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    6.
    发明专利
    未知

    公开(公告)号：DE102005023949A1

    公开(公告)日：2006-11-30

    申请号：DE102005023949

    申请日：2005-05-20

    Applicant: INFINEON TECHNOLOGIES AG

    Inventor： FUERGUT EDWARD ,  VILSMEIER HERMANN ,  JEREBIC SIMON ,  BAUER MICHAEL ,  BEMMERL THOMAS

    IPC: H01L23/04 ,  H01L21/60 ,  H01L23/50

    Abstract: The invention relates to a panel and a semiconductor device including a composite plate with semiconductor chips and a plastic packaging compound, and to processes for producing them. For this purpose, the panel having a composite plate has semiconductor chips arranged in rows and columns on a top side of a wiring substrate. The wiring substrate is covered by a plastic packaging compound in a plurality of semiconductor device positions, the rear sides of the semiconductor chips being fixed on the wiring substrate. A plastic packaging compound in the region of the boundary surfaces with the semiconductor chips has a coefficient of thermal expansion which is matched to that of silicon, while the remaining plastic packaging compound has a coefficient of thermal expansion which is matched to that of the wiring substrate and is therefore correspondingly higher.

    7.
    发明专利
    未知

    公开(公告)号：DE102004036909A1

    公开(公告)日：2006-03-23

    申请号：DE102004036909

    申请日：2004-07-29

    Applicant: INFINEON TECHNOLOGIES AG

    Inventor： POHL JENS ,  WOERNER HOLGER ,  STEINER RAINER ,  VILSMEIER HERMANN ,  BAUER MICHAEL ,  ZUHR BERNHARD ,  BACHMAIER ULRICH ,  HAGEN ROBERT

    IPC: H01L23/50 ,  H01L21/50 ,  H01L21/60 ,  H01L25/065

    Abstract: A semiconductor stack and a semiconductor base device with a wiring substrate and an intermediate wiring board for a semiconductor device stack is disclosed. In one embodiment, a semiconductor chip is arranged between the intermediate wiring board and the wiring substrate, which is electrically connected by way of the wiring substrate on the one hand to external contacts on the underside of the wiring substrate and on the other hand to contact terminal areas in the edge regions of the wiring substrate. The intermediate wiring board has angled-away external flat conductors, which are electrically connected in the contact terminal areas of the wiring board. Furthermore, on the upper side of the intermediate wiring board, arranged on the free ends of the internal flat conductors are external contact terminal areas, which correspond in size and arrangement to external contacts of a semiconductor device to be stacked.

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