日：2007-01-25

    申请号：JP2005199754

    申请日：2005-07-08

    Applicant: Hosiden Corp ,  ホシデン株式会社

    Inventor： IDO TOSHIAKI ,  ONO KAZUO ,  NAKANISHI KENSUKE ,  ONISHI HIROAKI

    IPC: H04R1/04 ,  H04R19/01 ,  H04R19/04

    CPC classification number: H05K3/341 ,  H04R1/06 ,  H04R19/016 ,  H04R31/006 ,  H05K1/0243 ,  H05K3/3452 ,  H05K2201/09809 ,  H05K2201/0989 ,  H05K2201/10083 ,  H05K2201/10583 ,  H05K2203/1178 ,  Y02P70/613

    Abstract: PROBLEM TO BE SOLVED: To reduce a harmful effect by heat to the inside of a microphone by reducing the amount of solder to be used. SOLUTION: This mounting substrate has a central pattern 24 formed in accordance with a central terminal 20 of the microphone, a plurality of outer patterns 25 formed in accordance with a peripheral terminal 21 of the microphone and arranged around the central pattern 24, a resist film 26 adhered surrounding respective parts 27 with no resist film formed on the central pattern 24 and the outer patterns 25, and solder members 28 placed on the parts 27 with no resist film formed surrounded with the resist film 26. COPYRIGHT: (C)2007,JPO&INPIT

    Abstract translation: 要解决的问题：通过减少使用的焊料量来减少热量对麦克风内部的有害影响。 解决方案：该安装基板具有根据麦克风的中心端子20形成的中心图案24，根据麦克风的外围端子21形成并围绕中心图案24布置的多个外部图案25， 在中心图案24和外部图案25上形成有不形成抗蚀剂膜的各个部分27的抗蚀剂膜26，以及没有形成由抗蚀剂膜26包围的抗蚀剂膜的部件27上的焊料部件28。 （C）2007，JPO＆INPIT

    Fuse holder
    149.
    发明专利
    Fuse holder 有权
    保险丝座

    公开(公告)号：JP2005100940A

    公开(公告)日：2005-04-14

    申请号：JP2004186737

    申请日：2004-06-24

    Applicant: Kyoshin Kogyo Co Ltd ,  協伸工業株式会社

    Inventor： KITAJIMA YOSHIICHI ,  NISHIMURA IWAO ,  ITO KOJI

    IPC: H01H85/20 ,  H01R4/48 ,  H01R43/20 ,  H05K3/30 ,  H05K3/34

    CPC classification number: H01R43/205 ,  H01H85/202 ,  H01H2085/2085 ,  H01R4/4809 ,  H05K3/301 ,  H05K3/341 ,  H05K2201/10181 ,  H05K2201/1031 ,  H05K2201/10583 ,  H05K2201/1084 ,  Y02P70/611

    Abstract: PROBLEM TO BE SOLVED: To provide a fuse holder which is surface-mountable by a nozzle chucking type mounting machine, keeps strongly the solder-peeling resistance, allows the precise mounting positioning, and allows a good electrical contact with a glass-tube fuse. SOLUTION: The fuse holder is integrally constructed of: a pair of opposing contact pieces 1a', 1b' which rise up obliquely inward from both sides of a bottom plate 1c mounted on and soldered to a soldering portion 3 of a printed board 2 and whose upper ends 1d, 1e are outward stretched, and which pinch an inserted glass-tube fuse base 5a along the axis; a chucking surface 1g which is provided continuously to one of the contact pieces and chucked and held on a nozzle of the nozzle chucking type mounting machine; a locking part 1h which is provided continuously to the chucking surface and bent toward the bottom plate, and lock an end surface 5b of the base; and a projection 1k of the bottom plate on which the base is mounted between the contact pieces. COPYRIGHT: (C)2005,JPO&NCIPI

    Abstract translation: 要解决的问题：为了提供通过喷嘴夹持型安装机器可表面安装的保险丝座，强烈地保持耐焊锡剥离性，允许精确的安装定位，并且允许与玻璃 - 管保险丝。 熔丝保持器一体地构成：一对相对的接触片1a'，1b'，其从安装在其上并焊接到印刷电路板的焊接部分3上的底板1c的两侧向内倾斜地上升 2，其上端1d，1e向外拉伸，并且沿着轴线夹持插入的玻璃管保险丝座5a; 一个夹持表面1g，其连续地设置在一个接触片上并夹持并保持在喷嘴夹持型安装机的喷嘴上; 锁定部1h，其连续地设置在卡盘面上，朝向底板弯曲，锁定基座的端面5b; 以及底板的突起1k，底座安装在接触片之间。 版权所有（C）2005，JPO＆NCIPI

    ASSEMBLY ARCHITECTURE EMPLOYING ORGANIC SUPPORT FOR COMPACT AND IMPROVED ASSEMBLY THROUGHPUT
    150.
    发明申请
    ASSEMBLY ARCHITECTURE EMPLOYING ORGANIC SUPPORT FOR COMPACT AND IMPROVED ASSEMBLY THROUGHPUT 审中-公开
    组装结构为有力的支持和改进的组装通过

    公开(公告)号：WO2016105435A1

    公开(公告)日：2016-06-30

    申请号：PCT/US2014/072446

    申请日：2014-12-26

    Applicant: INTEL CORPORATION

    Inventor： ELSHERBINI, Adel ,  ALEKSOV, Aleksandar ,  OSTER, Sasha N. ,  LIFF, Shawna M.

    IPC: H01L25/065

    CPC classification number: H05K1/115 ,  H01L25/16 ,  H01L2924/0002 ,  H05K1/144 ,  H05K1/181 ,  H05K3/303 ,  H05K3/368 ,  H05K2201/042 ,  H05K2201/10037 ,  H05K2201/10128 ,  H05K2201/10545 ,  H05K2201/10583 ,  H01L2924/00

    Abstract: An apparatus including a substrate including a first side and an opposite second side; at least one first circuit device on the first side of the substrate, at least one second device on the second side of the substrate; and a support on the second side of the substrate, the support including interconnections connected to the at least one first and second circuit device, the support having a thickness dimension operable to define a dimension from the substrate greater than a thickness dimension of the at least one second circuit device. A method including disposing at least one first circuit component on a first side of a substrate; disposing at least one second circuit component on a second side of the substrate; and coupling a support to the substrate, the substrate defining a dimension from the substrate greater than a thickness dimension of the at least one second circuit component.

    Abstract translation: 一种装置，包括：基板，包括第一侧和相对的第二侧; 在衬底的第一侧上的至少一个第一电路器件，在衬底的第二侧上的至少一个第二器件; 以及在所述基板的第二侧上的支撑件，所述支撑件包括连接到所述至少一个第一和第二电路装置的互连件，所述支撑件具有可操作以从所述基板限定大于所述至少一个第一和第二电路装置的厚度尺寸的尺寸的厚度尺寸 一秒电路装置。 一种方法，包括在衬底的第一侧上布置至少一个第一电路部件; 在所述基板的第二侧上布置至少一个第二电路部件; 以及将支撑件耦合到所述衬底，所述衬底限定来自所述衬底的尺寸大于所述至少一个第二电路部件的厚度尺寸。

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