公开(公告)号：US06713210B1

公开(公告)日：2004-03-30

申请号：US09700692

申请日：2001-03-21

Applicant: Takashi Sato ,  Naofumi Miyasaka ,  Takashi Hasunuma

Inventor： Takashi Sato ,  Naofumi Miyasaka ,  Takashi Hasunuma

IPC: H01M234

CPC classification number: H01M2/348 ,  H01C1/1406 ,  H01M10/4257 ,  H01M10/48 ,  H01M2200/10 ,  H01M2200/106 ,  H05K1/167 ,  H05K3/3442 ,  H05K2201/10643 ,  Y02P70/613

Abstract: A PTC device formed integrally on a PCB substrate, such a PCB substrate, a secondary battery protection circuit device comprising such PCB substrate provided with a circuit to control the voltage and current of secondary batteries, and a secondary battery assembly provided with said device. A PCB substrate 1 is provided with an electronic component 2 and a PTC device 3. The PTC device 3 has a construction having a PTC material 6 in the center, which is provided with foils 7, 7′ made of nickel foil on its top and bottom; an outlet electrode 4 is provided on the foil 7, and an outlet electrode 5, provided on the PCB substrate, is soldered below.

Abstract translation: 一种PTC器件，其一体地形成在PCB基板（例如PCB基板）上，二次电池保护电路装置包括设置有用于控制二次电池的电压和电流的电路的PCB基板以及设置有所述装置的二次电池组件。 PCB基板1设置有电子部件2和PTC装置3. PTC装置3具有中心具有PTC材料6的结构，其在其顶部设置有由镍箔制成的箔7,7'， 底部; 出口电极4设置在箔7上，并且设置在PCB基板上的出口电极5被焊接在下面。

公开(公告)号：US06570484B2

公开(公告)日：2003-05-27

申请号：US10242980

申请日：2002-09-13

Applicant: Michio Miyazaki ,  Haruyuki Takeuchi ,  Tadao Bekku

Inventor： Michio Miyazaki ,  Haruyuki Takeuchi ,  Tadao Bekku

IPC: H01C710

CPC classification number: H01C1/01 ,  H01C1/014 ,  H01C1/1406 ,  H05K1/0201 ,  H05K1/181 ,  H05K3/341 ,  H05K2201/062 ,  H05K2201/10378 ,  H05K2201/10643 ,  H05K2201/10659 ,  H05K2201/2036 ,  Y02P70/611

Abstract: A thermistor with positive resistance-to-temperature characteristic used in a overcurrent protection circuit has electrodes on mutually opposite main surfaces and is mounted to a substrate having electrically conductive members such that deterioration of its voltage resistance due to heat emission can be controlled. A spacer with smaller thermal conductivity than the substrate and penetrated by a conductor piece with a small cross-sectional area is inserted between solder materials connecting to one of the thermistor electrodes. The other electrode is contacted by an elongated connecting member through its sectional surface transverse to its longitudinal direction such that the cross-sectional area of electrical conduction is reduced.

公开(公告)号：US20030076197A1

公开(公告)日：2003-04-24

申请号：US10001781

申请日：2001-10-24

Inventor： Istvan Novak ,  Valerie St.Cyr ,  Michael C. Freda ,  Merle Tetreault

IPC: H01P005/12

CPC classification number: H05K1/0234 ,  H05K1/0231 ,  H05K1/113 ,  H05K1/115 ,  H05K1/116 ,  H05K1/167 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09454 ,  H05K2201/0979 ,  H05K2201/10022 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2201/10643 ,  Y02P70/611

Abstract: A method for achieving a desired value of electrical impedance between conductors of an electrical power distribution structure by electrically coupling multiple bypass capacitors and corresponding electrical resistance elements in series between the conductors. The resistance elements may be annular resistors, and may provide the designer a greater degree of control of the system ESR. The annular resistors may comprise a first terminal, an annular resistor, and a second terminal. The second terminal may be located within the confines of the annular resistor. The annular resistors may be printed onto a conductive plane (e.g. a power plane or a ground plane), or may be a discrete component.

Abstract translation: 一种用于通过电耦合多个旁路电容器和在导体之间串联的对应的电阻元件来实现电力分配结构的导体之间的电阻抗的期望值的方法。 电阻元件可以是环形电阻器，并且可以向设计者提供对系统ESR的更大程度的控制。 环形电阻器可以包括第一端子，环形电阻器和第二端子。 第二端子可以位于环形电阻器的范围内。 环形电阻器可以印刷到导电平面（例如电源平面或接地平面）上，或者可以是分立的部件。

公开(公告)号：US20020191380A1

公开(公告)日：2002-12-19

申请号：US10149789

申请日：2002-06-17

Inventor： Christian Val

IPC: H05K003/42 ,  H05K003/30 ,  H05K003/32

CPC classification number: H01L25/50 ,  H01L23/5222 ,  H01L24/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K1/0231 ,  H05K1/184 ,  H05K1/185 ,  H05K3/045 ,  H05K3/403 ,  H05K2201/0715 ,  H05K2201/09181 ,  H05K2201/09645 ,  H05K2201/10643 ,  Y10T29/49146 ,  Y10T29/49165 ,  H01L2924/00

Abstract: The invention relates to a method and device for interconnecting, in three dimensions, electronic components. In order to decrease the parasitic capacitances between the connections and shielding (304) of the device, metallized (42) grooves (40, 41) are cut in the block (3null) of stacked circuits, the conductors (21) of which are set back from the corresponding face (302) of the block, these grooves just clipping the connection conductors (21). The assembly is then encapsulated with resin (303) and shielded by metallization (304). The invention is especially applicable to producing electronic systems in three dimensions with a small size.

Abstract translation: 本发明涉及一种用于在三维中互连电子部件的方法和装置。 为了减小连接和器件的屏蔽（304）之间的寄生电容，金属化的（42）沟槽（40,41）在堆叠电路的块（3'）中被切割，导体（21）是 从块的相应面（302）回退，这些凹槽仅仅限制连接导体（21）。 然后将组件用树脂（303）包封并通过金属化（304）屏蔽。 本发明特别适用于制造具有小尺寸的三维电子系统。

公开(公告)号：US20010004189A1

公开(公告)日：2001-06-21

申请号：US09729179

申请日：2000-12-05

Inventor： Hideki Seki

IPC: H01J063/04 ,  H01J001/88

CPC classification number: H01G9/012 ,  H01C1/148 ,  H01G9/15 ,  H01L24/02 ,  H01L33/20 ,  H01L33/38 ,  H01L2924/01004 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K3/3442 ,  H05K2201/10643 ,  H05K2203/168 ,  Y02P70/613 ,  H01L2924/00

Abstract: In a polarized electrical component, a first electrode is provided at an inner-side bottom face of the component, and a second electrode is provided at an outer-side bottom face of the component. One of the first and second electrodes serves as an anode electrode, and the other serves as a cathode electrode.

Abstract translation: 在极化电气部件中，第一电极设置在部件的内侧底面，第二电极设置在部件的外侧底面。 第一和第二电极中的一个用作阳极电极，另一个用作阴极电极。

公开(公告)号：US06240625B1

公开(公告)日：2001-06-05

申请号：US09429736

申请日：1999-10-27

Applicant: Mark E. Tuttle

Inventor： Mark E. Tuttle

IPC: H01M642

CPC classification number: H01M2/1066 ,  H01M2/1044 ,  H01M2/204 ,  H01M6/42 ,  H02J7/0024 ,  H04B1/3883 ,  H05K3/321 ,  H05K2201/10037 ,  H05K2201/10515 ,  H05K2201/10643 ,  Y10T29/49108 ,  Y10T29/49114

Abstract: Thin-profile battery circuits and constructions, and in particular button-type battery circuits and constructions and methods of forming the same are described. In one implementation, a substrate is provided having an outer surface with a pair of spaced electrical contact pads thereon. At least two thin-profile batteries are conductively bonded together in a stack having a lowermost battery and an uppermost battery. The batteries include respective positive and negative terminals. The lowermost battery has one of its positive or negative terminals adhesively bonded to one of the pair of electrical contact pads while the uppermost battery has one of its positive or negative terminals electrically connected to the other of the pair of electrical contact pads. The batteries can be provided into parallel or series electrical connections.

Abstract translation: 描述了薄型电池电路和结构，特别是按钮式电池电路及其构成及其形成方法。 在一个实施方案中，提供了具有外表面的衬底，其上具有一对间隔的电接触焊盘。 至少两个薄型电池在具有最低电池和最上面的电池的堆叠中导电地结合在一起。 电池包括相应的正极和负极。 最下面的电池具有一个正极或负极端子，其粘合地粘合到一对电接触焊盘中的一个，而最上面的电池具有与该对电接触焊盘中的另一个电连接的正或负端子中的一个。 电池可以并联或串联电连接。

公开(公告)号：US06175480B1

公开(公告)日：2001-01-16

申请号：US09341366

申请日：1999-07-09

Applicant: Harry Karmazyn

Inventor： Harry Karmazyn

IPC: H02H504

CPC classification number: H01H37/761 ,  H01C7/10 ,  H01H2037/046 ,  H01H2037/763 ,  H02H9/042 ,  H05K1/0201 ,  H05K1/184 ,  H05K3/3442 ,  H05K2201/10181 ,  H05K2201/10643 ,  H05K2203/159 ,  H05K2203/176

Abstract: A varistor with no connecting legs extending from it, is mounted in a slot formed in a printed circuit board. The printed circuit board carries the normal circuit tracks. The physical and electrical connection between the printed circuit board and the varistor is achieved by the use of solder. When the varistor overheats to a temperature beyond a predetermined temperature, the solder melts and the varistor is separated from the printed circuit board. A leaf spring which is biased when the varistor is inserted into the slot pushes the varistor out of the slot when the solder melts. Alternatively, when the solder melts gravity causes the varistor to fall out of the printed circuit board.

Abstract translation: 没有连接脚从其延伸的变阻器安装在形成在印刷电路板中的槽中。 印刷电路板承载正常电路轨道。 印刷电路板和压敏电阻之间的物理和电气连接通过使用焊料实现。 当压敏电阻过热到超过预定温度的温度时，焊料熔化，并且变阻器与印刷电路板分离。 当压敏电阻插入插槽时被偏置的板簧在焊料熔化时将压敏电阻推出槽。 或者，当焊料熔化重力时，压敏电阻从印刷电路板掉出。

公开(公告)号：US6040983A

公开(公告)日：2000-03-21

申请号：US41902

申请日：1998-03-13

Applicant: Daniel Baudouin ,  Ernest J. Russell ,  Jeffrey W. Janzen

Inventor： Daniel Baudouin ,  Ernest J. Russell ,  Jeffrey W. Janzen

IPC: H01G4/232 ,  H05K1/02 ,  H05K7/02

CPC classification number: H01G4/232 ,  H05K1/023 ,  H05K1/0231 ,  H05K2201/10022 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10643 ,  H05K2201/10689

Abstract: In a surface mount assembly, an active integrated circuit device, such as, for example, a dynamic random access memory, typically has a lead finger attached to a solder pad of a printed wiring board. The surface mount assembly is significantly improved by configuring a passive component, such as a resistor or capacitor, such that it has metallic terminations on an upper and lower surface so that it may be positioned between the solder pad of the printed wiring board and the lead finger.

Abstract translation: 在表面安装组件中，有源集成电路器件，例如动态随机存取存储器通常具有连接到印刷线路板的焊盘的引线指。 表面安装组件通过配置诸如电阻器或电容器的无源部件而显着改善，使得其在上表面和下表面上具有金属端接，使得其可位于印刷线路板的焊盘和引线之间 手指。

公开(公告)号：US4611262A

公开(公告)日：1986-09-09

申请号：US609164

申请日：1984-05-11

Applicant: Michael D. Galloway ,  William H. Rose ,  David T. Shaffer

Inventor： Michael D. Galloway ,  William H. Rose ,  David T. Shaffer

IPC: H05K1/18 ,  H05K3/20 ,  H05K3/32 ,  H05K3/40 ,  H05K5/00 ,  H05K5/02

CPC classification number: H05K3/326 ,  H05K5/0086 ,  H05K1/182 ,  H05K2201/0397 ,  H05K2201/09118 ,  H05K2201/10037 ,  H05K2201/10083 ,  H05K2201/1059 ,  H05K2201/10643 ,  H05K3/202 ,  H05K3/4092 ,  Y10S428/901 ,  Y10T29/49105

Abstract: An electrical circuit package comprise a stamped and formed lead frame to which is molded a dielectric housing member which includes openings having exposed electrical contacts, the housing member providing support for the lead frame. Some of the exposed contacts in the openings serve to support electrical components in the openings and to make electrical contact therewith while other of the exposed contacts in the openings electrically engage the electrical components and maintain them in the openings. Further exposed contacts electrically engage another electrical component and the housing member and the further exposed contacts maintain the other electrical component in the housing member. An electrical switch is part of the lead frame.

Abstract translation: 电路封装包括冲压和成形的引线框架，模制成绝缘壳体构件，绝缘壳体构件包括具有暴露的电触点的开口，壳体构件为引线框架提供支撑。 开口中的一些暴露的触点用于支撑开口中的电气部件并与其电接触，而开口中的其他暴露的触点电接合电气部件并将它们保持在开口中。 进一步暴露的接触件电接合另一个电气部件和壳体部件，并且另外暴露的触头将另一电气部件保持在壳体部件中。 电气开关是引线框架的一部分。

公开(公告)号：US3266125A

公开(公告)日：1966-08-16

申请号：US23690362

申请日：1962-11-13

Applicant: DOUGLAS AIRCRAFT CO INC

Inventor： JAN TOBOLSKI

IPC: H05K1/14 ,  H05K1/18 ,  H05K3/28 ,  H05K3/34

CPC classification number: H05K1/145 ,  H05K1/182 ,  H05K3/284 ,  H05K3/34 ,  H05K2201/10643 ,  H05K2203/1316 ,  H05K2203/1469 ,  Y10T29/4913 ,  Y10T29/49156