Abstract:
본 발명의 표면 방출 레이저 소자에 따르면, 장파장 빛을 표면 방출하는 하부 거울층, 광 이득을 제공하는 활성층, 자유 캐리어(free carrier) 흡수 손실을 줄이기 위한 터널 접합층 및 상부 거울층이 화합물 반도체 기판 상에 순차적으로 적층되고, 상기 활성층, 터널 접합층 및 상부 거울층 중 적어도 어느 하나의 측면에 식각에 의하여 구경부가 형성되고,상기 구경부가 형성되는 층보다 더 큰 열 전도성을 갖는 열 방출층이 상기 구경부에 채워지는 것이 특징이다.
Abstract:
A long wavelength vertical cavity surface emitting laser device and a method for manufacturing the same improve performance and reliability of a device by growing all layers with a lattice matched crystal state. A lower mirror layer(20) emits the laser with surface. An active layer(40) provides an optical gain. A tunnel junction layer(60) and an upper mirror layer(80) for reducing the free carrier absorption loss are successively laminated on a compound semiconductor substrate. A vacant part is formed in at least one side among the active layer, the tunnel junction layer and the mirror layer by etching. A thermal dissipation layer having the thermal conductance which is higher than the layer in which the vacant part is formed is filled in the vacant part.
Abstract:
A long wavelength vertical cavity surface emitting laser device and a method for fabricating the same are provided to prevent the crystal defect or plastic deformation by using an epitaxial growing method. In a long wavelength vertical cavity surface emitting laser device, a low mirror layer(20), an active layer(40), a tunnel junction layer(60), and an upper mirror layer(80) are laminated on a compound semiconductor substrate(10), sequentially. The lower mirror layer emits long wavelength light. The active layer provides an optical gain. The tunnel junction layer confines the current. An aperture portion is formed on a side of at least one among the active layer, the tunnel junction layer, and the upper mirror layer using etching. A heat discharging layer(90) having higher heat conductivity than the layer on which the aperture portion is formed, is filled in the aperture portion.
Abstract:
PURPOSE: An anti-guide type surface emitting laser and a method for manufacturing the same are provided to realize a high power with a low current at a single mode since the output light is small in size and it scarcely diverges, thereby reducing the manufacturing cost thereof. CONSTITUTION: An anti-guide type surface emitting laser includes a lower Bragg mirror layer(102), a resonance layer(103), a beam width control layer(113) and an upper Bragg mirror layer(109). The beam width control layer(113) formed on top of the resonance layer(103) includes a first thin film(104) defining the central portion as a current injection region, a second thin film layer(105) for generating an effective refraction index difference between the peripheral portion and the central portion and a third thin film(107) formed between the first thin film(104) and the second thin film(105). The lower Bragg mirror layer(102) is formed on a semiconductor substrate and the resonance layer(103) is formed on top of the lower Bragg mirror layer(102). The upper Bragg mirror layer(109) formed on top of the beam width control layer(113) has a step at a boundary between the edge portion and the central portion by the second thin film(105).
Abstract:
The present invention relates to a method of fabricating vertical-cavity surface emitting lasers being watched as a light source for long wavelength communication. The present invention includes forming a layer having a high resistance near the surface by implanting heavy ions such as silicon (Si), so that the minimum current injection diameter is made very smaller unlike implantation of a proton. Further, the present invention includes regrowing crystal so that current can flow the epi surface in parallel to significantly reduce the resistance up to the current injection part formed by silicon (Si) ions. Therefore, the present invention can not only effectively reduce the current injection diameter but also significantly reduce the resistance of a device to reduce generation of a heat. Further, the present invention can further improve dispersion of a heat using InP upon regrowth and thus improve the entire performance of the device.
Abstract:
본 발명은 화합물 반도체 제조 기술에 관한 것으로, 특히 개선된 전류 감금 구조를 가진 InAlGaAs계 수직 공진 표면광 레이저의 구조 및 제조방법에 관한 것이다. 본 발명은 전류 주입 직경이 감소함에 따라 저항이 급격히 증가하는 문제가 없고, 낮은 임계 전류를 실현할 수 있으며, InAlGaAs, InAlAs, InP로 구성된 1.3 ∼ 1.55 ㎛ 장파장용 수직 공진 표면광 레이저에서 적용할 수 있으며, 제작 공정이 간단하고 안정적이어서 실제 소자의 양산에 적용될 수 있음을 물론, 열 방출 효율을 증대시킬 수 있는 InAlGaAs계 수직 공진 표면광 레이저 및 그 제조방법을 제공하는데 그 목적이 있다. 본 발명은 하부 거울층을 포함하는 하부 구조와, 전류 감금층 및 그 상부에 제공되는 상부 거울층을 포함하는 레이저 기둥을 구비하는 InAlGaAs계 수직 공진 표면광 레이저에 있어서, 상기 하부 구조 최상부에 제1 InP층이 배치되며, 상기 레이저 기둥의 상기 상부 거울층 하부에 제2 InP층이 배치되며, 상기 제1 및 제2 InP층 사이에 배치되는 상기 전류 감금층의 직경이 상기 레이저 기둥의 직경보다 작게 제공되는 것을 특징으로 한다.
Abstract:
PURPOSE: An InAlGaAs VCSEL(Vertical Cavity Surface Emitting Laser) having an improved current confinement scheme is provided, which prevents a rapid increase of a resistance by a decrease of a current confinement diameter and has a low threshold current and can increase a heat release efficiency. CONSTITUTION: An InAlGaAS/InAlAs bottom reflective mirror layer(10) and an active medium and a cladding layer(11) and the first InP wet etching mask layer(12a) are stacked on an InP substrate, and an InAlGaAs/InAlAs current confinement layer(13) is arranged on a center of the upper part. An InP insulation layer(14) is arranged to surround the InAlGaAs/InAlAs current confinement layer on an upper part of the first InP wet etching mask layer. Also, the second InP wet etching mask layer(12b), an InAlGaAs/InAlAs top reflective mirror layer(15) and an electrode(16) are stacked. The top/bottom reflective mirror are distributed Bragg reflectors and are formed with InAlGaAs/InAlAs. The InP insulation layer or an air gap act as an insulation layer and a current pass diameter of a current injected through the electrode is decreased at the InAlGaAs/InAlAs current confinement layer. Also, when the current confinement layer is arranged on a laser active medium, a threshold current is reduced without carrier loss.
Abstract:
PURPOSE: A polarization reconfigurable surface emission laser device and a method for manufacturing the same are provided to control to oscillate two polarization vertical to each other without a change of a transverse mode property depending on an electrode injecting a current. CONSTITUTION: In a surface emission type of laser device, an under mirror layer(22) and an active layer(23) are applied subsequentially on a semiconductor substrate(21). An upper mirror layers(24,25) are formed on the active layer. The center part of the upper mirror layer has a circular shape and the peripheral part of the upper mirror layer is patterned into a criss-crossing shape. The under peripheral part of the upper mirror layer is isolated from the active layer by an isolation layer(27). The first, second, third and fourth electrodes(29a,29b,29c,29d) which are isolated to each other are formed on the criss-crossing shape of the peripheral part of the upper mirror layer.
Abstract:
PURPOSE: A device for photo activation is provided. CONSTITUTION: A device for photo activation comprises an upper unit(10) having a through hole, first and second helical units being formed at its inner circumferential surface; a temperature adjusting unit(30) having a through hole in its longitudinal direction, a helical unit to be connected to the second helical unit, and two protruding units having a temperature adjusting wire therebetween, the lower protruding unit having an insertion hole; an optical fiber receiving means(20) having an optical fiber receiving unit for receiving an optical fiber, being received in the through hole of the temperature adjusting unit(30), and being connected to the first helical unit; a spring pin unit(40) received in the insertion hole of the lower protruding unit; a connecting unit(50) having a plurality of second through holes; and a sample stay unit(60) having a helical unit on its outer circumferential surface to be connected to a first center through unit, and having a turn plate. As a result, the optical fiber and the solid sample can be directly bonded to each other, thereby efficiently achieving photo activation of semiconductor, super conductor, polymer and other solid materials.