公开(公告)号：DE102006012738A1

公开(公告)日：2007-09-20

申请号：DE102006012738

申请日：2006-03-17

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BRUNNBAUER MARKUS ,  FUERGUT EDWARD

IPC: H01L23/10 ,  H01L21/52

公开(公告)号：DE102004022884B4

公开(公告)日：2007-07-19

申请号：DE102004022884

申请日：2004-05-06

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FUERGUT EDWARD ,  WOERNER HOLGER ,  JEREBIC SIMON ,  BAUER MICHAEL

IPC: H01L23/50 ,  H01L21/48 ,  H01L21/52 ,  H01L21/60 ,  H01L23/04 ,  H01L23/538 ,  H01L25/065 ,  H01L25/10

公开(公告)号：DE10352946B4

公开(公告)日：2007-04-05

申请号：DE10352946

申请日：2003-11-11

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FUERGUT EDWARD ,  WOERNER HOLGER ,  VILSMEIER HERMANN

IPC: H01L23/50 ,  H01L21/56 ,  H01L21/60 ,  H01L21/68 ,  H01L21/98 ,  H01L23/498 ,  H01L25/065

Abstract: The invention relates to a semiconductor device with a semiconductor chip and a rewiring layer, the semiconductor chip being embedded in a housing plastics composition by its rear side contact. The active top side of the semiconductor chip forms a coplanar overall top side with the top side of the housing plastics composition. The rear side contact is led to the overall top side via a flat conductor sheet tape, so that the rear side contact of the semiconductor chip can be accessed from the overall top side.

公开(公告)号：DE102005030465A1

公开(公告)日：2007-01-04

申请号：DE102005030465

申请日：2005-06-28

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BRUNNBAUER MARKUS ,  FUERGUT EDWARD

IPC: H01L23/50 ,  H01L21/50 ,  H01L23/34 ,  H01L23/498 ,  H01L25/065

Abstract: The stack has semiconductor components (5) stacked on top of each other with a laminar wiring structure (6) on a coplanar surface on an upper side of a plastic compound and on an active upper side of a semiconductor chip (4). The structure has component conductor paths (11) extending from contact areas of the active side until their freely lying ends (13) are provided on individual stack edges (14). A stack lower surface has a stack wiring structure (16) with external contact surfaces (17) that are arranged on the ends and/or in electrical connection with the ends by stack conductor paths. Independent claims are also included for: (a) a first method for manufacturing a semiconductor stack with a semiconductor chip (b) a second method for manufacturing a semiconductor stack with a semiconductor chip.

公开(公告)号：DE102005028704A1

公开(公告)日：2006-12-28

申请号：DE102005028704

申请日：2005-06-20

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BEMMERL THOMAS ,  BAUER MICHAEL ,  FUERGUT EDWARD

IPC: H01L23/29 ,  B81B7/00 ,  B81C99/00 ,  B82B3/00 ,  H01L23/16 ,  H01L23/495

Abstract: The device (1) has semiconductor device components (3) embedded in a plastic composition (2). A surface of one or more of the semiconductor device components has an adhesion promoter layer (5) with microporous morphology partially between the semiconductor device components and plastic composition. The adhesion promoter layer has an average thickness of between 5 and 300 nanometers, and has nanoscale ceramic grains applied by wet chemical process. Independent claims are included for the following: (1) System carrier; (2) System carrier fabrication method; and (3) Semiconductor device manufacture.

公开(公告)号：DE102005057400A1

公开(公告)日：2006-12-14

申请号：DE102005057400

申请日：2005-11-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FUERGUT EDWARD

IPC: H01L21/50

Abstract: The method involves providing a semiconductor chip with flip chip contacts (5) on its active upper side. The flip chip contacts are arranged on contact connection surfaces of a wiring structure that is provided on an upper side of a circuit carrier. A gap between the upper side of the chip and the upper side of the carrier is filled with a plastic mass (3), where edge sides (12, 13) and a back side of the chip are embedded in the gap.

公开(公告)号：DE102005014427A1

公开(公告)日：2006-09-28

申请号：DE102005014427

申请日：2005-03-24

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WOERNER HOLGER ,  FUERGUT EDWARD

IPC: H01L21/56 ,  B29C45/14 ,  H03H9/25

Abstract: Semiconductor component consists of chip(s) (5) on substrate (4) and encapsulation starts with fitting elastic cover (11) onto chip. Chip on substrate is then located into moulding tool (15) with lower (14) and top tool part (2).Moulding tool is then closed to completely contact elastic cover with its top inner surface. Then semiconductor component is cast in injection moulding mass. Preferably, chip is fastened on substrate, e.g. by gluing. Independent claims are included for semiconductor component.

公开(公告)号：DE102005007486A1

公开(公告)日：2006-08-31

申请号：DE102005007486

申请日：2005-02-17

Applicant: INFINEON TECHNOLOGIES AG

Inventor： JEREBIC SIMON ,  BAUER MICHAEL ,  FUERGUT EDWARD ,  VILSMEIER HERMANN

IPC: H01L23/488 ,  H01L21/48 ,  H05K13/04

Abstract: A semiconductor component including a surface-mount housing and a method for producing the same are described herein. The semiconductor component includes lead pieces embedded into a plastic housing composition and arranged on an underside of the housing. External contact areas of the lead pieces are free of the plastic housing composition. A structured solderable coating is arranged on the external contact areas that have been kept free of the plastic housing composition, the coating includes a plurality of electrically conductive and mechanically elastic contact elements.

公开(公告)号：DE102004020497B8

公开(公告)日：2006-06-14

申请号：DE102004020497

申请日：2004-04-26

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FUERGUT EDWARD ,  WOERNER HOLGER ,  JEREBIC SIMON ,  BAUER MICHAEL

IPC: H01L21/50 ,  H01L21/48 ,  H01L21/60 ,  H01L23/00 ,  H01L23/498 ,  H01L23/538 ,  H05K1/03 ,  H05K3/00 ,  H05K3/40 ,  H05K3/42

公开(公告)号：DE102004046227B3

公开(公告)日：2006-04-20

申请号：DE102004046227

申请日：2004-09-22

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FUERGUT EDWARD ,  VILSMEIER HERMANN ,  JEREBIC SIMON ,  BAUER MICHAEL ,  BEMMERL THOMAS ,  THEUSS HORST ,  STUEMPFL CHRISTIAN

IPC: H01L21/60 ,  H01L21/48 ,  H01L23/50